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MF1S7001XDUD/V1V

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P37
MF1S70YYX_V1
MIFARE Classic EV1 4K - Mainstream contactless smart card
IC for fast and easy solution development
Rev. 3.2 — 23 November 2017 Product data sheet
279332 COMPANY PUBLIC
1 General description
NXP Semiconductors has developed the MIFARE Classic MF1S70yyX/V1 to be used in
a contactless smart card according to ISO/IEC 14443 Type A.
The MIFARE Classic EV1 4K MF1S70yyX/V1 IC is used in applications like public
transport ticketing and can also be used for various other applications.
1.1 Anticollision
An intelligent anticollision function allows to operate more than one card in the field
simultaneously. The anticollision algorithm selects each card individually and ensures
that the execution of a transaction with a selected card is performed correctly without
interference from another card in the field.
001aam199
MIFARE
CARD PCD
energy
data
Figure 1. Contactless MIFARE system
1.2 Simple integration and user convenience
The MF1S70yyX/V1 is designed for simple integration and user convenience which
allows complete ticketing transactions to be handled in less than 100 ms.
1.3 Security and privacy
• Manufacturer programmed 7-byte UID or 4-byte NUID identifier for each device
• Random ID support
• Mutual three pass authentication (ISO/IEC DIS 9798-2)
• Individual set of two keys per sector to support multi-application with key hierarchy
1.4 Delivery options
• 7-byte UID, 4-byte NUID
• Bumped die on sawn wafer
• MOA4 and MOA8 contactless module
NXP Semiconductors
MF1S70YYX_V1
MIFARE Classic EV1 4K - Mainstream contactless smart card IC for fast and easy solution development
MF1S70yyX_V1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved.
Product data sheet Rev. 3.2 — 23 November 2017
COMPANY PUBLIC 279332 2 / 37
2 Features and benefits
• Contactless transmission of data and energy
supply
• Operating distance up to 100 mm
depending on antenna geometry and reader
configuration
• Operating frequency of 13.56 MHz • Data transfer of 106 kbit/s
• Data integrity of 16-bit CRC, parity, bit coding,
bit counting
• Anticollision
• Typical ticketing transaction time of < 100 ms
(including backup management)
• 7 Byte UID or 4 Byte NUID
• Random ID support (7 Byte UID version)
2.1 EEPROM
• 4 kB, organized in 32 sectors of 4 blocks and
8 sectors of 16 blocks (one block consists of
16 byte)
• User definable access conditions for each
memory block
• Data retention time of 10 years • Write endurance 200000 cycles
3 Applications
• Public transportation • Access management
• Electronic toll collection • Car parking
• School and campus cards • Employee cards
• Internet cafés • Loyalty
4 Quick reference data
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
C
i
input capacitance
[1]
14.9 16.9 19.0 pF
f
i
input frequency - 13.56 - MHz
EEPROM characteristics
t
ret
retention time T
amb
= 22 °C 10 - - year
N
endu(W)
write endurance T
amb
= 22 °C 100000 200000 - cycle
[1] T
amb
=22°C, f=13,56Mhz, V
LaLb
= 1,5 V RMS
NXP Semiconductors
MF1S70YYX_V1
MIFARE Classic EV1 4K - Mainstream contactless smart card IC for fast and easy solution development
MF1S70yyX_V1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved.
Product data sheet Rev. 3.2 — 23 November 2017
COMPANY PUBLIC 279332 3 / 37
5 Ordering information
Table 2. Ordering information
PackageType number
Name Description Version
MF1S7001XDUD/V1 FFC Bump 8 inch wafer, 120 μm thickness, on film frame carrier, electronic fail die
marking according to SECS-II format), Au bumps, 7-byte UID
-
MF1S7001XDUD2/V1 FFC Bump 12 inch wafer, 120 μm thickness, on film frame carrier, electronic fail die
marking according to SECS-II format), Au bumps, 7-byte UID
-
MF1S7001XDUF/V1 FFC Bump 8 inch wafer, 75 μm thickness, on film frame carrier, electronic fail die
marking according to SECS-II format), Au bumps, 7-byte UID
-
MF1S7000XDA4/V1 MOA4 plastic leadless module carrier package; 35 mm wide tape, 7-byte UID SOT500-2
MF1S7000XDA8/V1 MOA8 plastic leadless module carrier package; 35 mm wide tape, 7-byte UID SOT500-4
MF1S7031XDUD/V1 FFC Bump 8 inch wafer, 120 μm thickness, on film frame carrier, electronic fail die
marking according to SECS-II format), Au bumps, 4-byte non-unique ID
-
MF1S7031XDUD2/V1 FFC Bump 12 inch wafer, 120 μm thickness, on film frame carrier, electronic fail die
marking according to SECS-II format), Au bumps, 4-byte non-unique ID
-
MF1S7031XDUF/V1 FFC Bump 8 inch wafer, 75 μm thickness, on film frame carrier, electronic fail die
marking according to SECS-II format), Au bumps, 4-byte non-unique ID
-
MF1S7030XDA4/V1 MOA4 plastic leadless module carrier package; 35 mm wide tape,
4-byte non-unique ID
SOT500-2
MF1S7030XDA8/V1 MOA8 plastic leadless module carrier package; 35 mm wide tape,
4-byte non-unique ID
SOT500-4
6 Block diagram
001aan006
RF
INTERFACE
UART
ISO/IEC 14443
TYPE A
LOGIC UNIT
RNG
CRC
EEPROM
CRYPTO1
POWER ON
RESET
VOLTAGE
REGULATOR
CLOCK
INPUT FILTER
RESET
GENERATOR
Figure 2. Block diagram of MF1S70yyX/V1
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P37

MF1S7001XDUD/V1V

Mfr. #:
Buy MF1S7001XDUD/V1V
Manufacturer:
NXP Semiconductors
Description:
RFID Transponders MF1S7001XDUD/UNCASED//V1/WAFER SAWN FFC NDP NO MAR
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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