NCV7510
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4
PACKAGE PIN DESCRIPTIONS
PACKAGE PIN# PIN SYMBOL FUNCTION
1 ENA Logic input for Enable.
2 CONTROL Logic input for PWM cycle control.
3 PCLK Logic input for clock or logic level control of Dwell timer.
4 CSB Logic input for active low chip select.
5 SCLK SPI clock input.
6 SI SPI serial data input.
7 SO SPI serial data output.
8 LOOP Control loop state output.
9 FAULT Open-drain fault output.
10 OCP Overcurrent program input.
11 V
DD
Logic supply voltage input; CLAMP predriver voltage.
12 DGND Supply return; device substrate.
13 SNS- Current sense negative input.
14 SNS+ Current sense positive input.
15 PGND High current supply return; CLAMP antisaturation reference node.
16 CLAMP Clamp MOSFET gate drive output.
17 SRC HS and CLAMP MOSFET antisaturation diagnostic input.
18 GATE HS MOSFET gate drive output.
19 DRN HS MOSFET drain antisaturation / overvoltage diagnostic input.
20 V
B
Bootstrapped GATE predriver voltage.
DRN
GATE
SRC
CLAMP
PGND
SNS+
SNS-
DGND
CONTROL
SCLK
SO
LOOP
FAULT
SI
OCP
120
ENA
PCLK
CSB
V
B
V
DD
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PIN FUNCTION DESCRIPTIONS
ENA: CMOS input with hysteresis logically ANDed with
the CONTROL input to command the predriver outputs.
This input has an active pulldown current source.
CONTROL: CMOS input with hysteresis logically ANDed
with the ENA input to command the predriver outputs. This
input has an active pulldown current source.
PCLK: Buffered CMOS input with hysteresis. This input
controls which DAC register pair is selected for load current
comparison. The input is programmed via Auxiliary register
($01) bit D
3
to respond to a clock signal (AUX D
3
=0 default
at POR) or a logic level (AUX D
3
=1.) The pin presents a
12 pF maximum load to the controller.
CSB: CMOS input with hysteresis. This input is the
active-low chip select input that enables serial data transfer
between the host controller and the device. This input has an
active pullup current source.
SCLK: Buffered CMOS input with hysteresis. This input
is the synchronizing clock input for serial data transfer
between the micro controller and the device. The pin
presents a 12 pF maximum load to the controller.
SI: Buffered CMOS input with hysteresis. This pin is the
data input to the device's SPI shift register. Serial data
received at this input is transferred from the host controller
to the shift register under the control of the CSB and SCLK
inputs. The pin presents a 12 pF maximum load to the
controller. This input has an active pulldown current source.
SO: The CMOS compatible line driver at this pin is the data
output from the device's SPI shift register. Serial data
transmitted at this output is transferred from the shift register
to the host controller under the control of the CSB and SCLK
inputs. The pin is capable of driving 200 pF at 4 MHz and
is HI-Z when the CSB input is high.
LOOP: The CMOS compatible driver at this pin reflects the
state of the control loop. A logic low indicates that load
current is less than the programmed DAC reference.
FAULT: An open-drain low voltage NMOS output at this
pin provides immediate fault indication to a connected host
controller. An external resistor is normally connected
between this pin and V
DD
.
DGND: Device substrate voltage and V
DD
return path for
mixed signal functions. This pin is the circuit common
reference point.
OCP: This analog comparator input supplies a reference
voltage to the device's overcurrent fault detection. When the
voltage at this pin is less than 4.5 V, the applied voltage is the
overcurrent reference voltage. When the voltage is greater
than 4.5 V, an internal 3.0 V overcurrent reference is used.
The voltage at this pin must not exceed V
DD
. Applying
approximately V
DD
+ 1.4 V will place the NCV7510 in test
mode and suspend normal operation. The user is advised to
avoid activating the test mode.
V
DD
: +5.0 Vpower supply input. The voltage at this pin
initiates power-on reset, supplies power to internal
mixed-signal functions and supplies gate charge to the
external CLAMP MOSFET. A low ESR external bulk
capacitor connected between V
DD
and PGND is
recommended to supply transient gate charge. Several
internal reference voltages are derived from V
DD
.
SNS-: The inverting input to the analog current sense
amplifier. This input should be Kelvin connected directly to
the external current sense resistor's negative terminal.
SNS+: The noninverting input to the analog current sense
amplifier. This input should be Kelvin connected directly to
the external current sense resistor's positive terminal.
PGND: Return path for the GATE and CLAMP predriver
transient currents and the lower input to the CLAMP
antisaturation detection comparator. This pin should be
star-connected to the CLAMP MOSFET's source and the
external V
DD
bulk charge capacitor's negative terminal.
CLAMP: External CLAMP MOSFET predrive output.
This output switches the CLAMP MOSFET's gate between
V
DD
and PGND.
SRC: Lower input to the GATE antisaturation detection
comparator and upper input to the CLAMP antisaturation
detector.
GATE: External HS MOSFET predrive output. This output
switches the HS MOSFET's gate between V
B
and PGND.
DRN: Upper input to the GATE antisaturation detection
comparator, overvoltage detection input, and powerup
interlock input. This pin should be connected directly to the
HS MOSFET's drain terminal.
VB: Bootstrap or boost input voltage. This input supplies
gate charge to the external HS MOSFET.
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MAXIMUM RATINGS (Voltages are with respect to device substrate.)
Rating Symbol Value Unit
DC Supply Voltage (Note 1)
VDRN -0.3 to 45 V
V
DD
-0.3 to 7.0 V
VDRN Peak Transient Voltage (Note 2) VDRN
(PK)
45 V
VB Pin Voltage V
B
-2.0 to 50 V
GATE Pin Voltage V
GATE
-2.0 to 50 V
VB to GATE Differential Voltage V
B
- V
GATE
50 V
SRC Pin Voltage V
SRC
-2.0 to 45 V
Logic Level Input/Output Voltage
(SO, SI, SCLK, CSB, ENA, CONTROL, PCLK, FAULT, LOOP)
V
I/O
-0.3 to 7.0 V
Sense Amplifier Input Voltage
V
SNS+
-0.3 to 45 V
V
SNS-
-0.3 to 7.0 V
Overcurrent Comparator Input Voltage V
OCP
-0.3 to 7.0 V
Junction Temperature Tj 150 °C
Storage Temperature Range T
stg
-65 to 150 °C
Peak Reflow Soldering Temperature: Lead-free (60 to 150 seconds at 217 °C) (Note 3) 265 peak °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Reverse VDRN protection must be included in the application circuit.
2. VDRN transient voltage suppression must be included in the application circuit.
3. For additional information, see or download ON Semiconductor's Soldering and Mounting Techniques Reference Manual, SOLDERRM/D,
and Application Note AND8003/D.
ATTRIBUTES
Characteristic Value Unit
ESD Capability (All Pins)
Human Body Model
Charged Device Model
> 3.0
> 1.0
kV
kV
Moisture Sensitivity (Note 3) MSL 1
Package Thermal Resistance
Junction–to–Ambient, R
qJA
Junction–to–Case, R
qJC
55
9.0
°C/W
°C/W

NCV7510DWR2G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Gate Drivers OSPI PRE-DRIVER
Lifecycle:
New from this manufacturer.
Delivery:
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