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HMC329ALC3B

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P23
24 GHz to 32 GHz, GaAs, MMIC,
Double Balanced Mixer
Data Sheet
HMC329ALC3B
Rev. 0 Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2018 Analog Devices, Inc. All rights reserved.
Technical Support www.analog.com
FEATURES
Conversion loss (downconverter): 11 dB typical
LO to RF isolation: 36.5 dB typical for 24 GHz to 30 GHz
performance
Input IP3 (downconverter): 20 dBm typical
12-terminal, RoHS compliant, 3 mm × 3 mm LCC package
APPLICATIONS
Microwave and very small aperture terminal (VSAT) radios
Test equipment
Military electronic warfare (EW)
Electronic countermeasure (ECM)
Command, control, communications, and intelligence (C3I)
FUNCTIONAL BLOCK DIAGRAM
1
GND
7
GND
8
RF
9
GND
10
NIC
11
NIC
12
NIC
4
GND
2
LO
3
GND
5
IF
6
GND
PACKAGE
BASE
GND
HMC329ALC3B
16676-001
Figure 1.
GENERAL DESCRIPTION
The HMC329ALC3B is a general-purpose, double balanced
mixer in a leadless, RoHS compliant, surface-mount technology
(SMT) package that can be used as an upconverter or down-
converter between 24 GHz and 32 GHz. This mixer is fabricated
in a gallium arsenide (GaAs), monolithic microwave integrated
circuit (MMIC) process and requires no external components
or matching circuitry. The HMC329ALC3B provides excellent local
oscillator (LO) to radio frequency (RF) and LO to intermediate
frequency (IF) suppression due to optimized balun preliminary
structures. The mixer operates with LO amplitude above 9 dBm.
The RoHS compliant HMC329ALC3B eliminates the need for
wire bonding, allowing the use of surface-mount manufacturing
techniques.
HMC329ALC3B Data Sheet
Rev. 0 | Page 2 of 23
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Absolute Maximum Ratings ............................................................ 4
Thermal Resistance ...................................................................... 4
ESD Caution .................................................................................. 4
Pin Configuration and Function Descriptions ............................. 5
Interface Schematics..................................................................... 5
Typical Performance Characteristics ............................................. 6
Downconverter Performance, IF = 1000 MHz..........................6
Downconverter Performance, IF = 8000 MHz....................... 10
Upconverter Performance, IF = 1000 MHz ............................ 12
Upconverter Performance, IF = 8000 MHz ............................ 14
IF Bandwidth—Downconverter ............................................... 18
Spurious and Harmonics Performance ................................... 20
Theory of Operation ...................................................................... 21
Applications Information .............................................................. 22
Typical Application Circuit ....................................................... 22
Evaluation PCB Information .................................................... 22
Outline Dimensions ....................................................................... 23
Ordering Guide .......................................................................... 23
REVISION HISTORY
5/2018—Revision 0: Initial Versi on
Data Sheet HMC329ALC3B
Rev. 0 | Page 3 of 23
SPECIFICATIONS
T
A
= 25°C, IF = 1000 MHz, LO = 13 dBm for the upper sideband, unless otherwise noted. All measurements performed as a downconverter,
unless otherwise noted, on the evaluation printed circuit board (PCB).
Table 1.
Parameter Symbol Min Typ Max Unit
FREQUENCY RANGE
RF Pin 24 32 GHz
IF Pin DC 8 GHz
LO Pin 24 32 GHz
LO AMPLITUDE 9 13 15 dBm
24 GHz to 32 GHz Performance
Downconverter
Conversion Loss 11 13.5 dB
Single Sideband Noise Figure SSB NF 12 dB
Input Third-Order Intercept IP3 15.5 20 dBm
Input 1 dB Compression Point P1dB 12 dBm
Input Second-Order Intercept IP2 42 dBm
Upconverter IF
IN
Conversion Loss 10.5 dB
Input Third-Order Intercept IP3 15.3 dBm
Input 1 dB Compression Point P1dB 4.5 dBm
ISOLATION
24 GHz to 30 GHz Performance
LO to IF 28 35.5 dB
RF to IF 20 31.5 dB
LO to RF 32 36.5 dB
30 GHz to 32 GHz Performance
LO to IF 22 30 dB
RF to IF 10.5 24.4 dB
LO to RF 22.5 30.5 dB
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HMC329ALC3B

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Manufacturer:
Analog Devices / Hittite
Description:
RF Mixer GaAsMMIC Fundamental
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