HMC329ALC3B Data Sheet
Rev. 0 | Page 22 of 23
APPLICATIONS INFORMATION
TYPICAL APPLICATION CIRCUIT
Figure 73 shows the typical application circuit for the
HMC329ALC3B. The HMC329ALC3B is a passive device
and does not require any external components. The LO and RF
pins are internally ac-coupled. The IF pin is internally dc-coupled.
For applications not requiring operation to dc, dc block this
port externally using a series capacitor of a value chosen to pass
the necessary IF frequency range. When IF operation to dc is
required, do not exceed the IF source and sink current rating
specified in the Absolute Maximum Ratings section.
GND
GND
RF
GND
NIC
NIC
NIC
GND
LO
LO RF
IF
GND
IF
GND
HMC329ALC3B
1
7
8
9
101112
4
2
3
5 6
16676-076
Figure 73. Typical Application Circuit
EVALUATION PCB INFORMATION
Use RF circuit design techniques for the circuit board used in
the application. Ensure that signal lines have 50 Ω impedance
and connect the package ground leads and the exposed pad
directly to the ground plane (see Figure 74). Use a sufficient
number of via holes to connect the top and bottom ground
planes. The evaluation circuit board shown in Figure 74 is
available from Analog Devices, Inc., upon request.
Table 7. List of Materials for Evaluation PCB
EV1HMC329ALC3B
Item Description
J1, J2 PCB mount, SRI, 2.92 mm connectors
J3 PCB mount, Johnson Components SMA connector
U1 HMC329ALC3B
PCB
1
117611-1 evaluation board on
Rogers Corporation RO4350B laminates
1
117611-1 is the raw bare PCB identifier. Reference EV1HMC329ALC3B when
ordering complete evaluation PCB.
J1
J3
IF
LO RF
117611–1
U1
J2
329
A
16676-077
Figure 74. Evaluation PCB Top Layer
