NCV7683
www.onsemi.com
22
PACKAGE DIMENSIONS
CASE 940AP
ISSUE O
DIM MIN MAX
MILLIMETERS
A 1.75
A1 0.00 0.10
L 0.40 0.85
e 0.65 BSC
c 0.09 0.20
h 0.25 0.50
b 0.19 0.30
L2 0.25 BSC
M 0 8
__
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
BE 0.10 MAX. AT MMC. DAMBAR CANNOT BE
LOCATED ON THE LOWER RADIUS OF THE
FOOT. DIMENSION b APPLIES TO THE FLAT
SECTION OF THE LEAD BETWEEN 0.10 TO 0.25
FROM THE LEAD TIP.
4. DIMENSION D DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH, PROTRUSIONS OR GATE BURRS SHALL
NOT EXCEED 0.15 PER SIDE. DIMENSION D IS
DETERMINED AT DATUM PLANE H.
5. DIMENSION E1 DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH
OR PROTRUSION SHALL NOT EXCEED 0.25 PER
SIDE. DIMENSION E1 IS DETERMINED AT DA-
TUM PLANE H.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
7. A1 IS DEFINED AS THE VERTICAL DISTANCE
FROM THE SEATING PLANE TO THE LOWEST
POINT ON THE PACKAGE BODY.
8. CONTOURS OF THE THERMAL PAD ARE UN-
CONTROLLED WITHIN THE REGION DEFINED
BY DIMENSIONS D2 AND E2.
PIN 1
REFERENCE
0.10
SEATING
PLANE
24X
b
e
DETAIL A
---
L
L2
GAUGE
DETAIL A
E1 3.90 BSC
PLANE
SEATING
PLANE
C
c
h
END VIEW
A-B
M
0.12 DC
TOP VIEW
SIDE VIEW
A-B0.20
C
112
24
A
B
D
2X 12 TIPS
A1
A2
C
C
24X
D 8.64 BSC
E 6.00 BSC
2X
A
M
13
0.20 C
0.20 C
2X
0.10 C
A2 1.651.10
EE1
D
NOTE 5
NOTE 6
NOTE 6
NOTE 4
A-B
M
0.15 DC
BOTTOM VIEW
E2
NOTE 8
D2
NOTE 8
A-B
M
0.15 DC
D2 2.37 2.67
E2 1.79 1.99
L1 1.00 REF
H
A1
NOTE 7
L1
h
SOLDERING FOOTPRINT
24X
1.15
24X
0.40
0.65
PITCH
6.40
1
RECOMMENDED
2.19
2.72
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