Data Sheet ADF4157
Rev. D | Page 21 of 24
OUTLINE DIMENSIONS
16
9
81
PIN 1
SEATING
PLANE
8°
0°
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 24. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
0.50
BSC
0.65
0.60
0.55
0.30
0.25
0.18
COMPLIANT
TO
JEDEC STANDARDS MO-220-WGGD-1.
BOTTOM VIEWTOP VIEW
EXPOSED
PAD
PIN 1
INDICATOR
4.10
4.00 SQ
3.90
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.20 REF
0.20 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
2.30
2.10 SQ
2.00
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
1
20
6
10
11
15
16
5
08-16-2010-B
Figure 25. 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4mm × 4 mm Body, Very Very Thin Quad
(CP-20-6)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Description Temperature Range Package Option
ADF4157BRUZ 16-Lead Thin Shrink Small Outline Package [TSSOP] −40°C to +85°C RU-16
ADF4157BRUZ-RL 16-Lead Thin Shrink Small Outline Package [TSSOP] −40°C to +85°C RU-16
ADF4157BRUZ-RL7 16-Lead Thin Shrink Small Outline Package [TSSOP] −40°C to +85°C RU-16
ADF4157BCPZ 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ] −40°C to +85°C CP-20-6
ADF4157BCPZ-RL 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ] −40°C to +85°C CP-20-6
ADF4157BCPZ-RL7 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ] −40°C to +85°C CP-20-6
EV-ADF4157SD1Z Evaluation Board
1
Z = RoHS Compliant Part.
