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TSL2581FN

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P32
TSL2581, TSL2583
LIGHT-TO-DIGITAL CONVERTER
TAOS134 − MARCH 2011
25
The LUMENOLOGY r Company
r
r
Copyright E 2011, TAOS Inc.
www.taosinc.com
APPLICATION INFORMATION: HARDWARE
PCB Pad Layouts
Suggested PCB pad layout guidelines for the CS chipscale package are shown in Figure 7.
0.50
6 0.21
0.50
0.50
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
Figure 7. Suggested CS Package PCB Layout
Suggested PCB pad layout guidelines for the Dual Flat No-Lead (FN) surface mount package are shown in
Figure 8.
0.40
2.3
0.40
0.9
1.70
0.65
0.9
0.65
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
Figure 8. Suggested FN Package PCB Layout
TSL2581, TSL2583
LIGHT-TO-DIGITAL CONVERTER
TAOS134 − MARCH 2011
26
r
r
Copyright E 2011, TAOS Inc.
The LUMENOLOGY r Company
www.taosinc.com
MECHANICAL DATA
PACKAGE CS Six-Lead Chipscale
1750
500
BSC
1250
6 100
415 20
710 45
500
BSC
500
BSC
375 30
375 30
TOP VIEW
BOTTOM VIEW
END VIEW
6 210 30
PIN OUT
Lead Free
Pb
466
10
466
10
PHOTODIODE ARRAY
BOTTOM VIEW
SDA 6
INT 5
SCL 4
1 V
DD
2 ADDR SEL
3 GND
8 Nominal
C
L
of Solder Contacts
C
L
of Photodiode
Array Area
C
L
of Solder Contacts
of Photodiode Array Area
C
L
139 Nominal
PIN 1
PIN 1
NOTES: A. All linear dimensions are in micrometers. Dimension tolerance is ± 25 μm unless otherwise noted.
B. Solder bumps are formed of Sn (96.5%), Ag (3%), and Cu (0.5%).
C. The layer above the photodiode is glass and epoxy with an index of refraction of 1.53.
D. This drawing is subject to change without notice.
Figure 9. Package CS — Six-Lead Chipscale Packaging Configuration
TSL2581, TSL2583
LIGHT-TO-DIGITAL CONVERTER
TAOS134 − MARCH 2011
27
The LUMENOLOGY r Company
r
r
Copyright E 2011, TAOS Inc.
www.taosinc.com
MECHANICAL DATA
PACKAGE FN Dual Flat No-Lead
203 8
466
10
650
BSC
650 50
6 SDA
5 INT
4 SCL
V
dd
1
ADDR SEL 2
GND 3
TOP VIEW
SIDE VIEW
BOTTOM VIEW
Lead Fre
e
Pb
300
50
2000
75
2000 75
PIN 1
PIN 1
END VIEW
PIN OUT
TOP VIEW
Photo-Active Area
750 150
295
Nominal
466 10
C
L
of Solder Contacts
Photodiode Array Area (Note B)
C
L
140 Nominal
20 Nominal
C
L
of Solder Contacts
of Photodiode Array Area
(Note B)
C
L
NOTES: A. All linear dimensions are in micrometers. Dimension tolerance is ± 20 μm unless otherwise noted.
B. The die is centered within the package within a tolerance of ± 75 μm.
C. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
D. Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish.
E. This package contains no lead (Pb).
F. This drawing is subject to change without notice.
Figure 10. Package FN — Dual Flat No-Lead Packaging Configuration
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P32

TSL2581FN

Mfr. #:
Buy TSL2581FN
Manufacturer:
ams
Description:
Light to Digital Converters Light to Digital 30x Sensitivity
Lifecycle:
New from this manufacturer.
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