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TSL2581FN

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P32
TSL2581, TSL2583
LIGHT-TO-DIGITAL CONVERTER
TAOS134 − MARCH 2011
28
r
r
Copyright E 2011, TAOS Inc.
The LUMENOLOGY r Company
www.taosinc.com
MECHANICAL DATA
TOP VIEW
DETAIL B
DETAIL A
1.35 0.05
A
o
1.85 0.05
B
o
0.97 0.05
K
o
0.250
0.02
5 Max 5 Max
4.00
8.00
3.50 0.05
1.50
4.00
2.00 0.05
+ 0.30
− 0.10
1.75
B
B
AA
0.60
0.05
NOTES: A. All linear dimensions are in millimeters. Dimension tolerance is ± 0.10 mm unless otherwise noted.
B. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
C. Symbols on drawing A
o
, B
o
, and K
o
are defined in ANSI EIA Standard 481−B 2001.
D. Each reel is 178 millimeters in diameter and contains 3500 parts.
E. TAOS packaging tape and reel conform to the requirements of EIA Standard 481−B.
F. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape.
G. This drawing is subject to change without notice.
Figure 11. Package CS Carrier Tape
TSL2581, TSL2583
LIGHT-TO-DIGITAL CONVERTER
TAOS134 − MARCH 2011
29
The LUMENOLOGY r Company
r
r
Copyright E 2011, TAOS Inc.
www.taosinc.com
MECHANICAL DATA
TOP VIEW
DETAIL A
2.18 0.05
A
o
0.254
0.02
5 Max
4.00
8.00
3.50 0.05
1.50
4.00
2.00 0.05
+ 0.30
− 0.10
1.75
B
B
AA
1.00
0.25
DETAIL B
2.18 0.05
B
o
5 Max
0.83 0.05
K
o
NOTES: A. All linear dimensions are in millimeters. Dimension tolerance is ± 0.10 mm unless otherwise noted.
B. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
C. Symbols on drawing A
o
, B
o
, and K
o
are defined in ANSI EIA Standard 481−B 2001.
D. Each reel is 178 millimeters in diameter and contains 3500 parts.
E. TAOS packaging tape and reel conform to the requirements of EIA Standard 481−B.
F. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape.
G. This drawing is subject to change without notice.
Figure 12. Package FN Carrier Tape
TSL2581, TSL2583
LIGHT-TO-DIGITAL CONVERTER
TAOS134 − MARCH 2011
30
r
r
Copyright E 2011, TAOS Inc.
The LUMENOLOGY r Company
www.taosinc.com
MANUFACTURING INFORMATION
The package has been tested and have demonstrated an ability to be reflow soldered to a PCB substrate.
The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The components should
be limited to a maximum of three passes through this solder reflow profile.
Table 15. Solder Reflow Profile
PARAMETER REFERENCE DEVICE
Average temperature gradient in preheating 2.5°C/sec
Soak time t
soak
2 to 3 minutes
Time above 217°C (T1) t
1
Max 60 sec
Time above 230°C (T2) t
2
Max 50 sec
Time above T
peak
−10°C (T3) t
3
Max 10 sec
Peak temperature in reflow T
peak
260° C (−0°C/+5°C)
Temperature gradient in cooling Max −5°C/sec
t
3
t
2
t
1
t
soak
T
3
T
2
T
1
T
peak
Not to scale — for reference only
Time (sec)
Temperature (C)
Figure 13. Solder Reflow Profile Graph
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P32

TSL2581FN

Mfr. #:
Buy TSL2581FN
Manufacturer:
ams
Description:
Light to Digital Converters Light to Digital 30x Sensitivity
Lifecycle:
New from this manufacturer.
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