NCP81239, NCP81239A
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13
Table 8. INTERNAL PEAK CURRENT LIMIT
CLIP_1 CLIP_0 CLIM delta Value (mV) CSP1CSN1 (mV)
Current at RSENSE = 5 mW (A)
0 0 380 38 (Default) 7.6
0 1 230 23 4.6
1 0 110 11 2.2
1 1 700 70 14
Negative Current Limit Internal Path
Negative current limit can be activated in a few instances,
including light load synchronous operation, heavy load to
light load transition, output overvoltage, and high output
voltage to lower output voltage transitions. CSP2/CSN2 will
be the negative current limit sense channel.
During light load synchronous operation, or heavy load to
light load transitions the negative current limit can be
triggered during normal operation. When the sensed current
exceeds the negative current limit, the S4 switch is shut off
preventing the discharge of the output voltage both in buck
mode and in boost mode if the output is in the power good
range. Both in boost mode and in buck mode when a
negative current is sensed, the S4 switch is turned off for the
remainder of either the S4 or S2 switching cycle and is
turned on again at the appropriate time. In buck mode, S4
is turned off at the negative current limit transition and
turned on again as soon as the S2 on switch cycle ends. In
boost mode, the S4 switch is the rectifying switch and upon
negative current limit the switch will shut off for the
remainder of its switching cycle. The internal negative
current limits can be controlled via the I
2
C interface as
shown in Table 8.
External Path (CS1, CS2, CLIND)
The voltage drop across the sense resistors as a result of
the load can be observed on the CS1 and CS2 pins. Both
CS1, CS2 can be monitored with a high impedance input. An
external series resistor can be added for additional filtering.
The voltage drop is converted into a current by a
transconductance amplifier with a typical GM of 5 mS. The
final gain of the output is determined by the end users
selection of the R
CS
resistors. The output voltage of the CS
pin can be calculated from Equation 1. The user must be
careful to keep the dynamic range below 3.0 V when
considering the maximum short circuit current.
V
CS
+ (I
LOAD_MAX
*R
SENSE
* Trans) * R
CS
³
(eq. 1)
³ 2.967 V + (8.5 A * 5 mW * 5 mS) * 13.96 kW
R
CS
+
V
CS
I
LOAD
*R
SENSE
* Trans
³
³ 13.96 kW +
2.967 V
8.5 A * 5 mW *5mS
The speed and accuracy of the dual amplifier stage allows
the reconstruction of the input and output current signal,
creating the ability to limit the peak current. If the user would
like to limit the mean DC current of the switch, a capacitor
can be placed in parallel with the R
CS
resistors. CS1, CS2
can be monitored with a high impedance input. An external
series resistor can be added for additional filtering.
CS1, CS2 voltages are connected internally to 2 high
speed low offset comparators. The comparators output can
be used to suspend operation until reset or restart of the part
depending on I
2
C configuration. When the external CLIND
flag is triggered, it indicates that one of the internal
comparators has exceeded the preset limit (CSx_LIM). The
default comparator setting is 250 mV which is a limit of
500 mA with a current sense resistor of 5 mW and an R
CS
resistor of 20 kW. The external current limit settings are
shown in Table 9.
Table 9. REGISTER SETTING FOR THE CLIM COMPARATORS
CLIMx_1 CLIMx_0 CSx_LIM (V)
Current at RSENSE = 5 mW
RSET = 20 kW (A)
Current at RSENSE = 5 mW
RSET = 10 kW (A)
0 0 0.25 .5 1
0 1 0.75 1.5 3
1 0 1.5 3 6
1 1 2.5 5 10
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14
Overvoltage Protection (OVP)
When the divided output voltage is 120% (typical) above
the internal reference voltage for greater than one switching
cycle, an OV fault is set. During an overvoltage fault, S1 is
driven off, S2 is driven on, and S3 and S4 are modulated to
discharge the output voltage while preventing the inductor
current from going beyond the I
2
C programmed negative
current limit.
Figure 7. Diagram for OV Protection
V1 V2
L1S1
S2
S4
S3
During overvoltage fault detection the switching
frequency changes from its I
2
C set value to 50 kHz to reduce
the power dissipation in the switches and prevent the
inductor from saturating. OOV is disabled during voltage
changes to ensure voltage changes and glitches during
slewing are not falsely reported as faults. The OOV faults
are reengaged 1 ms after completion of the soft start.
Figure 8. OV Block Diagram
+
VFB
OV_REF
OV
OV_MSK
Table 10. OVERVOLTAGE MASKING
OV_MSK Description
0 OV Action and Indication Unmasked
1 OV Action and Indication Masked
Power Good Monitor (PG)
NCP81239 provides two window comparators to monitor
the internal feedback voltage. The target voltage window is
±5% of the reference voltage (typical). Once the feedback
voltage is within the power good window, a power good
indication is asserted once a 3.3 ms timer has expired. If the
feedback voltage falls outside a ±7% window for greater
than 1 switching cycle, the power good register is reset.
Power good is indicated on the INT pin if the I
2
C register is
set to display the PG state. During startup, INT is set until the
feedback voltage is within the specified range for 3.3 ms.
Figure 9. PG Block Diagram
+
VFB
PG_Low
PG_High
+
PG
PG_MSK
Table 11. POWER GOOD MASKING
PG_MSK Description
0 PG Action and Indication Unmasked
1 PG Action and Indication Masked
Thermal Shutdown
The NCP81239 protects itself from overheating with an
internal thermal shutdown circuit. If the junction
temperature exceeds the thermal shutdown threshold
(typically 150°C), all MOSFETs will be driven to the off
state, and the part will wait until the temperature decreases
to an acceptable level. The fault will be reported to the fault
register and the INT flag will be set unless it is masked.
When the junction temperature drops below 125°C
(typical), the part will discharge the output voltage to Vsafe
0 V.
CFET Turn On
The CFET is used to engage the output bulk capacitance
after successful negotiations between a consumer and a
provider. The USB Power Delivery Specification requires
that no more than 30 mF of capacitance be present on the
VBUS rail when sinking power. Once the consumer and
provider have completed a power role swap, a larger
capacitance can be added to the output rail to accommodate
a higher power level. The bulk capacitance must be added in
such a way as to minimize current draw and reduce the
voltage perturbation of the bus voltage. The NCP81239
incorporates a right drive circuit that regulates current into
the gate of the MOSFET such that the MOSFET turns on
slowly reducing the drain to source resistance gradually.
Once the transition from high to low has occurred in a
controlled way, a strong pulldown driver is used to ensure
normal operation does not turn on the power NMOSFET
engaging the bulk capacitance. The CFET must be activated
through the I
2
C interface where it can be engaged and
disengaged. The default state is to have the CFET
disengaged.
NCP81239, NCP81239A
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15
Figure 10. CFET Drive
CFET
30μF
C
BULK
10 μH
VCC
2μA
2μA
CFET
10 ms Rising
Edege Delay
VBUS
LSG2
HSG2
Q
CFET
Table 12. CFET ACTIVATION TABLE
CFET_0 Description
0 CFET Drive Pulldown
1 CFET Drive Pull Up
PFET Drive
The PMOS drive is an open drain output used to control
the turn on and turn off of PMOSFET switches at a floating
potential. The external PMOS can be used as a cutoff switch,
enable for an auxiliary power supply, or a bypass switch for
a power supply. The RDSon of the pulldown NMOSFET is
typically 20 W allowing the user to quickly turn on large
PMOSFET power channels.
Figure 11. PFET Drive
PDRV
PFET_DRV
VBUS
Table 13. PFET ACTIVATION TABLE
PFET_DRV Description
0 NFET OFF (Default)
1 NFET ON

NCP81239MNTXG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Switching Controllers I2C CONFIGURABLE 4 SWITCH
Lifecycle:
New from this manufacturer.
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