LTM8001
19
8001fd
For more information www.linear.com/LTM8001
and damaging the part. If the input supply is poorly con-
trolled or the user will be plugging the LTM8001
into an
energized supply, the input network should be designed
to prevent this overshoot. This can be accomplished by
installing a small resistor in series to V
IN0
, but the most
popular method of controlling input voltage overshoot is
to add an electrolytic bulk capacitor to the V
IN0
net. This
capacitor’s relatively high equivalent series resistance
damps the circuit and eliminates the voltage overshoot.
The extra capacitor improves low frequency ripple filtering
and can slightly improve the performance of the circuit,
though it may be physically large.
Shorted Input Protection
Care needs to be taken in systems where the V
OUT0
out-
put will be held high when the input to the LTM8001 is
absent.
If the V
IN0
is allowed to float and the RUN pin is
held high (either by a logic signal or because it is tied to
V
IN0
), then the LTM8001’s internal circuitry will pull its
quiescent current through its internal power switch. This
is fine if your system can tolerate this state. If the RUN pin
is pulled low, the input current will drop to essentially zero.
However, if the V
IN0
is grounded while the V
OUT0
output is
held high, then parasitic diodes inside the LTM8001 can
pull large currents from the output through the V
IN0
pin.
Figure 7 shows a circuit that will run only when the input
voltage is present and that protects against a shorted or
reversed input.
Charging Applications
The LTM8001s internal switching step-down regula
-
tor’s CVCC operation makes it well suited for battery or
super
capacitor
charging applications. A schematic of the
LTM8001 charging a supercapacitor and then distribut
-
ing power to various loads through the onboard LDOs is
shown in the Typical Applications section. In this applica-
tion, the supercapacitor is charged through the step-down
switching regulator and not the LDOs
.
Each LDO is rated
for positive and differential voltages between its input
and output, but may experience a negative voltage during
start-up or turn-off transients if its output is connected to
a battery, supercapacitor or energized load. Avoid using
the LTM8001 in applications where the internal LDOs can
experience a negative voltage.
Thermal Considerations
The LTM8001 output current may need to be derated if it
is required to operate in a high ambient temperature. The
amount of current derating is dependent upon the input
voltage, output power and ambient temperature. The
temperature rise curves given in the Typical Performance
Characteristics section can be used as a guide. These curves
were generated by the LTM8001 mounted to a 59cm
2
4-layer FR4 printed circuit board. Boards of other sizes
and layer count can exhibit different thermal behavior, so
it is incumbent upon the user to verify proper operation
over the intended systems line, load and environmental
operating conditions.
For increased accuracy and fidelity to the actual application,
many designers use finite element analysis (FEA) to predict
thermal performance. To that end, the Pin Configuration
of this data sheet typically gives four thermal coefficients:
θ
JA
: Thermal resistance from junction to ambient
θ
JCbottom
: Thermal resistance from junction to the bottom
of the product case
θ
JCtop
: Thermal resistance from junction to top of the
product case
θ
JB
: Thermal resistance from junction to the printed
circuit board
applicaTions inForMaTion
V
IN
RUN
RT
V
OUT0
GND
8001 F07
LTM8001
V
IN
V
OUT
Figure 7. The Input Diode Prevents a Shorted Input
from Discharging a Backup Battery Tied to the Output.
It Also Protects the Circuit from a Reversed Input. The
LTM8001 Runs Only When the Input is Present
LTM8001
20
8001fd
For more information www.linear.com/LTM8001
While the meaning of each of these coefficients may seem
to be intuitive, JEDEC has defined each to avoid confusion
and inconsistency. These definitions are given in JESD
51-12, and are quoted or paraphrased below:
θ
JA
is the natural convection junction-to-ambient air
thermal resistance measured in a one cubic foot sealed
enclosure. This environment is sometimes referred to as
still air although natural convection causes the air to
move. This value is determined with the part mounted to
a JESD 51-9 defined test board, which does not reflect an
actual application or viable operating condition.
θ
JCbottom
is the junction-to-board thermal resistance with
all of the component power dissipation flowing through the
bottom of the package. In the typical µModule regulator,
the bulk of the heat flows out the bottom of the package,
but there is always heat flow out into the ambient envi
-
ronment. As a result, this thermal resistance value may
be
useful
for comparing packages but the test conditions
don’t generally match the user’s application.
θ
JCtop
is determined with nearly all of the component power
dissipation flowing through the top of the package. As the
electrical connections of the typical µModule regulator are
on the bottom of the package, it is rare for an application
to operate such that most of the heat flows from the junc
-
tion to the top of the part. As in the case of θ
JCbottom
, this
value may be useful for comparing packages but the test
conditions don’t generally match the user’s application.
θ
JB
is the junction-to-board thermal resistance where
almost all of the heat flows through the bottom of the
µModule regulator and into the board, and is really the
sum of the θ
JCbottom
and the thermal resistance of the
bottom of the part through the solder joints and through a
portion of the board. The board temperature is measured
a specified distance from the package, using a two sided,
two layer board. This board is described in JESD 51-9.
Given these definitions, it should now be apparent that none
of these thermal coefficients reflects an actual physical
operating condition of a µModule regulator. Thus, none
of them can be individually used to accurately predict the
thermal performance of the product. Likewise, it would
be inappropriate to attempt to use any one coefficient to
correlate to the junction temperature vs load graphs given
in this product’s data sheet. The only appropriate way to
use the coefficients is when running a detailed thermal
analysis, such as FEA, which considers all of the thermal
resistances simultaneously.
A graphical representation of these thermal resistances
is Figure 8. The blue resistances are contained within the
µModule regulator, and the green are outside.
The die temperature of the LTM8001 must be lower than
the maximum rating of 125°C, so care should be taken in
the layout of the circuit to ensure good heat sinking of the
LTM8001. The bulk of the heat flow out of the LTM8001
is through the bottom of the module and the BGA pads
into the printed circuit board. Consequently a poor printed
circuit board design can cause excessive heating, result
-
ing in impaired performance or reliability. Please refer to
the PCB Layout section for printed cir
cuit board design
suggestions.
applicaTions inForMaTion
LTM8001
21
8001fd
For more information www.linear.com/LTM8001
applicaTions inForMaTion
8001 F08
µMODULE DEVICE
JUNCTION-TO-CASE (TOP)
RESISTANCE
JUNCTION-TO-BOARD RESISTANCE
JUNCTION-TO-AMBIENT RESISTANCE (JESD 51-9 DEFINED BOARD)
CASE (TOP)-TO-AMBIENT
RESISTANCE
BOARD-TO-AMBIENT
RESISTANCE
JUNCTION-TO-CASE
(BOTTOM) RESISTANCE
JUNCTION A
t
CASE (BOTTOM)-TO-BOARD
RESISTANCE
Figure 8. Thermal Resistances Among μModule Device Printed Circuit Board and Ambient Environment

LTM8001IY#PBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators 36VIN, 5A Module Regulator with 5-Output Configurable LDO Array
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet