LTM8001
25
8001fd
For more information www.linear.com/LTM8001
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
PACKAGE TOP VIEW
4
PIN “A1”
CORNER
Y
X
aaa Z
aaa Z
DETAIL A
PACKAGE BOTTOM VIEW
3
SEE NOTES
L
K
J
H
G
F
E
D
C
B
A
123891011 4567
PIN 1
BGA Package
121-Lead (15.00mm × 15.00mm × 3.42mm)
(Reference LTC DWG# 05-08-1923 Rev A)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
BALL DESIGNATION PER JESD MS-028 AND JEP95
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION CAN BE 96.5% Sn/3.0% Ag/0.5% Cu
OR Sn Pb EUTECTIC
4
3
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
DETAIL A
Øb (121 PLACES)
DETAIL B
SUBSTRATE
A
A1
b1
ccc Z
DETAIL B
PACKAGE SIDE VIEW
MOLD
CAP
Z
M
X YZddd
M
Zeee
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
H1
H2
aaa
bbb
ccc
ddd
eee
MIN
3.22
0.50
2.72
0.60
0.60
0.27
2.45
NOM
3.42
0.60
2.82
0.75
0.63
15.00
15.00
1.27
12.70
12.70
0.32
2.50
MAX
3.62
0.70
2.92
0.90
0.66
0.37
2.55
0.15
0.10
0.20
0.30
0.15
NOTES
DIMENSIONS
TOTAL NUMBER OF BALLS: 121
A2
D
E
e
b
F
G
SUGGESTED PCB LAYOUT
TOP VIEW
0.000
3.810
5.080
3.810
6.350
5.080
6.350
2.540
1.270
2.540
1.270
6.350
5.080
1.270
6.350
5.080
3.810
2.540
1.270
0.3175
0.3175
3.810
2.540
0.000
// bbb Z
Z
H2
H1
0.635 ±0.025 Ø 121x
LTMXXXXXX
µModule
BGA 121 1112 REV A
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
COMPONENT
PIN “A1”
7 PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
!
7
SEE NOTES
