NXP Semiconductors
BGU8061
low-noise high-linearity amplifier
BGU8061 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2017. All rights reserved.
Product data sheet Rev. 2 — 27 January 2017
4 / 17
8 Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
CC
supply voltage - 6 V
V
i(CTRL1)
input voltage on pin CTRL1 - 3.6 V
V
i(CTRL2)
input voltage on pin CTRL2 - 3.6 V
P
i(RF)CW
continuous waveform RF input power - 20 dBm
T
amb
ambient temperature −40 +85 °C
T
stg
storage temperature −40 +150 °C
T
j
junction temperature - 150 °C
P power dissipation T
case
≤ 125 °C
[1]
- 510 mW
Human Body Model (HBM) according to
ANSI/ESDA/JEDEC standard JS-001-2010
- 2.0 kVV
ESD
electrostatic discharge voltage
Charged Device Model (CDM) according to
JEDEC standard 22-C101B
- 1.0 kV
[1] Case is ground solder pad.
9 Recommended operating conditions
Table 5. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
V
CC
supply voltage 4.75 5 5.25 V
Z
0
characteristic impedance - 50 - Ω
10 Thermal characteristics
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-case)
thermal resistance from junction to case
[1]
[2]
- 55 - K/W
[1] Case is ground solder pad.
[2] Thermal resistance measured using infrared measurement technique, device mounted on application board and placed in still air.
NXP Semiconductors
BGU8061
low-noise high-linearity amplifier
BGU8061 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2017. All rights reserved.
Product data sheet Rev. 2 — 27 January 2017
5 / 17
11 Characteristics
Table 7. Characteristics
f = 900 MHz; V
CC
= 5 V; T
amb
= 25 °C; input and output 50 Ω; unless otherwise specified. All RF parameters are measured
on an application board with the circuit as shown in Figure 29 and components listed in Table 9 implemented. This board is
optimized for f = 900 MHz.
Symbol Parameter Conditions Min Typ Max Unit
LNA enable; bypass off - 70 85 mAI
CC
supply current
LNA disable; bypass on - 3 5 mA
LNA enable; bypass off 19 20.5 22 dBG
ass
associated gain
LNA disable; bypass on −1.6 −1.0 - dB
within 100 MHz bandwidth; LNA enable; bypass off
700 MHz ≤ f ≤ 1500 MHz - 0.9 - dB
G
flat
gain flatness
1000 MHz ≤ f ≤ 1500 MHz - 0.8 - dB
NF noise figure LNA enable; bypass off
[1]
- 1.1 1.8 dB
ΔG gain variation 700 MHz ≤ f ≤ 1500 MHz - 5.5 - dB
P
L(1dB)
output power at 1 dB
gain compression
LNA enable; bypass off 19 20.5 - dBm
2-tone; tone spacing = 1 MHz; P
L
= 5 dBm per tone
LNA enable; bypass off 33.5 36.5 - dBm
IP3
O
output third-order
intercept point
LNA disable; bypass on - 44 - dBm
LNA enable; bypass off - 10 - dBRL
in
input return loss
LNA disable; bypass on - 15 - dB
LNA enable; bypass off - 10 - dBRL
out
output return loss
LNA disable; bypass on - 15 - dB
LNA disable; bypass off - 30 - dBISL isolation
LNA enable; bypass off - 20 - dB
t
s(pon)
power-on settling time P
i
= −20 dBm - 0.5 - μs
t
s(poff)
power-off settling time P
i
= −20 dBm - 0.1 - μs
K Rollett stability factor both on-state and off-state up to f = 20 GHz 1 - - -
[1] Connector and Printed-Circuit Board (PCB) losses have been de-embedded.
NXP Semiconductors
BGU8061
low-noise high-linearity amplifier
BGU8061 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2017. All rights reserved.
Product data sheet Rev. 2 — 27 January 2017
6 / 17
Table 8. Control truth table
V
CC
= 5 V; T
amb
= 25 °C.
Control signal setting
[1]
Mode of operation
CTRL2 (pin 1) CTRL1 (pin 10) LNA bypass
HIGH LOW disable on
HIGH HIGH disable on
LOW LOW enable off
LOW HIGH disable off
[1] A logic LOW is the result of an input voltage on that specific pin between −0.3 V and +0.7 V.
A logic HIGH is the result of an input voltage on that specific pin between 1.2 V and 3.6 V.

BGU8061J

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
low-noise high-linearity amplifie
Lifecycle:
New from this manufacturer.
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