Data Sheet ADA4859-3
Rev. A | Page 15 of 16
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC
2.25
2.10 SQ
1.95
16
5
13
8
9
12
1
4
1.95 BSC
PIN 1
INDICATOR
T
OP
VIEW
4.00
BSC SQ
3.75
BSC
SQ
COPLANARITY
0.08
(BOTTOM VIEW)
12° MAX
1.00
0.85
0.80
SEATING
PLANE
0.35
0.30
0.25
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
0.20 REF
0.65 BSC
0.60 MAX
0.60 MAX
PIN 1
INDIC
A
TOR
0.25 MIN
072808-A
0.75
0.60
0.50
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 39.16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad (CP-16-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option Ordering Quantity
ADA4859-3ACPZ-R2 –40°C to +105°C 16-Lead LFCSP_VQ CP-16-4 250
ADA4859-3ACPZ-R7 –40°C to +105°C 16-Lead LFCSP_VQ CP-16-4 1,500
ADA4859-3ACPZ-RL –40°C to +105°C 16-Lead LFCSP_VQ CP-16-4 5,000
ADA4859-3ACP-EBZ Evaluation Board
1
Z = RoHS Compliant Part.
