Data Sheet ADA4859-3
Rev. A | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
Supply Voltage 6 V
Internal Power Dissipation
1
16-Lead LFCSP See Figure 2
Input Voltage (Common-Mode) (−V
− 0.2 V) to (+V
− 1.8 V)
Differential Input Voltage ±V
Output Short-Circuit Duration Observe power derating curves
Storage Temperature Range −65°C to +125°C
Operating Temperature Range
Lead Temperature
(Soldering, 10 sec)
300°C
1
Specification is for device in free air.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
ADA4859-3 is limited by the associated rise in junction
temperature. The maximum safe junction temperature
for plastic encapsulated devices is determined by the glass
transition temperature of the plastic, approximately 150°C.
Temporarily exceeding this limit may cause a shift in parametric
performance due to a change in the stresses exerted on the die
by the package. Exceeding a junction temperature of 175°C for
an extended period can result in device failure.
To ensure proper operation, it is necessary to observe the
maximum power derating curves in Figure 2.
2.5
2.0
1.5
1.0
0.5
0
–40 –20
0 20
40 60 80 100
MAXIMUM POWER DISSIPATION (W)
AMBIENT TEMPERATURE (°C)
07715-002
Figure 2. Maximum Power Dissipation vs. Ambient Temperature
ESD CAUTION
