9ZML1232
2:12 LOW POWER DIFFERENTIAL Z-BUFFER MUX FOR PCIE AND QPI/UPI
IDT®
2:12 LOW POWER DIFFERENTIAL Z-BUFFER MUX FOR PCIE AND QPI/UPI 7
9ZML1232 REV E 112015
Electrical Characteristics–DIF 0.7V Low Power Differential Outputs
Electrical Characteristics–Current Consumption
TA = T
COM
; Supply Voltage VDD/VDDA = 3.3 V +/-5%, VDDIO = 1.05 to 3.3V +/-5%. See Test Loads for Loading Conditions
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS NOTES
Slew rate Trf Scope avera
g
in
g
on 1 3.3 4
V/ns
1, 2, 3
Slew rate matching
Trf Slew rate matching, Scope averaging on 2 20
%
1, 2, 4
Voltage High VHigh 660 804 850 1
Voltage Low VLow -150 19 150 1
Max Voltage Vmax 885 1150 1
Min Voltage Vmin -300 -29 1
Vswing Vswing Scope averaging off 300 1569 mV 1, 2
Crossing Voltage (abs) Vcross_abs Scope averaging off 300 465 550 mV 1, 5
Crossing Voltage (var)
-Vcross Scope averaging off 12 140 mV 1, 6
2
Measured from differential waveform
3
Slew rate is measured through the Vswing voltage range centered around differential 0V. This results in a +/-150mV window around
differential 0V.
4
Matching applies to rising edge rate for Clock and falling edge rate for Clock#. It is measured using a +/-75mV window centered on
the average cross point where Clock rising meets Clock# falling. The median cross point is used to calculate the voltage thresholds the
oscilloscope is to use for the edge rate calculations.
5
Vcross is defined as voltage where Clock = Clock# measured on a component test board and only applies to the differential rising
edge (i.e. Clock rising and Clock# falling).
6
The total variation of all Vcross measurements in any particular system. Note that this is a subset of Vcross_min/max (Vcross
absolute) allowed. The intent is to limit Vcross induced modulation by setting
-Vcross to be smaller than Vcross absolute.
Statistical measurement on single-ended signal
using oscilloscope math function. (Scope
averaging on)
mV
Measurement on single ended signal using
absolute value. (Scope averaging off)
mV
1
Guaranteed by design and characterization, not 100% tested in production. C
L
= 2pF with R
S
= 27
for Zo = 85
differential trace
impedance).
TA = T
COM
; Supply Voltage VDD/VDDA = 3.3 V +/-5%, VDDIO = 1.05 to 3.3V +/-5%. See Test Loads for Loading Conditions
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS NOTES
I
DDVD
D
All outputs @100MHz, C
L
= 2pF; Zo=85
13 35 mA 1
I
DDVDDA/
R
All outputs @100MHz, C
L
= 2pF; Zo=85
14 20 mA 1
I
DDVDDI O
All outputs @100MHz, C
L
= 2pF; Zo=85
86 100 mA 1
I
DDVDDP
D
All differential pairs low/low 0.7 4 mA 1,2
I
DDVDDA/RP
D
All differential pairs low/low 5 mA 1,2
I
DDVDDIOPD
All differential pairs low/low 0.2 mA 1,2
1
Guaranteed by design and characterization, not 100% tested in production.
2
With input clock running. Stopping the input clock will result in lower numbers.
Operating Supply Current
Powerdown Current
9ZML1232
2:12 LOW POWER DIFFERENTIAL Z-BUFFER MUX FOR PCIE AND QPI/UPI
IDT®
2:12 LOW POWER DIFFERENTIAL Z-BUFFER MUX FOR PCIE AND QPI/UPI 8
9ZML1232 REV E 112015
Electrical Characteristics–Skew and Differential Jitter Parameters
TA = T
COM
; Supply Voltage VDD/VDDA = 3.3 V +/-5%, VDDIO = 1.05 to 3.3V +/-5%. See Test Loads for Loading Conditions
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS NOTES
CLK_IN, DIF[x:0] t
SPO_PLL
Input-to-Output Skew in PLL mode
nominal value @ 25°C, 3.3V
-325 -225 -125 ps 1,2,4,5,8
CLK_IN, DIF[x:0] t
PD_BYP
Input-to-Output Skew in Bypass mode
nominal value @ 25°C, 3.3V
3 3.8 4.5 ns 1,2,3,5,8
CLK_IN, DIF[x:0] t
DSPO_PLL
Input-to-Output Skew Varation in PLL mode
across voltage and temperature
-50 0 50 ps 1,2,3,5,8
CLK_IN, DIF[x:0] t
DSPO_BYP
Input-to-Output Skew Varation in Bypass mode
across voltage and temperature
-250 250 ps 1,2,3,5,8
CLK_IN, DIF[x:0] t
DTE
Random Differential Tracking error beween two
9ZM devices in Hi BW Mode
5
ps
(rms)
1,2,3,5,8
CLK_IN, DIF[x:0] t
DSSTE
Random Differential Spread Spectrum Tracking
error beween two 9ZM devices in Hi BW Mode
75 ps 1,2,3,5,8
DIF{x:0] t
SKEW_ALL
Output-to-Output Skew across all outputs
(Common to Bypass and PLL mode)
40 65 ps 1,2,3,8
PLL Jitter Peaking j
p
eak-hibw
LOBW#_BYPASS_HIBW = 1 0 2.5 dB 7,8
PLL Jitter Peaking j
p
eak-lobw
LOBW#_BYPASS_HIBW = 0 0 2 dB 7,8
PLL Bandwidth pll
HIBW
LOBW#_BYPASS_HIBW = 1 2 4 MHz 8,9
PLL Bandwidth pll
LOBW
LOBW#_BYPASS_HIBW = 0 0.7 1.4 MHz 8,9
Duty Cycle t
DC
Measured differentially, PLL Mode 45 50.2 55 % 1
Duty Cycle Distortion t
DCD
Measured differentially, Bypass Mode
@100MHz
-2 0.8 2 % 1,10
PLL mode 10 50 ps 1,11
Additive Jitter in Bypass Mode 0.1 50 ps 1,11
Notes for preceding table:
6.
t is the period of the input clock
7
Measured as maximum pass band gain. At frequencies within the loop BW, highest point of magnification is called PLL jitter peaking.
8.
Guaranteed by desi
g
n and characterization, not 100% tested in production.
9
Measured at 3 db down or half power point.
10
Duty cycle distortion is the difference in duty cycle between the output and the input clock when the device is operated in bypass mod
e
11
Measured from differential waveform
Jitter, Cycle to cycle t
jcyc-cyc
1
Measured into fixed 2 pF load cap. Input to output skew is measured at the first output edge following the corresponding input.
2
Measured from differential cross-point to differential cross-point. This parameter can be tuned with external feedback path, if present.
3
All Bypass Mode Input-to-Output specs refer to the timing between an input edge and the specific output edge created by it.
4
This parameter is deterministic for a given device
5
Measured with scope averaging on to find mean value.
9ZML1232
2:12 LOW POWER DIFFERENTIAL Z-BUFFER MUX FOR PCIE AND QPI/UPI
IDT®
2:12 LOW POWER DIFFERENTIAL Z-BUFFER MUX FOR PCIE AND QPI/UPI 9
9ZML1232 REV E 112015
Electrical Characteristics–Phase Jitter Parameters
TA = T
COM
; Supply Voltage VDD/VDDA = 3.3 V +/-5%, VDDIO = 1.05 to 3.3V +/-5%. See Test Loads for Loading Conditions
PARAMETER SYMBOL CONDITIONS MIN TYP MAX
INDUSTRY
LIMIT
UNITS Notes
t
jp
hPCIeG1
PCIe Gen 1 23 36 44 86 ps (p-p) 1,2,3
PCIe Gen 2 Lo Band
10kHz < f < 1.5MHz
0.84 1.18 1.41 3
ps
(rms)
1,2
PCIe Gen 2 High Band
1.5MHz < f < Nyquist (50MHz)
1.44
2.01
2.48 3.1
ps
(rms)
1,2
t
jphPCIeG3
PCIe Gen 3
(PLL BW of 2-4MHz, CDR = 10MHz)
0.37
0.49
0.59 1
ps
(rms)
1,2,4
QPI & SMI
(100MHz or 133MHz, 4.8Gb/s, 6.4Gb/s 12UI)
0.20 0.25 0.35 0.5
ps
(rms)
1,5
QPI & SMI
(100MHz, 8.0Gb/s, 12UI)
0.08 0.16 0.28 0.3
ps
(rms)
1,5
QPI & SMI
(100MHz, 9.6Gb/s, 12UI)
0.07 0.12 0.19 0.2
ps
(rms)
1,5
t
jp
hPCIeG1
PCIe Gen 1 0310 N/A ps (p-p) 1,2,3
PCIe Gen 2 Lo Band
10kHz < f < 1.5MHz
0.09 0.13 0.30 N/A
ps
(rms)
1,2,6
PCIe Gen 2 High Band
1.5MHz < f < Nyquist (50MHz)
0.00
0.10 0.70 N/A
ps
(rms)
1,2,6
t
jphPCIeG3
PCIe Gen 3
(PLL BW of 2-4MHz, CDR = 10MHz)
0.00
0.10
0.30 N/A
ps
(rms)
1,2,4,6
QPI & SMI
(100MHz or 133MHz, 4.8Gb/s, 6.4Gb/s 12UI)
0.00 0.10 0.30 N/A
ps
(rms)
1,5,6
QPI & SMI
(100MHz, 8.0Gb/s, 12UI)
0.04 0.05 0.10 N/A
ps
(rms)
1,5,6
QPI & SMI
(100MHz, 9.6Gb/s, 12UI)
0.04 0.05 0.10 N/A
ps
(rms)
1,5,6
1
Applies to all outputs.
6
For RMS figures, additive jitter is calculated by solving the following equation: (Additive jitter)^2 = (total jittter)^2 - (input jitter)^2
2
See http://www.pcisig.com for complete specs
3
Sample size of at least 100K cycles. This figures extrapolates to 108ps pk-pk @ 1M cycles for a BER of 1-12.
4
Subject to final ratification by PCI SIG.
5
Calculated from Intel-supplied Clock Jitter Tool v 1.6.3
Phase Jitter, PLL Mode
t
jphPCIeG2
t
jphQPI_SMI
Additive Phase Jitter,
Bypass mode
t
jphPCIeG2
t
jphQPI_SMI

9ZML1232BKLF

Mfr. #:
Manufacturer:
IDT
Description:
Clock Buffer Buffer
Lifecycle:
New from this manufacturer.
Delivery:
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