IRLML0060TRPbF
8 2016-12-20
Note: For the most current drawing please refer to Infineon’s web site www.infineon.com
Micro3™ (SOT-23/TO-236AB) Part Marking Information
Micro3™ (SOT-23) Package Outline (Dimensions are shown in millimeters (inches))
e
E1
E
D
A
B
0.15 [0.006]
e1
1
2
3
M
CBA
5
6
6
5
NOTES:
1. DIMENSIONING & TOLERANCING PER ANSI Y14. 5M-1994
2. DIMENSIONS ARE SHOWN IN MILLIMETERS [I NCHES].
3. CONTROLLI NG DIMENSION: MILLIMETER.
4. DATUM PLANE H IS LOCATED AT THE MOLD PARTING LINE.
5. DATUM A AND B TO BE DETERMINED AT DATUM PLANE H.
6. DIMENSIONS D AND E1 ARE MEASURED AT DATUM PLANE H. DI MENSIONS DOES
NOT INCLUDE MOLD PROTRUSI ONS OR INTERLEAD FLASH. MOLD PROTRUSIONS
OR INTERLEAD FLASH SHALL NOT EXCEED 0.25 MM [0. 010 INCH] PER SIDE.
7. DIMENSION L IS THE LEAD LENGTH FOR SOLDERING TO A SUBSTRATE.
8. OUTLINE CONFORMS TO JEDEC OUTLI NE TO-236 AB.
NOTES:
b
A1
3X
A
A2
ABC
M
0.20 [0.008]
0.10 [0.004]
C
C
3X L
c
L2
H
4
L1
7
0.972
1.900
Recommended Footprint
0.802
0.950
2.742
0.89
1.12
SYMBOL
MAXMI N
A1
b
0.01 0.10
c
0.30 0.50
D
0.08 0.20
E
2.80 3.04
E1
2.10 2.64
e
1.20 1.40
A
0.95
BSC
L
0.40 0.60
08
MI LLI METERS
A2
0.88 1.02
e1 1.90 BSC
REF0.54L1
BSC
0.25
L2
0.010
BSC
0.021
REF
BSC 0.075
0.0400.035
INCHES
80
0.0240.016
BSC0.037
0.0550.047
0.1040.083
0.1200.110
0.0080.003
0.0200.012
0.004
0.0004
MI N MAX
0.0440.035
DIMENSIONS
