©2011 Silicon Storage Technology, Inc. DS25040A 05/11
2
16 Mbit Multi-Purpose Flash Plus
SST39VF1681 / SST39VF1682
Data Sheet
Microchip Technology Company
Product Description
The SST39VF168x devices are 2M x8 CMOS Multi-Purpose Flash Plus (MPF+) manufactured with SST’s
proprietary, high performance CMOS SuperFlash® technology. The split-gate cell design and thick-oxide
tunneling injector attain better reliability and manufacturability compared with alternate approaches. The
SST39VF168x write (Program or Erase) with a 2.7-3.6V power supply. These devices conform to JEDEC
standard pinouts for x8 memories.
Featuring high performance Byte-Program, the SST39VF168x devices provide a typical Byte-Program
time of 7 µsec. These devices use Toggle Bit or Data# Polling to indicate the completion of Program
operation. To protect against inadvertent write, they have on-chip hardware and Software Data Protec-
tion schemes. Designed, manufactured, and tested for a wide spectrum of applications, these devices
are offered with a guaranteed typical endurance of 100,000 cycles. Data retention is rated at greater
than 100 years.
The SST39VF168x devices are suited for applications that require convenient and economical updat-
ing of program, configuration, or data memory. For all system applications, they significantly improve
performance and reliability, while lowering power consumption. They inherently use less energy during
Erase and Program than alternative flash technologies. The total energy consumed is a function of the
applied voltage, current, and time of application. Since for any given voltage range, the SuperFlash
technology uses less current to program and has a shorter erase time, the total energy consumed dur-
ing any Erase or Program operation is less than alternative flash technologies. These devices also
improve flexibility while lowering the cost for program, data, and configuration storage applications.
The SuperFlash technology provides fixed Erase and Program times, independent of the number of
Erase/Program cycles that have occurred. Therefore the system software or hardware does not have
to be modified or de-rated as is necessary with alternative flash technologies, whose Erase and Pro-
gram times increase with accumulated Erase/Program cycles.
To meet high density, surface mount requirements, the SST39VF168x are offered in both 48-ball TFBGA
and 48-lead TSOP packages. See Figures 2 and 3 for pin assignments.