ADLD8403 Data Sheet
Rev. D | Page 4 of 10
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
Supply Voltage, V
CC
13.2 V
Storage Temperature Range −65°C to +150°C
Operating Temperature Range −40°C to +85°C
Lead Temperature (Soldering, 10 sec) 300°C
Junction Temperature 150°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
θ
JA
is specified in still air with the exposed pad soldered to a
4-layer JEDEC test board. θ
JC
is specified at the exposed pad.
Table 3. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
20-Lead LFCSP (CP-20-8) 36.1 5.7 °C/W
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation for the ADLD8403 is
limited by its junction temperature on the die.
The maximum safe junction temperature of plastic encapsulated
devices, as determined by the glass transition temperature of the
plastic, is 150°C. Exceeding this limit may temporarily cause a shift
in the parametric performance due to a change in the stresses
exerted on the die by the package. Exceeding this limit for an
extended period can result in device failure.
Figure 3 shows the maximum power dissipation in the package vs.
the ambient temperature for the 20-lead LFCSP on a JEDEC
standard 4-layer board. θ
JA
values are approximations.
6
0
1
2
3
4
5
–25 857565
55453525155–5–15
MAXIMUM POWER DISSIPATION (W)
AMBIENT TEMPERATURE (°C)
T
J
= 150°C
08848-003
Figure 3. Maximum Power Dissipation vs. Ambient Temperature
for a 4-Layer Board
The power dissipated in the package (P
D
) is easily computed by
taking the total power consumed while driving a signal and
subtracting the power dissipated in the load. The total power
consumed is simply the product of the voltage between the
supply pins (VCC, VEEP, and VCCP) times the supply current (I
S
).
Use rms voltages and currents.
Airflow increases heat dissipation, effectively reducing θ
JA
. In
addition, more copper in direct contact with the package leads
from PCB traces, through holes, ground, and power planes
reduces θ
JA
.
ESD CAUTION
