LPC2131_32_34_36_38 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5.1 — 29 July 2011 37 of 45
NXP Semiconductors
LPC2131/32/34/36/38
Single-chip 16/32-bit microcontrollers
Fig 14. Oscillator modes and models: oscillation mode of operation and external crystal
model used for C
X1
/C
X2
evaluation
Table 10. Recommended values for C
X1
/C
X2
in oscillation mode (crystal and external
components parameters): low frequency mode
Fundamental oscillation
frequency F
OSC
Crystal load
capacitance C
L
Maximum crystal
series resistance R
S
External load
capacitors C
X1
/C
X2
1 MHz to 5 MHz 10 pF < 300 18 pF, 18 pF
20 pF < 300 39 pF, 39 pF
30 pF < 300 57 pF, 57 pF
5 MHz to 10 MHz 10 pF < 300 18 pF, 18 pF
20 pF < 200 39 pF, 39 pF
30 pF < 100 57 pF, 57 pF
10 MHz to 15 MHz 10 pF < 160 18 pF, 18 pF
20 pF < 60 39 pF, 39 pF
15 MHz to 20 MHz 10 pF < 80 18 pF, 18 pF
Table 11. Recommended values for C
X1
/C
X2
in oscillation mode (crystal and external
components parameters): high frequency mode
Fundamental oscillation
frequency F
OSC
Crystal load
capacitance C
L
Maximum crystal
series resistance R
S
External load
capacitors C
X1
,
CX2
15 MHz to 20 MHz 10 pF < 180 18 pF, 18 pF
20 pF < 100 39 pF, 39 pF
20 MHz to 25 MHz 10 pF < 160 18 pF, 18 pF
20 pF < 80 39 pF, 39 pF
002aag469
LPC2xxx
XTAL1 XTAL2
C
X2
C
X1
XTAL
=
C
L
C
P
R
S
L
LPC2131_32_34_36_38 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5.1 — 29 July 2011 38 of 45
NXP Semiconductors
LPC2131/32/34/36/38
Single-chip 16/32-bit microcontrollers
12.2 RTC 32 kHz oscillator component selection
The RTC external oscillator circuit is shown in Figure 15. Since the feedback resistance is
integrated on chip, only a crystal, the capacitances C
X1
and C
X2
need to be connected
externally to the microcontroller.
Table 12
gives the crystal parameters that should be used. C
L
is the typical load
capacitance of the crystal and is usually specified by the crystal manufacturer. The actual
C
L
influences oscillation frequency. When using a crystal that is manufactured for a
different load capacitance, the circuit will oscillate at a slightly different frequency
(depending on the quality of the crystal) compared to the specified one. Therefore for an
accurate time reference it is advised to use the load capacitors as specified in Table 12
that belong to a specific C
L
. The value of external capacitances C
X1
and C
X2
specified in
this table are calculated from the internal parasitic capacitances and the C
L
. Parasitics
from PCB and package are not taken into account.
12.3 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors C
x1
, C
x2
, and C
x3
in case of
third overtone crystal usage have a common ground plane. The external components
must also be connected to the ground plane. Loops must be made as small as possible in
order to keep the noise coupled in via the PCB as small as possible. Also parasitics
should stay as small as possible. Values of C
x1
and C
x2
should be chosen smaller
accordingly to the increase in parasitics of the PCB layout.
Fig 15. RTC oscillator modes and models: oscillation mode of operation and external
crystal model used for C
X1
/C
X2
evaluation
Table 12. Recommended values for the RTC external 32 kHz oscillator C
X1
/C
X2
components
Crystal load capacitance
C
L
Maximum crystal series
resistance R
S
External load capacitors C
X1
/C
X2
11 pF < 100 k 18 pF, 18 pF
13 pF < 100 k 22 pF, 22 pF
15 pF < 100 k 27 pF, 27 pF
002aaf495
LPC2xxx
RTCX1 RTCX2
C
X2
C
X1
32 kHz XTAL
=
C
L
C
P
R
S
L
LPC2131_32_34_36_38 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5.1 — 29 July 2011 39 of 45
NXP Semiconductors
LPC2131/32/34/36/38
Single-chip 16/32-bit microcontrollers
13. Package outline
Fig 16. Package outline SOT314-2 (LQFP64)
UNIT
A
max.
A
1
A
2
A
3
b
p
cE
(1)
eH
E
LL
p
Zywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
1.6
0.20
0.05
1.45
1.35
0.25
0.27
0.17
0.18
0.12
10.1
9.9
0.5
12.15
11.85
1.45
1.05
7
0
o
o
0.12 0.11 0.2
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT314-2 MS-026136E10
00-01-19
03-02-25
D
(1) (1)(1)
10.1
9.9
H
D
12.15
11.85
E
Z
1.45
1.05
D
b
p
e
θ
E
A
1
A
L
p
detail X
L
(A )
3
B
16
c
D
H
b
p
E
H
A
2
v M
B
D
Z
D
A
Z
E
e
v M
A
X
1
64
49
48 33
32
17
y
pin 1 index
w M
w M
0 2.5 5 mm
scale
LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm
SOT314-2

LPC2131FBD64,151

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
IC MCU 32BIT 32KB FLASH 64LQFP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union