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MTA18ASF2G72HZ-2G6D1

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P22
Table 5: Pin Descriptions (Continued)
Symbol Type Description
TDQS_t
TDQS_c
(x8 DRAM-based
RDIMM only)
Output Termination data strobe: When enabled via the mode register, the DRAM device enables the
same R
TT
termination resistance on TDQS_t and TDQS_c that is applied to DQS_t and DQS_c.
When the TDQS function is disabled via the mode register, the DM/TDQS_t pin provides the da-
ta mask (DM) function, and the TDQS_c pin is not used. The TDQS function must be disabled in
the mode register for both the x4 and x16 configurations. The DM function is supported only in
x8 and x16 configurations. DM, DBI, and TDQS are a shared pin and are enabled/disabled by
mode register settings. For more information about TDQS, see the DDR4 DRAM component da-
ta sheet (TDQS_t and TDQS_c are not valid for UDIMMs).
V
DD
Supply Module power supply: 1.2V (TYP).
V
PP
Supply DRAM activating power supply: 2.5V –0.125V / +0.250V.
V
REFCA
Supply Reference voltage for control, command, and address pins.
V
SS
Supply Ground.
V
TT
Supply Power supply for termination of address, command, and control V
DD
/2.
V
DDSPD
Supply Power supply used to power the I
2
C bus for SPD.
RFU – Reserved for future use.
NC – No connect: No internal electrical connection is present.
NF – No function: May have internal connection present, but has no function.
16GB (x72, ECC DR) 260-Pin DDR4 SODIMM
Pin Descriptions
09005aef861e841e
asf18c2gx72hz.pdf – Rev. F 8/16 EN
7
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
DQ Map
Table 6: Component-to-Module DQ Map, Front
Component
Reference
Number
Component
DQ Module DQ
Module Pin
Number
Component
Reference
Number
Component
DQ Module DQ
Module Pin
Number
U1 0 14 38 U2 0 31 80
1 12 24 1 28 66
2 15 37 2 30 79
3 13 25 3 29 67
4 11 42 4 27 84
5 8 28 5 24 70
6 10 41 6 26 83
7 9 29 7 25 71
U3 0 CB3 105 U5 0 39 182
1 CB0 92 1 36 170
2 CB2 101 2 38 183
3 CB1 91 3 37 169
4 CB7 104 4 35 186
5 CB4 88 5 32 174
6 CB6 100 6 34 187
7 CB5 87 7 33 173
U6 0 54 224 U7 0 7 17
1 53 212 1 5 3
2 55 225 2 6 16
3 52 211 3 4 4
4 50 228 4 2 20
5 48 216 5 0 8
6 51 229 6 3 21
7 49 215 7 1 7
U8 0 23 59 U9 0 42 207
1 21 45 1 41 194
2 22 58 2 43 208
3 20 46 3 40 195
4 19 63 4 47 204
5 16 50 5 45 190
6 18 62 6 46 203
7 17 49 7 44 191
16GB (x72, ECC DR) 260-Pin DDR4 SODIMM
DQ Map
09005aef861e841e
asf18c2gx72hz.pdf – Rev. F 8/16 EN
8
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
Table 6: Component-to-Module DQ Map, Front (Continued)
Component
Reference
Number
Component
DQ Module DQ
Module Pin
Number
Component
Reference
Number
Component
DQ Module DQ
Module Pin
Number
U10 0 58 249
1 56 237
2 59 250
3 57 236
4 63 246
5 61 233
6 62 245
7 60 232
Table 7: Component-to-Module DQ Map, Back
Component
Reference
Number
Component
DQ Module DQ
Module Pin
Number
Component
Reference
Number
Component
DQ Module DQ
Module Pin
Number
U11 0 53 212 U12 0 36 170
1 54 224 1 39 182
2 52 211 2 37 169
3 55 225 3 38 183
4 48 216 4 32 174
5 50 228 5 35 186
6 49 215 6 33 173
7 51 229 7 34 187
U13 0 CB0 92 U14 0 28 66
1 CB3 105 1 31 80
2 CB1 91 2 29 67
3 CB2 101 3 30 79
4 CB4 88 4 24 70
5 CB7 104 5 27 84
6 CB5 87 6 25 71
7 CB6 100 7 26 83
16GB (x72, ECC DR) 260-Pin DDR4 SODIMM
DQ Map
09005aef861e841e
asf18c2gx72hz.pdf – Rev. F 8/16 EN
9
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P22

MTA18ASF2G72HZ-2G6D1

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Buy MTA18ASF2G72HZ-2G6D1
Manufacturer:
Micron
Description:
IC SDRAM DDR
Lifecycle:
New from this manufacturer.
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