1616 Tyco Electronics Corp..
Data Sheet
July 2002dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W
FW250F1 and FW300F1 Power Modules:
Thermal Considerations (continued)
Heat Transfer with Heat Sinks (continued)
8-1320 (C)
Figure 28. Case-to-Ambient Thermal Resistance
Curves; Longitudinal Orientation
These measured resistances are from heat transfer
from the sides and bottom of the module as well as the
top side with the attached heat sink; therefore, the
case-to-ambient thermal resistances shown are gener-
ally lower than the resistance of the heat sink by itself.
The module used to collect the data in Figures 27 and
28 had a thermal-conductive dry pad between the case
and the heat sink to minimize contact resistance.
To choose a heat sink, determine the power dissipated
as heat by the unit for the particular application.
Figure 29 shows typical heat dissipation for a range of
output currents and three voltages for the FW250F1
and FW300F1.
8-1737 (C)
Figure 29. FW250F1 and FW300F1 Power
Dissipation vs. Output Current
Example
If an 85 °C case temperature is desired, what is the
minimum airflow necessary? Assume the FW300F1
module is operating at nominal line and an output cur-
rent of 50 A, maximum ambient air temperature of
40 °C, and the heat sink is 0.5 inch.
Solution
Given: V
I = 54 V
I
O = 50 A
T
A = 40 °C
T
C = 85 °C
Heat sink = 0.5 inch.
Determine P
D by using Figure 29:
P
D = 42 W
00.5
(100)
1.0
(200)
1.5
(300)
2.0
(400)
2.5
(500)
3.0
(600)
0.0
0.5
3.0
3.5
4.0
4.5
2.5
2.0
1.0
1 1/2 IN. HEAT SINK
1 IN. HEAT SINK
1/2 IN. HEAT SINK
1/4 IN. HEAT SINK
NO HEAT SINK
CASE-TO-AMBIENT THERMAL
RESISTANCE,
1.5
AIR VELOCITY, m/s
(
ft./min.
)
RCA (˚C/W)
10 20 30 40 50 6
0
0
50
30
20
40
0
60
10
OUTPU
T
CURREN
T
,
IO
(
A
)
P
O
W
E
R
D
I
S
S
I
P
A
T
I
O
N
,
P
D
(
W
)
VI =72V
VI =54V
VI =36V
Tyco Electronics Corp.. 17
Data Sheet
July 2002 dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W
FW250F1 and FW300F1 Power Modules:
Thermal Considerations (continued)
Heat Transfer with Heat Sinks (continued)
Then solve the following equation:
Use Figures 27 and 28 to determine air velocity for the
0.5 inch heat sink. The minimum airflow necessary for
the FW250F1 module depends on heat sink fin orienta-
tion and is shown below:
2.0 m/s (400 ft./min.) (oriented along width)
3.0 m/s (600 ft./min.) (oriented along length)
Custom Heat Sinks
A more detailed model can be used to determine the
required thermal resistance of a heat sink to provide
necessary cooling. The total module resistance can be
separated into a resistance from case-to-sink (θcs) and
sink-to-ambient (θsa) as shown in Figure 30.
8-1304 (C)
Figure 30. Resistance from Case-to-Sink and Sink-
to-Ambient
For a managed interface using thermal grease or foils,
a value of θcs = 0.1 °C/W to 0.3 °C/W is typical. The
solution for heat sink resistance is:
This equation assumes that all dissipated power must
be shed by the heat sink. Depending on the user-
defined application environment, a more accurate
model, including heat transfer from the sides and bot-
tom of the module, can be used. This equation pro-
vides a conservative estimate for such instances.
Solder, Cleaning, and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical testing. The result
of inadequate circuit-board cleaning and drying can
affect both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning, and dry-
ing procedures, refer to the
Board-Mounted Power
Modules Soldering and Cleaning
Application Note
(AP97-021EPS).
EMC Considerations
For assistance with designing for EMC compliance,
please refer to the FLTR100V10 data sheet
(DS98-152EPS).
Layout Considerations
Copper paths must not be routed beneath the power
module standoffs. For additional layout guidelines, refer
to the FLTR100V10 data sheet (DS98-152EPS).
θca
T
C TA()
P
D
------------------------
=
θca
85 40()
42
------------------------
=
θca 1.07 °C/W=
PD
TC TS TA
θcs θsa
θsa
T
C TA()
P
D
-------------------------
θcs=
18 Tyco Electronics Corp..
Data Sheet
July 2002
dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W
FW250F1 and FW300F1 Power Modules:
Outline Diagram
Dimensions are in millimeters and (inches).
Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.),
x.xx mm ± 0.25 mm (x.xxx in. ± 0.010 in.)
8-1650 (C)
* Side label includes Tyco name, product designation, safety agency markings, input/output voltage and current ratings, and bar code.
CASE
SYNC IN
ON/OFF
V
IÐ
V
I+
2.54 (0.100) TYP
V
OÐ
VO+
SYNC OUT
SENSEÐ
SENSE+
TRIM
PARALLEL
CURRENT MON
PWRGOOD
5.1 (0.20)
50.8
(2.00)
30.48
(1.200)
22.86
(0.900)
12.7
(0.50)
5.08
(0.200)
10.16
(0.400)
15.24
(0.600)
20.32
(0.800)
25.40
(1.000)
30.48
(1.200)
35.56
(1.400)
66.04 ( 2.600)
MOUNTINGINSERTS
M3x 0.5 THROUGH,
4PLACES
5.1 (0.20)
2.54 (0.100) TYP
106.68 (4.200)
7.62
(0.300)
17.78
(0.700)
12.70
(0.500)
5.1 (0.20) MIN
1.57 ± 0.05 (0.062 ± 0.002) DIA
SOLDER-PLATED BRASS,
11 PLACES,
(VOUTÐ, VOUT+, VINÐ, VIN+)
1.02 ± 0.05 (0.040 ± 0.002) DIA
SOLDER-PLATED BRASS,
9PLACES
SIDE LABEL*
13.5
(0.53)
116.8 (4.60)
61.0
(2.40)
Top View
Side View
Bottom View

FW250F1

Mfr. #:
Manufacturer:
Description:
DC DC CONVERTER 3.3V 165W
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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