1. General description
The SC18IS600 is designed to serve as an interface between the standard SPI of a host
(microcontroller, microprocessor, chip set, etc.) and the serial I
2
C-bus. This allows the
host to communicate directly with other I
2
C-bus devices. The SC18IS600 can operate as
an I
2
C-bus master-transmitter or master-receiver. The SC18IS600 controls all the I
2
C-bus
specific sequences, protocol, arbitration and timing.
2. Features and benefits
SPI slave interface
SPI Mode 3
Single master I
2
C-bus controller
Four General Purpose Input/Output (GPIO) pins
Two quasi-bidirectional I/O pins
5 V tolerant I/O pins
High-speed SPI: Up to 1.2 Mbit/s
High-speed I
2
C-bus: 400 kbit/s
96-byte transmit buffer
96-byte receive buffer
2.4 V to 3.6 V operation
Power-down mode with WAKEUP
pin
Internal oscillator
Active LOW interrupt output
Available in very small TSSOP16 and HVQFN24 packages
SC18IS600
SPI to I
2
C-bus interface
Rev. 7.1 — 20 November 2017 Product data sheet
SC18IS600 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2017. All rights reserved.
Product data sheet Rev. 7.1 — 20 November 2017 2 of 30
NXP Semiconductors
SC18IS600
SPI to I
2
C-bus interface
3. Ordering information
3.1 Ordering options
[1] Discontinued 201706009DN with Last Time Buy 12/7/2018 and Last Time Ship 6/6/2019.
[2] NXP plans to supply the /S8 device which is identical to the discontinued device for a minimum of 7 years with an expected
discontinuation in the 2024-2025 timeframe, but in the meantime, Failure Analysis for /S8 devices will consist of Automated Test
Equipment (ATE) and electrical overstress verification along with package and wire bond validation only. Detailed device failure analysis
will not be available; refer to CIN 201708035I
.
[3] The “,128” packing code for tape and reel with pin 1 in Q2 is now “HP”.
Table 1. Ordering information
Type number Topside
marking
Package
Name Description Version
SC18IS600IPW 18IS600 TSSOP16 plastic thin shrink small outline package; 16 leads;
body width 4.4 mm
SOT403-1
SC18IS600IPW/S8 18IS600 TSSOP16 plastic thin shrink small outline package; 16 leads;
body width 4.4 mm
SOT403-1
SC18IS600IBS 600 HVQFN24 plastic thermal enhanced very thin quad flat package;
no leads; 24 terminals; body 4 4 0.85 mm
SOT616-3
Table 2. Ordering options
Type number Orderable part number Package Packing method Minimum
order
quantity
Temperature
SC18IS600IPW SC18IS600IPW,112
[1]
TSSOP16 STANDARD
MARKING * IC'S
TUBE - DSC BULK
PACK
2400 T
amb
= 40 C to +85 C
SC18IS600IPW,128
[1]
TSSOP16 REEL 13" Q2/T3
*STANDARD MARK
SMD
2500 T
amb
= 40 C to +85 C
SC18IS600IPW/S8 SC18IS600IPW/S8HP
[2][3]
TSSOP16 REEL 13" Q2/T3
*STANDARD MARK
SMD
2500 T
amb
= 40 C to +85 C
SC18IS600IBS SC18IS600IBS,128
[1]
HVQFN24 REEL 13" Q2/T3
*STANDARD MARK
SMD
1500 T
amb
= 40 C to +85 C
SC18IS600IBS,151
[1]
HVQFN24 STANDARD
MARKING * TRAY
PACK, BAKEABLE,
SINGLE
490 T
amb
= 40 C to +85 C
SC18IS600IBS,157
[1]
HVQFN24 STANDARD
MARKING * TRAY
PACK, BAKEABLE,
MULTIPLE
2450 T
amb
= 40 C to +85 C
SC18IS600 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2017. All rights reserved.
Product data sheet Rev. 7.1 — 20 November 2017 3 of 30
NXP Semiconductors
SC18IS600
SPI to I
2
C-bus interface
4. Block diagram
Fig 1. Block diagram of SC18IS600
SC18IS600
RESET
002aab712
CONTROL
LOGIC
INTERCONNECT BUS LINES
AND
CONTROL SIGNALS
MOSI
SPI
SCLK
CS
MISO
INTERRUPT
CONTROL
LOGIC
INT
OSCILLATOR
BUFFER
I
2
C-BUS
CONTROLLER
GENERAL
PURPOSE
I/Os
GPIO0
SDA
SCL
GPIO1
GPIO2
GPIO3
IO5
ON-CHIP
RC
OSCILLATOR
IO4/WAKEUP

SC18IS600IPW/S8HP

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
I/O Controller Interface IC SPI to I2C-bus Interface
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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