Si550
Rev. 1.1 7
Table 7. CLK± Output Phase Noise (Typical)
Offset Frequency 74.25 MHz
90 ppm/V
LVPECL
155.52 MHz
45 ppm/V
LVPECL
491.52 MHz
45 ppm/V
LVPECL
622.08 MHz
135 ppm/V
LVPECL
Units
100 Hz
1kHz
10 kHz
100 kHz
1MHz
10 MHz
100 MHz
–87
–114
–132
–142
–148
–150
n/a
–86
–111
–128
–133
–144
–147
n/a
–75
–100
–116
–124
–135
–146
–147
–65
–90
–109
–121
–134
–146
–147
dBc/Hz
Table 8. Environmental Compliance
The Si550 meets the following qualification test requirements.
Parameter Conditions/Test Method
Mechanical Shock MIL-STD-883, Method 2002
Mechanical Vibration MIL-STD-883, Method 2007
Solderability MIL-STD-883, Method 203
Gross & Fine Leak MIL-STD-883, Method 1014
Resistance to Solder Heat MIL-STD-883, Method 2036
Moisture Sensitivity Level J-STD-020, MSL 1
Contact Pads J-STD-020, MSL 1
Table 9. Thermal Characteristics
(Typical values TA = 25 ºC, V
DD
=3.3V)
Parameter Symbol Test Condition Min Typ Max Unit
Thermal Resistance Junction to Ambient
JA
Still Air — 84.6 — °C/W
Thermal Resistance Junction to Case
JC
Still Air — 38.8 — °C/W
Ambient Temperature T
A
–40 — 85 °C
Junction Temperature T
J
——125°C
