BUK664R4-55C All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 03 — 21 December 2010 3 of 16
NXP Semiconductors
BUK664R4-55C
N-channel TrenchMOS intermediate level FET
4. Limiting values
[1] -16 V accumulated duration not to exceed 168 hrs.
[2] Accumulated pulse duration not to exceed 5 mins.
[3] Continuous current is limited by package.
[4] Single-pulse avalanche rating limited by maximum junction temperature of 175 °C.
[5] Repetitive avalanche rating limited by an average junction temperature of 170 °C.
[6] Refer to application note AN10273 for further information.
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
DS
drain-source voltage T
j
25 °C; T
j
175 °C - 55 V
V
GS
gate-source voltage DC
[1]
-16 16 V
pulsed
[2]
-20 20 V
I
D
drain current T
mb
=2C; V
GS
=10V; see Figure 1
[3]
- 100 A
T
mb
= 100 °C; V
GS
=10V; see Figure 1 -97A
I
DM
peak drain current T
mb
= 25 °C; pulsed; t
p
10 µs;
see Figure 3
- 550 A
P
tot
total power dissipation T
mb
=2C; see Figure 2 - 204 W
T
stg
storage temperature -55 175 °C
T
j
junction temperature -55 175 °C
Source-drain diode
I
S
source current T
mb
=2C
[3]
- 100 A
I
SM
peak source current pulsed; t
p
10 µs; T
mb
= 25 °C - 550 A
Avalanche ruggedness
E
DS(AL)S
non-repetitive drain-source
avalanche energy
I
D
= 100 A; V
sup
55 V; R
GS
=50;
V
GS
=10V; T
j(init)
=2C
- 263 mJ
E
DS(AL)R
repetitive drain-source
avalanche energy
[4][5][6]
--J
BUK664R4-55C All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 03 — 21 December 2010 4 of 16
NXP Semiconductors
BUK664R4-55C
N-channel TrenchMOS intermediate level FET
Fig 1. Continuous drain current as a function of
mounting base temperature
Fig 2. Normalized total power dissipation as a
function of mounting base temperature
T
mb
= 25 °C; I
DM
is a single pulse
Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage
003aae850
0
50
100
150
200
0 50 100 150 200
T
mb
(
°
C)
I
D
(A)
(1)
T
mb
(°C)
0 20015050 100
03aa16
40
80
120
P
der
(%)
0
003aae707
10
-1
1
10
10
2
10
3
10
4
10
-1
1 10 10
2
V
DS
(V)
I
D
(A)
Limit R
DSon
= V
DS
/ I
D
DC
100
μ
s
10 ms
t
p
= 10
μ
s
100 ms
1 ms
BUK664R4-55C All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 03 — 21 December 2010 5 of 16
NXP Semiconductors
BUK664R4-55C
N-channel TrenchMOS intermediate level FET
5. Thermal characteristics
Table 5. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-mb)
thermal resistance from junction to
mounting base
see Figure 4 --0.74K/W
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration
single shot
0.2
0.1
0.05
0.02
10
3
10
2
10
1
1
10
5
10
4
10
3
10
2
10
1
1
t
p
(s)
Z
th(j-mb)
(K/W)
δ = 0.5
003aae531
t
p
t
p
T
P
t
T
δ =
10
6

BUK664R4-55C,118

Mfr. #:
Manufacturer:
Nexperia
Description:
MOSFET N-CHAN 55V 100A
Lifecycle:
New from this manufacturer.
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