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VND810

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27
VND810 Application information
19/27
3.5 Maximum demagnetization energy (V
CC
= 13.5V)
Figure 26. Maximum turn-off current versus load inductance
Note: Values are generated with R
L
= 0Ω.
In case of repetitive pulses, T
jstart
(at beginning of each demagnetization) of every pulse
must not exceed the temperature specified above for curves B and C.
V
IN
, I
L
t
Demagnetization
Demagnetization
Demagnetization
A = single pulse at T
Jstart
= 150ºC
B= repetitive pulse at T
Jstart
= 100ºC
C= repetitive pulse at T
Jstart
= 125ºC
1
10
0,1 1 10 100
L(mH)
I
LMAX (A)
A
B
C
Obsolete Product(s) - Obsolete Product(s)
Package and PCB thermal data VND810
20/27
4 Package and PCB thermal data
4.1 SO-16 thermal data
Figure 27. SO-16 PC board
Note: Layout condition of R
th
and Z
th
measurements (PCB FR4 area = 58mm x 58mm, PCB
thickness = 1.6mm, Cu thickness = 35µm, Copper areas: 0.26 cm
2
, 4cm
2
).
Figure 28. R
thj-amb
Vs PCB copper area in open box free air condition
40
45
50
55
60
65
70
75
80
85
012345
PCB Cu heatsink area (cm^2)
RTH j-am b
(°C /W)
Obsolete Product(s) - Obsolete Product(s)
VND810 Package and PCB thermal data
21/27
Figure 29. Thermal impedance junction ambient single pulse
Equation 1
: pulse calculation formula
Figure 30. Thermal fitting model of a quad channel HSD in SO-16
0.01
0.1
1
10
100
1000
0.0001 0.001 0.01 0.1 1 10 100 1000
Time (s)
ZT H (°C /W)
0.26 cm
2
4 cm
2
Z
THδ
R
TH
δ Z
THtp
1 δ–()+⋅=
where
δ t
p
T⁄=
T_amb
Pd1
C1
R4
C3 C4
R3R1 R6R5R2
C5 C6C2
Pd2
R2
C1 C2
R1
Tj_1
Tj_2
Obsolete Product(s) - Obsolete Product(s)
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27

VND810

Mfr. #:
Buy VND810
Manufacturer:
STMicroelectronics
Description:
IC DRVR HISIDE 2CH 16-SOIC
Lifecycle:
New from this manufacturer.
Delivery:
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