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VND810

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27
Package and PCB thermal data VND810
22/27
Table 14. Thermal parameters
Area / island (cm
2
) Footprint 6
R1 (°C/W) 0.35
R2 (°C/W) 1.8
R3 (°C/W) 4.5
R4 (°C/W) 10
R5 (°C/W) 16
R6 (°C/W) 48 25
C1 (W.s/°C) 0.0001
C2 (W.s/°C) 7E-04
C3 (W.s/°C) 6E-03
C4 (W.s/°C) 0.2
C5 (W.s/°C) 0.7
C6 (W.s/°C) 2 4
Obsolete Product(s) - Obsolete Product(s)
VND810 Package and packing information
23/27
5 Package and packing information
5.1 ECOPACK
®
packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
Figure 31. SO-16 package dimensions
Obsolete Product(s) - Obsolete Product(s)
Package and packing information VND810
24/27
Table 15. SO-16 mechanical data
DIM.
mm.
Min. Typ. Max.
A 1.75
a1 0.1 0.2
a2 1.65
b 0.35 0.46
b1 0.19 0.25
C0.5
c1 45° (typ.)
D9.8 10
E5.8 6.2
e1.27
e3 8.89
F3.8 4.0
G4.6 5.3
L 0.5 1.27
M 0.62
S 8° (max.)
Obsolete Product(s) - Obsolete Product(s)
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27

VND810

Mfr. #:
Buy VND810
Manufacturer:
STMicroelectronics
Description:
IC DRVR HISIDE 2CH 16-SOIC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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