NCP1602
www.onsemi.com
22
V
REF,LLINE
V
REF,BONOK
CSint VSNS
1.801 V if LLINE=1
1.392 V otherwise
0.819 V if BONOK=1
0.737 V otherwise
CSZCD
BUFFER
DEMAG
&
LINE SENSE
DRV
Figure 37. Input Line Sense Monitoring
Two−Level Boost Follower Line Level Dependent
The Two−Level Boost Follower feature is disabled by
default, but it is available on product versions [**B] &
[**D].
When the feature is enabled, the controller will regulate its
output voltage V
out
to a value dependent on the sensed line
level. The regulated ouput voltage V
out
uses a reference
voltage that has two possible values based on mains voltage.
For LLINE = 0 V
REF
= 2.5 V and for LLINE = 1
V
REF
=V
REF2
= 1.6 V so the output voltage will have for
example a 390 V value for Highline (LLINE = 0) and a
250 V value for Lowline (LLINE = 1).
In order for the Two−Level Boost Follower Line Level
Dependent feature to work OK with the the Brown−in
feature at startup, the controller will always start with
V
REF
= 2.5 V and then, once Brown−in validated and
switching started, the sensed line level will determine the
V
REF
value to be used and hence the V
out
value.
Thermal Shut−Down (TSD)
An internal thermal circuitry disables the circuit gate drive
and keeps the power switch off when the junction
temperature exceeds 150°C. The output stage is then
enabled once the temperature drops below about 100°C
(50°C hysteresis).
The temperature shutdown remains active as long as the
circuit is not reset, that is, as long as V
CC
is higher than a reset
threshold.
Output Drive Section
The output stage contains a totem pole optimized to
minimize the cross conduction current during high
frequency operation. Its high current capability (−500 mA /
+800 mA) allows it to effectively drive high gate charge
power MOSFET.
Second Over−Voltage Protection
On top of the existing overvoltage protection, a second
and redundant overvoltage protection named OVP2 has
been added. This overvoltage protection, senses, during
t
DEMAG
the value of V
out
, thru the R
CS1
, R
CS2
divider bridge
connected to the pin CS and compares it to an OVP2 voltage
reference V
REF,OVP2
. Because it is not possible to adjust the
V
REF,OVP2
reference to R
fb1
& Rf
b2
that programs the V
out
value, it has been decided to set V
REF,OVP2
and R
CS1
, R
CS2
in order to get OVP2 triggering for Vout voltages much
higher than for OVP condition (e.g. OVP2 goes high when
Vout goes higher than 438 V)
For V
out
= 438 V for OVP2 and given a K
CS
value equal
to 1/138 (K
CS
=R
CS2
/(R
CS1
+R
CS2
), this gives
V
REF,OVP2
= 3.175 V for the threshold voltage to which is
compared to the CS voltage during t
off
. When V
CS
goes
above V
REF,OVP2
threshold of the OVP2 comparator
(100 mV hysteresis), and after a 1−ms leading edge blanking
time, the OVP2 flag is latched and will stop the switching by
resetting the main PWM latch. The OVP2 latch is reset each
800 ms.
Two−level Boost Follower
In order to minimize the voltage between V
in
and V
out
for
avoiding the degradation of power efficiency, the internal
voltage references can be managed versus the line voltage
level condition (LLINE = 0 for High Line or LLINE = 1 for
Low Line).
If the “Two−level Boost Follower” feature is activated (by
default it is not activated), this will result in a regulated V
out
voltage for Low Line condition being 0.64 times the
regulated V
out
voltage for High Line condition.
OFF Mode
As previously mentioned, the circuit turns off when one
of the following faults is detected:
Incorrect feeding of the circuit (“UVLO” high when
V
CC
<V
CC(off)
, V
CC(off)
equating 9 V typically).
Excessive die temperature detected by the thermal
shutdown
Under−Voltage Protection
Brown−Out Fault and STATICOVP (see Figure 2)
NCP1602
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23
Generally speaking, the circuit turns off when the
conditions are not proper for desired operation. In this mode,
the controller stops operating. The major part of the circuit
sleeps and its consumption is minimized.
More specifically, when the circuit is in OFF state:
The drive output is kept low
All the blocks are off except:
The UVLO circuitry that keeps monitoring the V
CC
voltage and controlling the start−up current source
accordingly.
The TSD (thermal shutdown)
The Under−Voltage Protection (“UVP”)
The brown−out circuitry
V
ctrl
is grounded so that when the fault is removed, the
device starts−up under the soft start mode (version XB).
The internal “PFCOK” signal is grounded.
The output of the “V
ton
processing block” is grounded
Failure Detection
When manufacturing a power supply, elements can be
accidentally shorted or improperly soldered. Such failures
can also happen to occur later on because of the components
fatigue or excessive stress, soldering defaults or external
interactions. In particular, adjacent pins of controllers can be
shorted; a pin can be grounded or badly connected. Such
open/short situations are generally required not to cause fire,
smoke nor big noise. NCP1602 integrate functions that ease
meet this requirement. Among them, we can list:
Floating feedback pin
A special internal circuitry detects the floating feedback
pin and stops the operation of the IC.
Fault of the GND connection
If the GND pin is not connected, internal circuitry
detects it and if such a fault is detected for 200 ms, the
circuit stops operating.
Detection the CS/ZCD pin improper connection
If the CS/ZCD pin is floating or shorted to GND it is
detected by internal circuitry and the circuit stops
operating.
Boost or bypass diode short
The controller addresses the short situations of the
boost and bypass diodes (a bypass diode is generally
placed between the input and output high−voltage rails
to divert this inrush current). Practically, the overstress
protection is implemented to detect such conditions and
forces a low duty−cycle operation until the fault is gone.
Refer to application note ANDxxxx for more details.
NCP1602
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24
PACKAGE DIMENSIONS
TSOP−6
CASE 318G−02
ISSUE V
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
STYLE 13:
PIN 1. GATE 1
2. SOURCE 2
3. GATE 2
4. DRAIN 2
5. SOURCE 1
6. DRAIN 1
RECOMMENDED
0.60
6X
3.20
0.95
6X
0.95
PITCH
DIMENSIONS: MILLIMETERS
23
456
D
1
e
b
E1
A1
A
0.05
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM
LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D
AND E1 ARE DETERMINED AT DATUM H.
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.
c
DIM
A
MIN NOM MAX
MILLIMETERS
0.90 1.00 1.10
A1 0.01 0.06 0.10
b 0.25 0.38 0.50
c 0.10 0.18 0.26
D 2.90 3.00 3.10
E 2.50 2.75 3.00
e 0.85 0.95 1.05
L 0.20 0.40 0.60
0.25 BSC
L2
0° 10°
1.30 1.50 1.70
E1
E
NOTE 5
L
C
M
H
L2
SEATING
PLANE
GAUGE
PLANE
DETAIL Z
DETAIL Z
M
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NCP1602BEASNT1G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Power Factor Correction - PFC ENHANCED HIGH EFFICIENCY
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