MGA-82563-TR2G

4
MGA-82563 Typical Scattering Parameters
[1]
, T
C
= 25°C, Z
O
= 50 Ω, V
d
= 3 V
Freq. S
11
S S S K
GHz Mag Ang dB Mag Ang dB Mag Ang Mag Ang Factor
0.1 0.48 -39 15.71 6.10 164 -23 0.070 27 0.16 -99 1.02
0.2 0.35 -35 14.81 5.50 165 -22 0.076 14 0.12 -134 1.20
0.5 0.29 -37 14.34 5.21 159 -22 0.079 6 0.11 177 1.29
1.0 0.29 -57 13.95 4.98 144 -22 0.080 3 0.11 156 1.33
1.5 0.29 -78 13.50 4.73 128 -22 0.082 2 0.10 142 1.37
2.0 0.29 -99 12.99 4.46 114 -22 0.085 1 0.10 131 1.41
2.5 0.29 -118 12.45 4.19 99 -21 0.089 -1 0.10 124 1.44
3.0 0.28 -138 11.84 3.91 86 -21 0.093 -3 0.11 118 1.48
3.5 0.28 -158 11.24 3.65 74 -21 0.098 -6 0.12 111 1.51
4.0 0.29 -177 10.67 3.42 61 -20 0.103 -9 0.13 106 1.52
4.5 0.30 166 10.11 3.20 50 -20 0.107 -13 0.15 100 1.53
5.0 0.32 151 9.58 3.01 38 -19 0.112 -18 0.16 94 1.54
5.5 0.34 136 9.07 2.84 27 -19 0.117 -23 0.18 87 1.55
6.0 0.36 123 8.57 2.68 16 -19 0.121 -29 0.19 82 1.54
6.5 0.38 110 8.06 2.53 5 -19 0.125 -35 0.22 74 1.55
7.0 0.40 97 7.51 2.37 -5 -18 0.126 -41 0.24 66 1.59
MGA-82563 Typical Noise Parameters
[1]
T
C
= 25°C, Z
O
= 50 Ω, V
d
= 3 V
Frequency NF
O
*
opt
R
n
/ 50 Ω
GHz dB Mag. Ang.
0.5 2.10 0.15 25 1.20
1.0 2.10 0.15 45 0.60
1.5 2.10 0.14 65 0.29
2.0 2.12 0.15 75 0.27
2.5 2.12 0.15 94 0.25
3.0 2.15 0.144 113 0.23
3.5 2.16 0.14 134 0.21
4.0 2.16 0.15 155 0.19
4.5 2.19 0.17 177 0.18
5.0 2.18 0.20 -166 0.18
5.5 2.19 0.22 -152 0.18
6.0 2.23 0.25 -138 0.19
6.5 2.28 0.27 -125 0.23
7.0 2.39 0.29 -111 0.28
Note:
1. Reference plane per Figure 11 in Applications Information section.
5
RF
INPUT
22 nH
RFC
100 pF
100 pF
V
d
RF
OUTPUT
82
MGA-82563 Applications Information
Introduction
This medium power GaAs MMIC amplier was developed
for commercial wireless applications from 100 MHz to 6
GHz. The MGA-82563 runs on only 3 volts and typically
requires only 84 mA to deliver over 17 dBm of output
power at 1 dB gain compression.
The 17.3 dBm output power (P
1 dB
) makes the MGA-
82563 extremely useful for pre-driver and driver stages
in transmit cascades or for nal output stages in lower
power systems. For transmitter gain stage applications
that require even higher output power, the MGA-82563
can provide 100 mW (20 dBm) of saturated output pow-
er with a power added eciency approaching 50%. The
low cost of the MGA-82563 makes it feasible to power
combine two (or more) devices for even higher output
power ampliers.
The MGA-82563 oers an excellent combination of high
linearity (+31 dBm output IP
3
) and very low noise gure
(2.2 dB) for applications requiring a very high dynamic
range.
The MGA-82563 uses resistive feedback to simultane-
ously achieve at gain over a wide bandwidth and to
match the input and output impedances to 50Ω. The
MGA-82563 is also unconditionally stable (K>1) over its
entire frequency range, making it both very easy to use
and yielding consistent performance in the manufacture
of high volume wireless products.
An innovative internal bias circuit regulates the devices
internal current to enable the MGA-82563 to operate
over a wide temperature range with a single, positive
power supply of 3 volts. The MGA-82563 will operate
with reduced power and gain with a bias supply as low
as 1.5 volts.
Test Circuit
The circuit shown in Figure 10 is used for 100% RF testing
of Gain and Noise Figure. The test circuit is merely a 50Ω in-
put/output PC board with a RFC at the output to apply DC
bias to the device under test. Tests in this circuit are used to
guarantee the NF
test
and G
test
parameters shown in the table
of Electrical Specications.
Figure 10. Test Circuit.
Phase Reference Planes
The positions of the reference planes used to specify the
S-Parameters and Noise Parameters for this device are
shown in Figure 11. As seen in the illustration, the refer-
ence planes are located at the point where the package
leads contact the test circuit.
TEST CIRCUIT
REFERENCE
PLANES
Figure 11. Phase Reference Planes.
Specications and Statistical Parameters
Several categories of parameters appear within this data
sheet. Parameters may be described with values that are
either minimum or maximum, “typical, or standard de-
viations.
The values for parameters are based on comprehensive
product characterization data, in which automated mea-
surements are made on of a minimum of 500 parts taken
from 3 non-consecutive process lots of semiconductor
wafers. The data derived from product characterization
tends to be normally distributed, e.g., ts the standard
“bell curve.
Parameters considered to be the most important to
system performance are bounded by minimum or maxi-
mum values. For the MGA-82563, these parameters are:
Gain (G
test
), Noise Figure (NF
test
), and Device Current (I
d
).
Each of these guaranteed parameters is 100% tested.
Values for most of the parameters in the table of Electri-
cal Specications that are described by typical data are
the mathematical mean (P), of the normal distribution
taken from the characterization data. For parameters
where measurements or mathematical averaging may
not be practical, such as the Noise and S-parameter ta-
bles or performance curves, the data represents a nomi-
nal part taken from the center of the characterization
distribution. Typical values are intended to be used as a
basis for electrical design.
To assist designers in optimizing not only the immediate
circuit using the MGA-82563, but to also optimize and
evaluate trade-os that aect a complete wireless sys-
tem, the standard deviation (V) is provided for many of
the Electrical Specications parameters (at 25°) in addi-
tion to the mean. The standard deviation is a measure of
the variability about the mean. It will be recalled that a
normal distribution is completely described by the mean
and standard deviation.
6
PCB Material
FR-4 or G-10 printed circuit board materials are a good
choice for most low cost wireless applications. Typical
board thickness is 0.020 to 0.031 inches. The width of the
50 Ω microstriplines on PC boards in this thickness range
is also very convenient for mounting chip components
such as the series inductor at the input or DC blocking
and bypass capacitors.
For higher frequencies or for noise gure critical appli-
cations, the additional cost of PTFE/glass dielectric ma-
terials may be warranted to minimize transmission line
loss at the ampliers input. A 0.5 inch length of 50
microstripline on FR-4, for example, has approximately
0.3 dB loss at 4 GHz. This loss will add directly to the
noise gure of the MGA-82563.
Biasing
The MGA-82563 is a voltage-biased device and is
designed to operate from a single, +3 volt power supply
with a typical current drain of 84 mA. The internal cur-
rent regulation circuit allows the amplier to be operat-
ed with voltages as low as +1.5 volts. Refer to the section
titled “Operation at Bias Voltages Other than 3 Volts for
information on performance and precau tions when us-
ing other voltages.
Typical Application Example
The printed circuit layout in Figure 14 can serve as a de-
sign guide. This layout is a microstripline design (solid
groundplane on the backside of the circuit board) with a
50 Ω input and output. The circuit is fabricated on 0.031-
inch thick FR-4 dielectric material. Plated through holes
(vias) are used to bring the ground to the top side of the
circuit where needed. Multiple vias are used to reduce
the inductance of the paths to ground.
Standard statistics tables or calculations provide the
probability of a parameter falling between any two
values, usually symmetrically located about the mean.
Referring to Figure 12 for example, the probability of a
parameter being between ±1V is 68.3%; between ±2V is
95.4%; and between ±3V is 99.7%.
68%
95%
99%
Parameter Value
Mean (μ)
(typical)
-3σ -2σ -1σ +1σ +2σ +3σ
82
50 Ω
50 Ω
RF Input
RF Output
and V
d
IN
OUT
+V
MGA-8-A
Figure 12. Normal Distribution.
RF Layout
The RF layout in Figure 13 is suggested as a starting point
for microstripline designs using the MGA-82563 ampli-
er. Adequate grounding is needed to obtain optimum
per formance and to maintain stability. All of the ground
pins of the MMIC should be connected to the RF ground-
plane on the backside of the PCB by means of plated
through holes (vias) that are placed near the package
terminals. As a minimum, one via should be located next
to each ground pin to ensure good RF grounding. It is a
good practice to use multiple vias to further minimize
ground path inductance.
Figure 13. RF Layout.
In addition to the RF considerations, the use of multiple
vias for grounding is important for the purpose of pro-
viding a lower resistance thermal path to the heatsink.
It is recommended that the PCB pads for the ground pins
not be connected together underneath the body of the
package. PCB traces hidden under the package cannot
be adequately inspected for SMT solder quality.
Figure 14. PCB Layout.

MGA-82563-TR2G

Mfr. #:
Manufacturer:
Broadcom / Avago
Description:
RF Amplifier 3 SV 13.2 dB
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet