ADA4062-2/ADA4062-4
Rev. B | Page 5 of 20
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 3.
Parameter Rating
Supply Voltage ±18 V
Input Voltage ±V
SY
Differential Input Voltage ±V
SY
Input Current ±10 mA
Output Short-Circuit Duration to GND Indefinite
Storage Temperature Range −65°C to +150°C
Operating Temperature Range −40°C to +125°C
Junction Temperature Range −65°C to +150°C
Lead Temperature (Soldering, 60 sec) 300°C
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages. It was
measured using a standard 4-layer board.
Table 4. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
8-Lead SOIC 120 45 °C/W
8-Lead MSOP 142 45 °C/W
10-Lead LFCSP 132 46 °C/W
14-Lead TSSOP 112 35 °C/W
16-Lead LFCSP 75 12 °C/W
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
POWER SEQUENCING
The supply voltages of the op amps must be established
simultaneously with, or before, any input signals are applied. If
this is not possible, the input current must be limited to 10 mA.
ESD CAUTION
