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BTA225B-800B,118

P1-P3P4-P6P7-P9P10-P12P13-P15
NXP Semiconductors
BTA225B-800B
3Q Hi-Com Triac
BTA225B-800B All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved
Product data sheet 6 August 2014 9 / 14
T
j
(°C)
-50 0 15010050
003aae176
0.8
1.2
1.6
0.4
V
GT
V
GT(25°C)
Fig. 11. Normalized gate trigger voltage as a function of
junction temperature
003aae175
T
j
(°C)
0 1601208040
10
2
10
10
3
dI
com
/dt
(A/ms)
1
Fig. 12. Critical rate of change of commutating current
as a function of junction temperature; typical
values
NXP Semiconductors
BTA225B-800B
3Q Hi-Com Triac
BTA225B-800B All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved
Product data sheet 6 August 2014 10 / 14
10. Package outline
References
Outline
version
European
projection
Issue date
IEC JEDEC JEITA
SOT404
sot404_po
06-03-16
13-02-25
Unit
mm
max
nom
min
4.5
4.1
1.40
1.27
1.45
1.05
0.64
0.46
11 1.6
1.2
A
Dimensions (mm are the original dimensions)
Plastic single-ended surface-mounted package (D2PAK); 3 leads (one lead cropped) SOT404
A
1
b
0.85
0.60
b
2
c D D
1
E e H
D
L
p
Q
2.54
15.8
14.8
2.6
2.2
10.3
9.7
2.9
2.1
0 5 mm
scale
e e
E
b
D
1
H
D
D
b
2
Q
L
p
c
A
1
A
1 3
2
mounting
base
Fig. 13. Package outline D2PAK (SOT404)
NXP Semiconductors
BTA225B-800B
3Q Hi-Com Triac
BTA225B-800B All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved
Product data sheet 6 August 2014 11 / 14
11. Soldering
msd057
solder lands
solder resist
occupied area
solder paste
10.50
7.40
7.50
1.50
1.70
10.60
1.20
1.30
1.55
5.08
10.85
0.30
2.15
8.35
2.25
4.60
0.20
3.00
4.85
7.95
8.15
8.075
8.275
5.40
1.50
Fig. 14. Reflow soldering footprint for D2PAK (SOT404)
P1-P3P4-P6P7-P9P10-P12P13-P15

BTA225B-800B,118

Mfr. #:
Buy BTA225B-800B,118
Manufacturer:
WeEn Semiconductors
Description:
Triacs 800V 25A
Lifecycle:
New from this manufacturer.
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