NXP Semiconductors
BTA225B-800B
3Q Hi-Com Triac
BTA225B-800B All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved
Product data sheet 6 August 2014 6 / 14
8. Thermal characteristics
Table 5. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
full cycle; Fig. 6 - - 1 K/WR
th(j-mb)
thermal resistance
from junction to
mounting base
half cycle; Fig. 6 - - 1.4 K/W
R
th(j-a)
thermal resistance
from junction to
ambient
printed circuit board (FR4) mounted - 55 - K/W
003aak972
10
-1
10
-2
1
10
Z
th(j-mb)
(K/W)
10
-3
t
p
(s)
10
-5
1 1010
-1
10
-2
10
-4
10
-3
(1)
(2)
t
p
P
t
(1) Unidirectional (half cycle)
(2) Bidirectional (full cycle)
Fig. 6. Transient thermal impedance from junction to mounting base as a function of pulse duration