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AT17LV512-10CI

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P29
25
2321H–CNFG–03/06
AT17LV65/128/256/512/010/002/040
23.5 20S2 – SOIC
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
20S2, 20-lead, 0.300" Wide Body, Plastic Gull
Wing Small Outline Package (SOIC)
1/9/02
20S2
A
L
A1
End View
Side View
Top View
H
E
b
N
1
e
A
D
C
COMMON DIMENSIONS
(Unit of Measure = inches)
SYMBOL
MIN
NOM
MAX
NOTE
Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-013, Variation AC for additional information.
2. Dimension "D" does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15 mm (0.006") per side.
3. Dimension "E" does not include inter-lead Flash or protrusion. Inter-lead Flash and protrusions shall not exceed 0.25 mm
(0.010") per side.
4. "L" is the length of the terminal for soldering to a substrate.
5. The lead width "b", as measured 0.36 mm (0.014") or greater above the seating plane, shall not exceed a maximum value of 0.61 mm
(0.024") per side.
A 0.0926 0.1043
A1 0.0040 0.0118
b 0.0130 0.0200 4
C 0.0091 0.0125
D 0.4961 0.5118 1
E 0.2914 0.2992 2
H 0.3940 0.4190
L 0.0160 0.050 3
e 0.050 BSC
26
2321H–CNFG–03/06
AT17LV65/128/256/512/010/002/040
23.6 44A – TQFP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
44A, 44-lead, 10 x 10 mm Body Size, 1.0 mm Body Thickness,
0.8 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP)
B
44A
10/5/2001
PIN 1 IDENTIFIER
0˚~7˚
PIN 1
L
C
A1
A2 A
D1
D
e
E1 E
B
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
Notes: 1. This package conforms to JEDEC reference MS-026, Variation ACB.
2. Dimensions D1 and E1 do not include mold protrusion. Allowable
protrusion is 0.25 mm per side. Dimensions D1 and E1 are maximum
plastic body size dimensions including mold mismatch.
3. Lead coplanarity is 0.10 mm maximum.
A – – 1.20
A1 0.05 – 0.15
A2 0.95 1.00 1.05
D 11.75 12.00 12.25
D1 9.90 10.00 10.10 Note 2
E 11.75 12.00 12.25
E1 9.90 10.00 10.10 Note 2
B 0.30 – 0.45
C 0.09 – 0.20
L 0.45 – 0.75
e 0.80 TYP
27
2321H–CNFG–03/06
AT17LV65/128/256/512/010/002/040
23.7 44J – PLCC
Notes: 1. This package conforms to JEDEC reference MS-018, Variation AC.
2. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is .010"(0.254 mm) per side. Dimension D1
and E1 include mold mismatch and are measured at the extreme
material condition at the upper or lower parting line.
3. Lead coplanarity is 0.004" (0.102 mm) maximum.
A 4.191 – 4.572
A1 2.286 – 3.048
A2 0.508 – –
D 17.399 – 17.653
D1 16.510 – 16.662 Note 2
E 17.399 – 17.653
E1 16.510 – 16.662 Note 2
D2/E2 14.986 – 16.002
B 0.660 – 0.813
B1 0.330 – 0.533
e 1.270 TYP
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
1.14(0.045) X 45˚
PIN NO. 1
IDENTIFIER
1.14(0.045) X 45˚
0.51(0.020)MAX
0.318(0.0125)
0.191(0.0075)
A2
45˚ MAX (3X)
A
A1
B1
D2/E2
B
e
E1 E
D1
D
44J, 44-lead, Plastic J-leaded Chip Carrier (PLCC)
B
44J
10/04/01
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P29

AT17LV512-10CI

Mfr. #:
Buy AT17LV512-10CI
Manufacturer:
Microchip Technology / Atmel
Description:
FPGA - Configuration Memory ASICS
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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