13
LTC1266
LTC1266-3.3/LTC1266-5
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Figure 6. Low-Battery Comparator
+
1.25V
REFERENCE
LB
OUT
V
IN
R2
R1
LTC1266
1266 F06
The divided down voltage at the “–” input to the comparator
is compared to an internal 1.25V reference. This reference
is separate from the 1.265V reference used by the voltage
comparator and current comparator for regulation and is
not disabled by the shutdown pin, therefore the low-battery
detection is operational even when the rest of the chip is
shut down. The comparator is functional down to an input
voltage of 2.5V. Thus, the output will provide a valid state
even when the rest of the chip does not have sufficient
voltage to operate. For best performance, the value of the
pull-up resistor should be high enough that the output is
pulled down to ground when sinking 200µA or less.
Suppressing Burst Mode Operation
Normally, enabling Burst Mode operation is desired due to
its superior efficiency at low load currents (see Figure 7).
However, in certain applications it may be desirable to
inhibit this feature. Some reasons for doing so are:
1. To eliminate audible noise from certain types of induc-
tors at light loads.
Figure 7. Effect of Disabling Burst Mode Operation on Efficiency
2. If the load is never expected to drop low enough to
benefit from the efficiency advantages of Burst Mode
operation, the output capacitor ESR and minimum capaci-
tance requirements (which may falsely trigger Burst Mode
operation if not met) can be relaxed if Burst Mode opera-
tion is disabled.
3. If an auxiliary winding is used. Disabling Burst Mode
operation guarantees switching independent of the load
on the primary. This allows power to be taken from the
auxiliary winding independently.
4. Tighter load regulation (< 1%).
Burst Mode operation is disabled by applying a CMOS
logic high voltage (> 2.1V) to Pin 4. When it is disabled, the
voltage comparator limit is raised high enough so that it no
longer is involved in regulation; however it is still active
and is useful as a voltage clamp to keep the output from
overshooting.
Note that since the inductor current must reverse to
regulate the output at zero load when Burst Mode opera-
tion is disabled, the minimum inductance (L
MIN
) specified
during Inductor Core Selection is no longer applicable.
Checking Transient Response
The regulator loop response can be checked by looking at
the load transient response. Switching regulators take
several cycles to respond to a step in DC (resistive) load
current. When a load step occurs, V
OUT
shifts by an
amount equal to I
LOAD
(ESR), where ESR is the effective
series resistance of C
OUT
. I
LOAD
also begins to charge or
LOAD CURRENT
0
V
IN
–V
0UT
(mV) AT DROPOUT
300
400
500
600
4
1266 F05
200
100
0
1
2
3
5
TOPSIDE
N-CHANNEL WITH
CHARGE PUMP
TOPSIDE N-CHANNEL
WITH POWER V
IN
= 12V
TOPSIDE
P-CHANNEL
V
OUT
= 3.3V
Figure 5. Comparison of Dropout Performance
14
LTC1266
LTC1266 -3.3/LTC1266 -5
15nC. This results in I
GATECHG
= 6mA in 200kHz continu-
ous operation for a 2% to 3% typical mid-current loss with
V
IN
= 5V.
Note that the gate charge loss increases directly with
both input voltage and operating frequency. This is the
principal reason why the highest efficiency circuits oper-
ate at moderate frequencies. Furthermore, it argues against
using larger MOSFETs than necessary to control I
2
R
losses, since overkill can cost efficiency as well as money!
3. I
2
R losses are easily predicted from the DC resistances
of the MOSFET, inductor and current shunt. In continuous
mode the average output current flows through L and
R
SENSE
, but is “chopped” between the topside and bot-
tom-side MOSFETs. If the two MOSFETs have approxi-
mately the same R
DS(ON)
, then the resistance of one
MOSFET can simply be summed with the resistances of L
and R
SENSE
to obtain I
2
R losses. For example, if each
R
DS(ON)
= 0.05, R
L
= 0.05 and R
SENSE
= 0.02, then
the total resistance is 0.12. This results in losses ranging
from 3.5% to 15% as the output current increases from 1A
to 5A. I
2
R losses cause the efficiency to roll off at high
output currents.
Figure 8 shows how the efficiency losses in a typical
LTC1266 series regulator end up being apportioned. The
gate charge loss is responsible for the majority of the
efficiency lost in the mid-current region. If Burst Mode
operation was not employed at low currents, the gate
charge loss alone would cause efficiency to drop to
unacceptable levels (see Figure 7). With Burst Mode
discharge C
OUT
until the regulator loop adapts to the
current change and returns V
OUT
to its steady-state value.
During this recovery time V
OUT
can be monitored for
overshoot or ringing which would indicate a stability
problem. The Pin 7 external components shown in the
Figure 1 circuit will prove adequate compensation for
most applications.
Efficiency Considerations
The percent efficiency of a switching regulator is equal to
the output power divided by the input power times 100%.
It is often useful to analyze individual losses to determine
what is limiting the efficiency and which change would
produce the most improvement. Percent efficiency can be
expressed as:
% Efficiency = 100% – (L1 + L2 + L3 + ...)
where L1, L2, etc., are the individual losses as a percent-
age of input power. (For high efficiency circuits, only small
errors are incurred by expressing losses as a percentage
of output power).
Although all dissipative elements in the circuit produce
losses, three main sources usually account for most of the
losses in LTC1266 series circuits: 1) LTC1266 DC bias
current, 2) MOSFET gate charge current and 3) I
2
R losses.
1. The DC supply current is the current which flows into
V
IN
(Pin 2). For V
IN
= 10V the LTC1266 DC supply current
is 170µA for no load, and increases proportionally with
load up to a constant 2.1mA after the LTC1266 series has
entered continuous mode. Because the DC bias current is
drawn from V
IN
, the resulting loss increases with input
voltage. For V
IN
= 5V the DC bias losses are generally less
than 1% for load currents over 30mA. However, at very
low load currents the DC bias current accounts for nearly
all of the loss.
2. MOSFET gate charge current results from switching the
gate capacitance of the power MOSFETs. Each time a
MOSFET gate is switched from low to high to low again, a
packet of charge dQ moves from Power V
IN
to ground. The
resulting dQ/dt is a current flowing into Power V
IN
(Pin 5)
which is typically much larger than the DC supply current.
In continuous mode, I
GATECHG
= f (Q
N
+ Q
P
). The typical
gate charge for a 0.05 N-channel power MOSFET is
Figure 8. Efficiency Loss
I
OUT
(A)
0.01
EFFICIENCY/LOSS (%)
90
95
1
1266 F08
85
80
0.03
0.1
0.3
5
100
GATE CHARGE
LTC1266 I
Q
I
2
R
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15
LTC1266
LTC1266-3.3/LTC1266-5
operation, the DC supply current represents the lone (and
unavoidable) loss component which continues to become
a higher percentage as output current is reduced. As
expected the I
2
R losses dominate at high load currents.
Other losses including C
IN
and C
OUT
ESR dissipative
losses, MOSFET switching losses, Schottky conduction
losses during deadtime and inductor core losses, gener-
ally account for less than 2% total additional loss.
Design Example
As a design example, assume V
IN
= 5V (nominal),
V
OUT
= 3.3V, I
MAX
= 5A and f = 200kHz; R
SENSE
, C
T
and L
can immediately be calculated:
R
SENSE
= 100mV/5 = 0.02
t
OFF
= (1/200kHz) • [1 – (3.3/5)] = 1.7µs
C
T
= 1.7µs/(1.3 • 10
4
) = 130pF
L
MIN
= 5.1 • 10
5
• 0.02 • 130pF • 3.3V = 5µH
Assume that the MOSFET dissipations are to be limited to
P
T
= P
B
= 2W.
If T
A
= 40°C and the thermal resistance of each MOSFET
is 50°C/W, then the junction temperatures will be 140°C
and δ
T
= δ
B
= 0.60. The required R
DS(ON)
for each MOSFET
can now be calculated:
TS R
DS(ON)
=
5(2)
3.3(5)
2
(1.60)
= 0.076
BS R
DS(ON)
=
5(2)
1.7(5)
2
(1.60)
= 0.147
The topside FET requirement can be met by an N-channel
Si9410DY which has an R
DS(ON)
of about 0.04 at
V
GS
= 5V. The bottom-side FET requirement is exceeded
by an Si9410DY. Note that the most stringent requirement
for the bottom-side MOSFET is with V
OUT
= 0 (i.e., short
circuit). During a continuous short circuit, the worst-case
dissipation rises to:
P
B
= I
SC(AVG)
2
• R
DS(ON)
• (1 + δ
B
)
With the 0.02 sense resistor, I
SC(AVG)
6A will result,
increasing the 0.04 bottom-side FET dissipation to 2.3W.
C
IN
will require an RMS current rating of at least 2.5A at
temperature and C
OUT
will require an ESR of 0.02 for
optimum efficiency.
Now allow V
IN
to drop to its minimum value. The minimum
V
IN
can be calculated from the maximum duty cycle and
voltage drop across the topside FET,
V
MIN
=
D
MAX
V
OUT
+ I
LOAD
• (R
DS(ON)
+ R
L
+ R
SENSE
)
= 4.0V
At this lower input voltage, the operating frequency de-
creases and the topside FET will be conducting most of the
time, causing the power dissipation to increase.
At dropout,
f
MIN
=
1
t
ON (MAX)
+ t
OFF
= 16kHz
P
T
= I
2
LOAD
• R
DS(ON)
• (1 + δ
T
) • D
MAX
This last step is necessary to assure that the power
dissipation and junction temperature of the topside FET
are not exceeded.
These last calculations assume that Power V
IN
is high
enough to keep the topside FET fully turned on at dropout,
as would be the case with the Figure 11circuit. If this isn’t
true (as with the Figure 1 circuit) the R
DS(ON)
will increase
which in turn increases V
MIN
and P
T
.
Adjustable Applications
When an output voltage other than 3.3V or 5V is required,
the LTC1266 adjustable version is used with an external
resistive divider from V
OUT
to V
FB
, Pin 10. The regulated
voltage is determined by:
V
OUT
= 1.265
)
)
1 +
R2
R1
To prevent stray pickup a 100pF capacitor is suggested
across R1 located close to the LTC1266.
For Figure 1 applications with V
OUT
below 2V, or when
R
SENSE
is moved to ground, the current sense comparator
inputs operate near ground. When the current comparator
is operated at less than 2V common mode, the off-time
increases approximately 40%, requiring the use of a
smaller timing capacitor C
T
.
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LTC1266CS-3.3#TRPBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators Syn Switching Reg Controller
Lifecycle:
New from this manufacturer.
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