ADF4212L Data Sheet
Rev. E | Page 6 of 28
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 4.
Parameter
1, 2
Rating
V
DD
1 to GND −0.3 V to +3.6 V
V
DD
1 to V
DD
2
−0.3 V to +0.3 V
V
P
1, V
P
2 to GND −0.3 V to +5.8 V
V
P
1, V
P
2 to V
DD
1, V
DD
2 −0.3 V to +5.8 V
Digital I/O Voltage to GND −0.3 V to DV
DD
+ 0.3 V
Analog I/O Voltage to GND −0.3 V to V
DD
+ 0.3 V
REF
IN
, RF
IN
, IF
IN
to GND
−0.3 V to V
DD
+ 0.3 V
Operating Temperature Range
Industrial (B Version) −40°C to +85°C
Storage Temperature Range 65°C to +150°C
Maximum Junction Temperature 150°C
TSSOP θ
JA
Thermal Impedance 150.4°C/W
LFCSP θ
JA
Thermal Impedance
(Paddle Soldered)
122°C/W
LFCSP θ
JA
Thermal Impedance
(Paddle Not Soldered)
216°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) 215°C
Infrared (15 sec) 220°C
1
This device is a high performance RF integrated circuit with an ESD rating of
<2 kV, and is ESD sensitive. Proper precautions should be taken for handling
and assembly.
2
GND = AGND = DGND = 0 V.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Data Sheet ADF4212L
Rev. E | Page 7 of 28
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
1
2
3
4
5
6
7
8
9
10
V
P
1
CP
RF
DGND
RF
FL
O
AGND
RF
RF
IN
V
DD
1
MUXOUT
DGND
IF
REF
IN
20
19
18
17
16
15
14
13
12
11
V
P
2
CP
IF
DGND
IF
R
SET
AGND
IF
IF
IN
CLK
DATA
LE
V
DD
2
ADF4212L
TOP VIEW
(Not to Scale)
0
2774-003
Figure 3. TSSOP Pin Configuration
CP
RF
DGND
RF
RF
IN
AGND
RF
FL
O
NOTES
1. IT IS RECOMMENDED THAT THE EXPOSED PAD
BE THERMALLY CONNECTED TO A COPPER PLANE
FOR ENHANCED THERM
A
L PERFORMANCE. THE PAD
SHOULD BE GROUNDED AS WELL.
AGND
IF
IF
IN
DGND
IF
R
SET
LE
REF
IN
DGND
IF
MUXOUT
DATA
CLK
V
DD
2
V
DD
1
V
P
1
V
P
2
CP
IF
02774-004
14
13
12
1
3
4
15
11
2
5
7
6
8
9
10
19
20
18
17
16
TOP
VIEW
ADF4212L
Figure 4. LFCSP Pin Configuration
Table 5. Pin Function Descriptions
Pin No.
Mnemonic TSSOP LFCSP Description
CP
RF
3 1
RF Charge Pump Output. When enabled, this provides ±I
CP
to the external RF loop filter, which in turn
drives the external RF VCO.
DGND
RF
4 2 Digital Ground Pin for the RF Digital Circuitry.
RF
IN
5 3 Input to the RF Prescaler. This small signal input is normally ac-coupled from the RF VCO.
AGND
RF
6 4 Ground Pin for the RF Analog Circuitry.
FL
O
7 5 Multiplexed Output of RF/IF Programmable or Reference Dividers, RF/IF Fastlock Mode. CMOS output.
REF
IN
8 6
Reference Input. This is a CMOS input with a nominal threshold of V
DD
/2 and an equivalent input
resistance of 100 kΩ. See Figure 26. This input can be driven from a TTL or CMOS crystal oscillator, or can
be ac-coupled.
DGND
IF
9, 17 7, 15 Digital Ground Pin for the IF Digital, Interface, and Control Circuitry.
MUXOUT 10 8
This multiplexer output allows either the IF/RF lock detect, the scaled RF, the scaled IF, or the scaled
reference frequency to be accessed externally.
CLK 11 9
Serial Clock Input. This serial clock is used to clock in the serial data to the registers. The data is latched
into the 24-bit shift register on the CLK rising edge. This input is a high impedance CMOS input.
DATA 12 10
Serial Data Input. The serial data is loaded MSB first with the two LSBs being the control bits. This input is
a high impedance CMOS input.
LE 13 11
Load Enable, CMOS Input. When LE goes high, the data stored in the shift registers is loaded into one of
the four latches, with the latch selected using the control bits.
R
SET
14 12
Connecting a resistor between this pin and ground sets the maximum RF and IF charge pump output
current. The nominal voltage potential at the R
SET
pin is 0.66 V. The relationship between I
CP
and R
SET
is,
therefore,
SET
MAXCP
R
I
13.5
where R
SET
= 2.7 kΩ and I
CP
MAX
= 5 mA for both the RF and IF charge pumps.
AGND
IF
15 13 Ground Pin for the IF Analog Circuitry.
IF
IN
16 14 Input to the IF Prescaler. This small signal input is normally ac-coupled from the IF VCO.
CP
IF
18 16
Output from the IF Charge Pump. This is normally connected to a loop filter that drives the input to an
external VCO.
V
P
2 19 17
Power Supply for the IF Charge Pump. This should be greater than or equal to V
DD
2. In systems where
V
DD
2 is 3 V, it can be set to 5.5 V and used to drive a VCO with a tuning range up to 5.5 V.
ADF4212L Data Sheet
Rev. E | Page 8 of 28
Pin No.
Mnemonic TSSOP LFCSP Description
V
DD
2 20 18
Power Supply for the IF, Digital, and Interface Section. Decoupling capacitors to the ground plane
should be placed as close as possible to this pin. V
DD
2 should have a value of between 2.6 V and 3.3 V.
V
DD
2 must have the same potential as V
DD
1.
V
DD
1 1 19
Power Supply for the RF Section. Decoupling capacitors to the ground plane should be placed as close
as possible to this pin. V
DD
1 should have a value of between 2.6 V and 3.3 V. V
DD
1 must have the same
potential as V
DD
2.
V
P
1 2 20
Power Supply for the RF Charge Pump. This should be greater than or equal to V
DD
1. In systems where
V
DD
1 is 3 V, it can be set to 5.5 V and used to drive a VCO with a tuning range up to 5.5 V.
EP
Exposed
Pad
It is recommended that the exposed pad be thermally connected to a copper plane for enhanced
thermal performance. The pad should be grounded as well.

ADF4212LBRUZ-RL7

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Phase Locked Loops - PLL Dual Power Freq Synthesizer
Lifecycle:
New from this manufacturer.
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