BFU725F/N1,115

1. Product profile
1.1 General description
NPN silicon germanium microwave transistor for high speed, low noise applications in a
plastic, 4-pin dual-emitter SOT343F package.
1.2 Features and benefits
Low noise high gain microwave transistor
Noise figure (NF) = 0.7 dB at 5.8 GHz
High maximum stable gain 27 dB at 1.8 GHz
110 GHz f
T
silicon germanium technology
1.3 Applications
2nd LNA stage and mixer stage in DBS LNB’s
Satellite radio
Low noise amplifiers for microwave communications systems
WLAN and CDMA applications
Analog/digital cordless applications
Ka band oscillators (DRO’s)
1.4 Quick reference data
BFU725F/N1
NPN wideband silicon germanium RF transistor
Rev. 2 — 3 November 2011 Product data sheet
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling
electrostatic sensitive devices.
Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or
equivalent standards.
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
V
CBO
collector-base voltage open emitter - - 10 V
V
CEO
collector-emitter voltage open base - - 2.8 V
V
EBO
emitter-base voltage open collector - - 1.0 V
I
C
collector current - 25 40 mA
P
tot
total power dissipation T
sp
90 C
[1]
- - 136 mW
h
FE
DC current gain I
C
=10mA; V
CE
=2V;
T
j
=25C
160 280 400
BFU725F_N1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 3 November 2011 2 of 12
NXP Semiconductors
BFU725F/N1
NPN wideband silicon germanium RF transistor
[1] T
sp
is the temperature at the solder point of the emitter lead.
[2] G
p(max)
is the maximum power gain, if K > 1. If K < 1 then G
p(max)
= Maximum Stable Gain (MSG).
2. Pinning information
3. Ordering information
4. Marking
C
CBS
collector-base
capacitance
V
CB
=2V; f=1MHz - 70 - fF
f
T
transition frequency I
C
=25mA; V
CE
=2V;
f=2GHz; T
amb
=25C
-55- GHz
G
p(max)
maximum power gain I
C
=25mA; V
CE
=2V;
f=5.8GHz; T
amb
=25C
[2]
-18- dB
NF noise figure I
C
=5mA; V
CE
=2V;
f=5.8GHz;
S
=
opt
;
T
amb
=25C
-0.7- dB
Table 1. Quick reference data
…continued
Symbol Parameter Conditions Min Typ Max Unit
Table 2. Discrete pinning
Pin Description Simplified outline Graphic symbol
1emitter
2base
3emitter
4 collector
12
34
mbb159
4
1, 3
2
Table 3. Ordering information
Type number Package
Name Description Version
BFU725F/N1 - plastic surface-mounted flat pack package; reverse
pinning; 4 leads
SOT343F
Table 4. Marking
Type number Marking Description
BFU725F/N1 B7* * = p : made in Hong Kong
* = t : made in Malaysia
* = W : made in China
BFU725F_N1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 3 November 2011 3 of 12
NXP Semiconductors
BFU725F/N1
NPN wideband silicon germanium RF transistor
5. Limiting values
[1] T
sp
is the temperature at the solder point of the emitter lead.
6. Thermal characteristics
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
CBO
collector-base voltage open emitter - 10 V
V
CEO
collector-emitter voltage open base - 2.8 V
V
EBO
emitter-base voltage open collector - 1.0 V
I
C
collector current - 40 mA
P
tot
total power dissipation T
sp
90 C
[1]
- 136 mW
T
stg
storage temperature 65 +150 C
T
j
junction temperature - 150 C
Table 6. Thermal characteristics
Symbol Parameter Conditions Typ Unit
R
th(j-sp)
thermal resistance from junction to solder point 440 K/W
Fig 1. Power derating curve
T
sp
(°C)
0 16012040 80
001aah424
100
50
150
200
P
tot
(mW)
0

BFU725F/N1,115

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
RF Bipolar Transistors 2.8V 0.04A 4-Pin Trans GP BJT NPN
Lifecycle:
New from this manufacturer.
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