ADG725/ADG731
Rev. B | Page 16
OUTLINE DIMENSIONS
Figure 10. 48-Lead Lead Frame Chip Scale Package [LFCSP]
7 mm × 7 mm Body and 0.75 mm Package Height
(CP-48-4)
Dimensions shown in millimeters
Figure 11. 48-Lead Thin Plastic Quad Flat Package [TQFP]
(SU-48)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADG725BCPZ –40°C to +85°C 48-Lead Frame Chip Scale Package [LFCSP] CP-48-4
ADG725BSUZ –40°C to +85°C 48-Lead Thin Plastic Quad Flat Package [TQFP] SU-48
ADG731BCPZ –40°C to +85°C 48-Lead Frame Chip Scale Package [LFCSP] CP-48-4
ADG731BCPZ-REEL
–40°C to +85°C
48-Lead Frame Chip Scale Package [LFCSP] CP-48-4
ADG731BCPZ-REEL7
–40°C to +85°C
48-Lead Frame Chip Scale Package [LFCSP] CP-48-4
ADG731BSUZ
–40°C to +85°C
48-Lead Thin Plastic Quad Flat Package [TQFP] SU-48
1
Z = RoHS Compliant Part.
112408-B
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-WKKD.
1
0.50
BSC
BOTTOM VIEW
TOP VIEW
PIN 1
INDICATOR
7.00
BSC SQ
48
13
24
25
36
37
12
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
5.20
5.10 SQ
5.00
0.45
0.40
0.35
EATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.25 MIN
0.20 REF
COPLANARITY
0.08
0.30
0.23
0.18
COMPLIANT TO JEDEC STANDARDS MS-026ABC
0.50
BSC
LEAD PITCH
0.27
0.22
0.17
9.00
BSC SQ
7.00
BSC SQ
1.20
MAX
TOP VIEW
(PINS DOWN)
1
12
13
25
24
36
37
48
0.75
0.60
0.45
PIN 1
VIEW A
1.05
1.00
0.95
0.20
0.09
0.08 MAX
COPLANARITY
SEATING
PLANE
0° MIN
7°
3.5°
0°
0.15
0.05
VIEW A
ROTATED 90° CCW
