2N7002P All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 29 July 2010 9 of 15
NXP Semiconductors
2N7002P
60 V, 360 mA N-channel Trench MOSFET
8. Test information
Fig 17. Duty cycle definition
t
1
t
2
P
t
006aaa812
duty cycle δ =
t
1
t
2
2N7002P All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 29 July 2010 10 of 15
NXP Semiconductors
2N7002P
60 V, 360 mA N-channel Trench MOSFET
9. Package outline
Fig 18. Package outline SOT23 (TO-236AB)
UNIT
A
1
max.
b
p
cD
E
e
1
H
E
L
p
Qwv
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
04-11-04
06-03-16
IEC JEDEC JEITA
mm
0.1
0.48
0.38
0.15
0.09
3.0
2.8
1.4
1.2
0.95
e
1.9
2.5
2.1
0.55
0.45
0.1
0.2
DIMENSIONS (mm are the original dimensions)
0.45
0.15
SOT23 TO-236AB
b
p
D
e
1
e
A
A
1
L
p
Q
detail X
H
E
E
w M
v M
A
B
AB
0 1 2 mm
scale
A
1.1
0.9
c
X
12
3
Plastic surface-mounted package; 3 leads SOT2
3
2N7002P All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 29 July 2010 11 of 15
NXP Semiconductors
2N7002P
60 V, 360 mA N-channel Trench MOSFET
10. Soldering
Fig 19. Reflow soldering footprint for SOT23 (TO-236AB)
Fig 20. Wave soldering footprint for SOT23 (TO-236AB)
solder lands
solder resist
occupied are
a
solder paste
sot023_
fr
0.5
(3×)
0.6
(3×)
0.6
(3×)
0.7
(3×)
3
1
3.3
2.9
1.7
1.9
2
Dimensions in mm
solder lands
solder resist
occupied are
a
preferred transport direction during soldering
sot023_
fw
2.8
4.5
1.4
4
.6
1.4
(2×)
1.2
(2×)
2.2
2.6
Dimensions in mm

2N7002P,215

Mfr. #:
Manufacturer:
Nexperia
Description:
MOSFET 60V 0.3A N-CHANNEL TRENCH MOSFET
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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