PRODUCTS
Surface Mount
Chip LED
TYPE
SML-L13DTAFS
PAGE
／
【ATTENTION POINTS IN SOLDERING OPERATION】
This product was developed as a surface mount LED especially suitable for reflow soldering.
So refrow soldering is recommended. Incase of implementing manual soldering,
please take care of following points.
1. SOLDERING OPERATION
1) SOLDER USED
Sn-Cu, Sn-Ag-Cu, Sn-Ag-Bi-Cu
2)SOLDERING CONDITION
LED products do not contain reinforcement material such as a glass fillers.
So thermal stress by soldering greatly influence its reliability.
Please keep following points for manual soldering.
3)WASHING
Please note the following points when washing is required after soldering.
3-1) WASHING SOLVENT
Isopropyl alcohol or other alcohol solvent is recommendable.
3-2) TEMPERATURE
Below 30℃, immersion time : within 3 minutes.
3-3) ULTRA SONIC WASHING
Below 15W/1 litter of solvent tub.
3-4) CURING
Below 100℃ within 3 minutes.
4)STORAGE
At manual soldering, the reliability of this product is often influenced by moisture
absorption so we apply the packaging with moisture proof for better condition is use, please also note that
4-1) Not to be opened before using.
4-2) To be kept in our moisture proof packaging with some desiccant (SILICA GEL) after opening it.
To be baked in case the SILICA GEL indicator changed its color from either blue to clear or green to pink.
4-3) STRAGE CONDITION
Please use products in a sort time after opening the package. In case all parts
are not used at the sometime, put the remaining back into ROHM package.
Storage condition : (Lower than 30℃, 70% Humidity max.72 hours.)
4-4) BAKING CONDITION
12～24 hours at 60℃, and humidity less than 20%
REV.： －
SPECIFICATION No.： TENTATIVE (20091222)
TSZ22111･05･002
ITEM RECOMMENDED CONDITION
a) Soldering iron Less than 30W, top of iron less than 3mm.
b) Heating method Condition ) Temp. of iron top less than
350℃ within 3 sec.
Heating on PCB pattern, not direct to the LED.
c) Handling after
soldering
Please handle after the part temp.
Goes down to room temp.
