PRODUCTS
Surface Mount
Chip LED
TYPE
SML-L13DTAFS
PAGE
／
【ATTENTION POINT IN HANDLING】
This product was developed as a surface mount LED especially suitable for soldering.
Please take care of following points when using this device.
1.DESIGNING OF PCB
As for a recommendable solder pattern, Please refer to Fig-1.
The size and direction of the pad pattern
depends on the condition of the PCB,
So, please investigate about the adjustment
thoroughly before designing.
2.SOLDERING ( Sn-Cu, Sn-Ag-Cu, Sn-Ag-Bi-Cu )
LED products do not contain reinforcement
materials such as glass fillers.
Therefore, thermal stress by soldering greatly
influence its reliability.
The temperature conditions for reflow soldering
should therefore be set up according to the
characteristic of this product. (See Fig-2)
Furthermore, a sudden heating or cooling of LED
cause internal stress greatly and has a possibility to
break the device. Therefore, thermal gradient shall be
gradual as possible.
Number of reflow process shall be max 2 times
and these processes shall be performed in a row.
Cooling process to normal temperature shall be required
between first and second soldering process.
3.HANDLING AFTER MOUNTING
In case outside force is given to the device, stress is
concentrated to the jointed part between mold resin and substrate.
Therefore please be careful when handling LED and PCB for
there is a possibility to break the device or PCB.
4.WASHING
Please note the following points when washing is required after soldering.
4-1) WASHING SOLVENT
Isopropyl alcohol or other alcohol solvent is recommendable.
4-2) TEMPERATURE
Below 30℃, immersion time ; within 3 minutes.
4-3) ULTRA SONIC WASHING
Below 15 / 1 litter of solvent tub.
4-4) CULING
Below 100℃ within 3 minutes.
5.STORAGE
At reflow soldering, the reliability of this product is often influenced by moisture
absorption so we apply the packaging with moisture proof for better condition is use, please also note that
5-1) Not to be opened before using.
5-2) To be kept in our moisture proof packaging with some desiccant (SILICA GEL) after opening it.
To be baked in case the SILICAGEL indicator changed its color from either blue to clear or green to pink.
5-3) Please use within 72 hours after the package was opened. (Condition at 30℃, max.70%Rh.)
In case it is not used within 72 hours, please put it back into our packaging.
5-4) BAKING
Please bake under reel condition at 60℃, 12～24 hours (max.20%Rh) after un-sealing.
While baking is done, the reel and emboss tape may be easily deformed.
Please be careful not to give any stress.
REV.： －
SPECIFICATION No.：
TENTATIVE (20091222)
TSZ22111･05･002
（Fig-1)
( unit : mm )
0
50
100
150
200
250
300
Outside Force
PCB
Soldering part
Emitting Direction
1.2
±0.1
4.25
1.0
0.630.63
0.5 0.8 0.8 0.5
Through hole
(Fig-2)
Max 250℃, Within 10sec
140～180℃
230～250℃
Max 40sec
Min.1 min
Max
-6℃/sec
