MRF6S23100HR5

4
RF Device Data
Freescale Semiconductor
MRF6S23100HR3 MRF6S23100HSR3
Figure 2. MRF6S23100HR3(HSR3) Test Circuit Component Layout
CUT OUT AREA
MRF6S23100 Rev 2.0
C10
C1
R1
B1
C6 C5
C4
C2
C8
C9
C11
C12
C7
C3
MRF6S23100HR3 MRF6S23100HSR3
5
RF Device Data
Freescale Semiconductor
TYPICAL CHARACTERISTICS
G
ps
, POWER GAIN (dB)
IRL, INPUT RETURN LOSS (dB)
IM3 (dBc), ACPR (dBc)
-24
-12
-15
-21
24002300
IRL
G
ps
ACPR
IM3
f, FREQUENCY (MHz)
Figure 3. 2-Carrier W-CDMA Broadband Performance @ P
out
= 20 Watts Avg.
2370236023502340233023202310
16
-43
25.4
24.8
24.2
23.6
-35
-37
-39
η
D
, DRAIN
EFFICIENCY (%)
15.8
15.6
15.4
15.2
15
14.8
14.6
-41
-18
14.4
η
D
G
ps
, POWER GAIN (dB)
IRL, INPUT RETURN LOSS (dB)
IM3 (dBc), ACPR (dBc)
-22
-12
-16
24002300
IRL
G
ps
ACPR
IM3
f, FREQUENCY (MHz)
Figure 4. 2-Carrier W-CDMA Broadband Performance @ P
out
= 40 Watts Avg.
2370236023502340233023202310
15.2
-35
35.5
35
34.5
34
-27
-29
-31
η
D
, DRAIN
EFFICIENCY (%)
15.1
15
14.9
14.8
14.7
14.6
14.5
-25
-14
3.84 MHz Channel Bandwidth
PAR = 8.5 dB @ 0.01% Probability (CCDF)
14.2
η
D
Figure 5. Two-T one Power Gain versus
Output Power
10
12
18
0.1
I
DQ
= 1500 mA
P
out
, OUTPUT POWER (WATTS) PEP
300
G
ps
, POWER GAIN (dB)
16
15
13
1000 mA
750 mA
500 mA
14
100
V
DD
= 28 Vdc, f1 = 2345 MHz
f2 = 2355 MHz, Two-Tone Measurements
10 MHz Tone Spacing
Figure 6. Third Order Intermodulation Distortion
versus Output Power
0
0.1 10
-2 0
-3 0
-4 0
300
-70
-5 0
P
out
, OUTPUT POWER (WATTS) PEP
INTERMODULATION DISTORTION (dBc)
IMD, THIRD ORDER
100
-18
-20
2380 2390
14.4
14.3
2380 2390
35.5
-33
1250 mA
-1 0
-60
1
1
I
DQ
= 500 mA
1000 mA
750 mA
V
DD
= 28 Vdc
f1 = 2345 MHz, f2 = 2355 MHz
Two-Tone Measurements, 10 MHz Tone Spacing
1500 mA
1250 mA
17
3.84 MHz Channel Bandwidth
PAR = 8.5 dB @ 0.01% Probability (CCDF)
V
DD
= 28 Vdc, P
out
= 20 W (Avg.), I
DQ
= 1000 mA
2-Carrier W-CDMA, 10 MHz Carrier Spacing
V
DD
= 28 Vdc, P
out
= 40 W (Avg.), I
DQ
= 1000 mA
2-Carrier W-CDMA, 10 MHz Carrier Spacing
6
RF Device Data
Freescale Semiconductor
MRF6S23100HR3 MRF6S23100HSR3
TYPICAL CHARACTERISTICS
11
18
0.1
0
70
P
out
, OUTPUT POWER (WATTS) CW
10
16
14
12
60
50
40
30
η
D
, DRAIN EFFICIENCY (%)
G
ps
, POWER GAIN (dB)
15
13
V
DD
= 28 Vdc
I
DQ
= 1000 mA
f = 2350 MHz
η
D
G
ps
IM3 (dBc), ACPR (dBc)
Figure 7. Intermodulation Distortion Products
versus Tone Spacing
10
-60
-1 0
0.1
7th Order
TWO-T ONE SPACING (MHz)
V
DD
= 28 Vdc, P
out
= 100 W (PEP), I
DQ
= 1000 mA
Two-Tone Measurements
(f1 + f2)/2 = Center Frequency of 2350 MHz
5th Order
3rd Order
-2 0
-3 0
-4 0
1 100
Figure 8. Pulsed CW Output Power versus
Input Power
Figure 9. 2-Carrier W-CDMA ACPR, IM3, Power Gain
and Drain Efficiency versus Output Power
0
-55
P
out
, OUTPUT POWER (WATTS) AVG.
35
-20
-30
25
20
-35
10
10 100
-40
40
57
P3dB = 51.88 dBm (154.14 W)
P
in
, INPUT POWER (dBm)
V
DD
= 28 Vdc, I
DQ
= 1000 mA
Pulsed CW, 8 µsec(on), 1 msec(off)
f = 2350 MHz
53
49
47
3433 36
Actual
Ideal
55
51
32
Figure 10. Power Gain and Drain Efficiency
versus CW Output Power
Figure 11. Power Gain versus Output Power
P
out
, OUTPUT POWER (WATTS) CW
IM3
G
ps
η
D
, DRAIN EFFICIENCY (%), G
ps
, POWER GAIN (dB)
IMD, INTERMODULATION DISTORTION (dBc)
P
out
, OUTPUT POWER (dBm)
G
ps
, POWER GAIN (dB)
160
10
16
0
12
11
20
13
14
I
DQ
= 1000 mA
f = 2350 MHz
30
-45
η
D
ACPR
V
DD
= 24 V
28 V
32 V
38
1
-25
40 60 80
10
20
P1dB = 51.18 dBm (131.19 W)
15
T
C
= 25_C
-30 _C
85_C
25_C
T
C
= -30_C
85_C
25_C
85_C
-30 _C
100
25_C
15
100
V
DD
= 28 Vdc, I
DQ
= 1000 mA
f1 = 2345 MHz, f2 = 2355 MHz
2-Carrier W-CDMA
10 MHz Carrier Spacing, 3.84 MHz
Channel Bandwidth, PAR = 8.5 dB
@ 0.01% Probability (CCDF)
393735
5 -50
-30 _C
85_C
25_C
25_C
17
1
120 140

MRF6S23100HR5

Mfr. #:
Manufacturer:
NXP / Freescale
Description:
RF MOSFET Transistors HV6 2.3GHZ 20W
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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