NCV4276, NCV4276A
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19
Table 2. D
2
PAK 5Lead Thermal RC Network Models
Drain Copper Area (1 oz thick) 241 mm
2
788 mm
2
241 mm
2
788 mm
2
(SPICE Deck Format) Cauer Network Foster Network
241 mm
2
653 mm
2
Units Ta u Ta u Units
C_C1 Junction GND 1.00E06 1.00E06 Ws/C 1.361E08 1.361E08 sec
C_C2 node1 GND 1.00E05 1.00E05 Ws/C 7.411E07 7.411E07 sec
C_C3 node2 GND 6.00E05 6.00E05 Ws/C 1.005E05 1.007E05 sec
C_C4 node3 GND 1.00E04 1.00E04 Ws/C 3.460E05 3.480E05 sec
C_C5 node4 GND 2.82E04 2.87E04 Ws/C 7.868E04 8.107E04 sec
C_C6 node5 GND 5.58E03 5.95E03 Ws/C 7.431E03 7.830E03 sec
C_C7 node6 GND 4.25E01 4.61E01 Ws/C 2.786E+00 2.012E+00 sec
C_C8 node7 GND 9.22E01 2.05 Ws/C 2.014E+01 2.601E+01 sec
C_C9 node8 GND 1.73 4.88 Ws/C 1.134E+02 1.218E+02 sec
C_C10 node9 GND 7.12 1.31 Ws/C sec
241 mm
2
653 mm
2
R’s R’s
R_R1 Junction node1 0.015 0.0150 C/W 0.0123 0.0123 C/W
R_R2 node1 node2 0.08 0.0800 C/W 0.0585 0.0585 C/W
R_R3 node2 node3 0.4 0.4000 C/W 0.0257 0.0260 C/W
R_R4 node3 node4 0.2 0.2000 C/W 0.3413 0.3438 C/W
R_R5 node4 node5 1.85638 1.8839 C/W 1.77 1.81 C/W
R_R6 node5 node6 1.23672 1.2272 C/W 1.54 1.52 C/W
R_R7 node6 node7 9.81541 5.3383 C/W 4.13 3.46 C/W
R_R8 node7 node8 33.1868 18.9591 C/W 6.27 5.03 C/W
R_R9 node8 node9 27.0263 13.3369 C/W 60.80 29.30 C/W
R_R10 node9 GND 1.13944 0.1191 C/W C/W
NOTE: Bold face items represent the package without the external thermal system.
The Cauer networks generally have physical significance and may be divided between nodes to separate thermal behavior
due to one portion of the network from another. The Foster networks, though when sorted by time constant (as above) bear
a rough correlation with the Cauer networks, are really only convenient mathematical models. Cauer networks can be easily
implemented using circuit simulating tools, whereas Foster networks may be more easily implemented using mathematical
tools (for instance, in a spreadsheet program), according to the following formula:
R(t) +
n
S
i + 1
R
i
ǒ
1e
tńtau
i
Ǔ
NCV4276, NCV4276A
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20
110
150
Figure 53. qJA vs. Copper Spreader Area,
DPAK 5Lead
Figure 54. qJA vs. Copper Spreader Area,
D
2
PAK 5Lead
100
90
80
70
60
50
40
30
200 250 300 350 400 450 500 550 600 650 700 750
COPPER AREA (mm
2
)
qJA (C°/W)
1 oz
2 oz
110
150
100
90
80
70
60
50
40
30
200 250 300 350 400 450 500 550 600 650 700 750
COPPER AREA (mm
2
)
qJA (C°/W)
1 oz
2 oz
100
10
1.0
0.1
0.01
TIME (sec)
R(t) C°/W
0.0000001 0.000001 0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1000
Cu Area 167 mm
2
Cu Area 736 mm
2
Figure 55. SinglePulse Heating Curves, DPAK 5Lead
100
10
1.0
0.1
0.01
TIME (sec)
R(t) C°/W
0.0000001 0.000001 0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1000
Cu Area 167 mm
2
Cu Area 736 mm
2
sqrt(t)
Figure 56. SinglePulse Heating Curves, D
2
PAK 5Lead
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21
100
10
1.0
0.1
0.01
PULSE WIDTH (sec)
R
q
JA
788 mm
2
C°/W
0.0000001 0.000001 0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1000
Nonnormalized Response
50% Duty Cycle
20%
10%
5%
2%
1%
100
10
1.0
0.1
0.01
PULSE WIDTH (sec)
R
q
JA
736 mm
2
C°/W
0.0000001 0.000001 0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1000
Nonnormalized Response
50% Duty Cycle
Figure 57. Duty Cycle for 1, Spreader Boards, DPAK 5Lead
20%
10%
5%
2%
1%
Figure 58. Duty Cycle for 1, Spreader Boards, D
2
PAK 5Lead

NCV4276DSADJG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
IC REG LIN POS ADJ 400MA D2PAK-5
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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