Application Note Sep 2008
7 Order Number: 320005-04
Conversion Guide: P33 130nm to 65nm
3.0 Device Packaging and Ballout
The following section provides a brief overview of the package and ballout differences
between the P33 130nm and P33 65nm devices.
Note: For 256M/256M stack TSOP migration options, please contact your local Numonyx local Sales representative.
3.1 Easy BGA Ballout
The Easy BGA ballout is available for both P33 130nm and P33 65nm products. Ball
pitch of the Easy BGA ballout is 1.0 mm. The package has an 8 x 8 active-ball matrix.
Table 2: Package Comparison
Features / Specifications P33 130nm P33 65nm
Monolithic Densities
Easy BGA Yes Yes
TSOP Yes Yes
QUAD+ (SCSP) Yes No
Stack Densities
Easy BGA Yes Yes
TSOP Yes See Note
QUAD+ (SCSP) Yes No
Figure 1: 64-Ball Easy BGA Ballout (256/512-Mbit)
1
8
234
5
67
Easy BGA
Top View- Ball side down
Easy BGA
Bottom View- Ball side up
1
8
234
5
67
H
G
F
E
D
C
B
A
H
G
F
E
D
C
A
A2 VSS A9 A14CE# A19 RFUA25
RFU VSS VCC DQ13VSS DQ7 A24VSS
A3 A7 A10 A15A12 A20 A21WP#
A4 A5 A11 VCCQRST# A16 A17VCCQ
RFUDQ8 DQ1 DQ9 DQ4DQ3 DQ15CLK
RFU OE#DQ0 DQ10 DQ12DQ11 WAITADV#
WE#A23 RFU DQ2 DQ5VCCQ DQ14DQ6
A1 A6 A8 A13VPP A18 A22VCC
A23
A4A5A11VCCQ RST#A16A17 VCCQ
A1A6A8A13 VPPA18A22 VCC
A3A7A10A15 A12A20A21 WP#
RFU DQ8DQ1DQ9DQ4 DQ3DQ15 CLK
RFUOE# DQ0DQ10DQ12 DQ11WAIT ADV#
WE# RFUDQ2DQ5 VCCQDQ14 DQ6
A2VSSA9A14 CE#A19RFU A25
RFUVSSVCCDQ13 VSSDQ7A24 VSS
B
Conversion Guide: P33 130nm to 65nm
Application Note Sep 2008
8 Order Number: 320005-04
Notes:
1. A1 is the least significant address bit.
2. A24 is valid for 256-Mbit densities and above; otherwise, it is a no connect (NC).
3. A25 is valid for 512-Mbit densities; otherwise, it is a no connect (NC).
3.2 TSOP Pinout
The TSOP Pinout is available and compatible for both P33 130nm and P33 65nm
products. Pin 13 on P33 130nm is connected to Vcc. For P33 65nm this pin has no
internal connection; it may be driven or left floated
1. A1 is the least significant address bit.
2. A24 is valid for 256-Mbit densities; otherwise, it is a no connect (NC).
3. No Internal Connection on VCC Pin 13; it may be driven or floated. For legacy designs, pin can be tied to Vcc
Figure 2: 56-Lead TSOP Pinout (256-Mbit)
Numonyx
P33 Flash Memory
56-Lead TSOP Pinout
14 mm x 20 mm
Top View
1
3
4
2
5
7
8
6
9
11
12
10
13
15
16
14
17
19
20
18
21
23
24
22
25
27
28
26
56
54
53
55
52
50
49
51
48
46
45
47
44
42
41
43
40
38
37
39
36
34
33
35
32
30
29
31
A14
A13
A12
A10
A9
A11
A23
A21
VSS
A22
VCC
WP#
A20
WE#
A19
A8
A7
A18
A6
A4
A3
A5
A2
RFU
VSS
A24
WAIT
DQ15
DQ7
A17
DQ14
DQ13
DQ5
DQ6
DQ12
ADV#
CLK
DQ4
RST#
A16
DQ3
VPP
DQ10
VCCQ
DQ9
DQ2
DQ1
DQ0
VCC
DQ8
OE#
CE#
A1
VSS
A15
DQ11
Application Note Sep 2008
9 Order Number: 320005-04
Conversion Guide: P33 130nm to 65nm
4.0 Hardware Design Considerations
The P33 130nm and P33 65nm flash memory devices provide reliable, two-bit-per-cell
storage technology for embedded applications. They satisfy the need for more density
in less space, with a high-speed interface. Both flash devices feature asymmetrically-
blocked architecture, Buffered Enhanced Factory Programming, and synchronous-burst
read mode. The following sections discuss hardware design considerations when
converting from the P33 130nm device to the P33 65nm device.
4.1 AC Read Specifications
Refer to the product datasheet for detailed list of all read timing specifications:
•Numonyx
TM
StrataFlash
®
Embedded Memory (P33-130nm) Datasheet (314749)
•Numonyx
TM
StrataFlash
®
Embedded Memory (P33-65nm) Datasheet (320003)
4.2 AC Write/Erase Specifications
Note: Refer to the product datasheet for detailed list of all write and erase timing
specifications.
•Numonyx
TM
StrataFlash
®
Embedded Memory (P33-130nm) Datasheet (314749)
•Numonyx
TM
StrataFlash
®
Embedded Memory (P33-65nm) Datasheet (320003)
Table 3: Key AC Read Specification Comparison
Features / Specifications P33 130nm P33 65nm
Performance
Clock Frequency (Max) 52 MHz 52 MHz
Asynchronous Access (t
AVQV
t
VLQV
t
ELQV
)
Easy BGA: 85 ns Easy BGA: 95 ns
TSOP: 95 ns TSOP: 105 ns
Asynch Page Access time (t
APA
) 25 ns 25 ns
Clock-to-Data Burst Access (t
CHQV
) 17 ns 17 ns
Burst Data Hold Time (t
CHQX
)3 ns3ns
Address and ADV# Setup Time (t
AVCH
, t
VLCH
) 9 ns 9 ns
CE# Setup Time (t
ELCH
) 9 ns 9 ns
Rise/Fall Time (t
FCLK/LCLK
)3.0 ns3.0 ns
Clock High/Low Time (t
CH/CL
)5 ns5ns
Vcc power valid to RST# de-assertion (high) 60 us 300 us
Async Page Size 4 words 16 words
Synchronous Burst Length (word) 4-, 8-, 16-, and Cont. 4-, 8-, 16- and Cont.
Burst Suspend Mode Yes Yes

TE28F256P33BFA

Mfr. #:
Manufacturer:
Micron
Description:
IC FLASH 256M PARALLEL 56TSOP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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