LT3580
13
3580fg
APPLICATIONS INFORMATION
(1) SYNC may not toggle outside the frequency range of
200kHz to 2.5MHz unless it is stopped low to enable
the free-running oscillator.
(2) The SYNC frequency can always be higher than the
free-running oscillator frequency, f
OSC
, but should not
be less than 25% below f
OSC
.
Operating Frequency Selection
There are several considerations in selecting the operating
frequency of the converter. The first is staying clear of
sensitive frequency bands, which cannot tolerate any
spectral noise. For example, in products incorporating RF
communications, the 455kHz IF frequency is sensitive to
any noise, therefore switching above 600kHz is desired.
Some communications have sensitivity to 1.1MHz, and in
that case, a 1.5MHz switching converter frequency may be
employed. The second consideration is the physical size
of the converter. As the operating frequency goes up, the
inductor and filter capacitors go down in value and size.
The tradeoff is efficiency, since the switching losses due
to NPN base charge (see Thermal Calculations), Schottky
diode charge, and other capacitive loss terms increase
proportionally with frequency.
Soft-Start
The LT3580 contains a soft-start circuit to limit peak switch
currents during start-up. High start-up current is inherent
in switching regulators in general since the feedback loop
is saturated due to V
OUT
being far from its final value. The
regulator tries to charge the output capacitor as quickly as
possible, which results in large peak currents.
The start-up current can be limited by connecting an
external capacitor (typically 100nF to 1μF) to the SS pin.
This capacitor is slowly charged to ~2.2V by an internal
275k resistor once the part is activated. SS pin voltages
below ~1.1V reduce the internal current limit. Thus, the
gradual ramping of the SS voltage also gradually increases
the current limit as the capacitor charges. This, in turn,
allows the output capacitor to charge gradually toward its
final value while limiting the start-up current.
In the event of a commanded shutdown or lockout (SHDN
pin), internal undervoltage lockout (UVLO) or a thermal
lockout, the soft-start capacitor is automatically discharged
to ~200mV before charging resumes, thus assuring that
the soft-start occurs after every reactivation of the chip.
Shutdown
The SHDN pin is used to enable or disable the chip.
For most applications, SHDN can be driven by a digital
logic source. Voltages above 1.38V enable normal active
operation. Voltages below 300mV will shutdown the chip,
resulting in extremely low quiescent current.
While the SHDN voltage transitions through the lockout
voltage range (0.3V to 1.24V) the power switch is disabled
and the SR2 latch is set (see the Block Diagram). This
causes the soft-start capacitor to begin discharging,
which continues until the capacitor is discharged and
active operation is enabled. Although the power switch
is disabled, SHDN voltages in the lockout range do not
necessarily reduce quiescent current until the SHDN voltage
is near or below the shutdown threshold.
Also note that SHDN can be driven above V
IN
or V
OUT
as
long as the SHDN voltage is limited to less than 32V.
Figure 6. Chip States vs SHDN Voltage
Configurable Undervoltage Lockout
Figure 7 shows how to configure an undervoltage lockout
(UVLO) for the LT3580. Typically, UVLO is used in situations
where the input supply is current-limited, has a relatively
high source resistance, or ramps up/down slowly. A
switching regulator draws constant power from the source,
so source current increases as source voltage drops. This
looks like a negative resistance load to the source and can
cause the source to current-limit or latch low under low
(HYSTERESIS AND TOLERANCE)
SHUTDOWN
(LOW QUIESCENT CURRENT)
ACTIVE
(NORMAL OPERATION)
LOCKOUT
(POWER SWITCH OFF,
SS CAPACITOR DISCHARGED)
1.24V
0.0V
1.38V
0.3V
3580 F06
SHDN (V)
LT3580
14
3580fg
APPLICATIONS INFORMATION
source voltage conditions. UVLO prevents the regulator
from operating at source voltages where these problems
might occur.
The shutdown pin comparator has voltage hysteresis with
typical thresholds of 1.32V (rising) and 1.29V (falling).
Resistor R
UVLO2
is optional. R
UVLO2
can be included
to reduce the overall UVLO voltage variation caused by
variations in SHDN pin current (see the Electrical Character-
istics). A good choice for R
UVLO2
is ≤10k ±1%. After
choosing a value for R
UVLO2
, R
UVLO1
can be determined
from either of the following:
R
UVLO1
=
V
IN
+
1.32V
1.32V
R
UVLO2
+11.6μA
or
R
UVLO1
=
V
IN
1.29V
1.29V
R
UVLO2
+11.6μA
where V
IN
+
and V
IN
are the V
IN
voltages when rising or
falling respectively.
For example, to disable the LT3580 for V
IN
voltages below
3.5V using the single resistor configuration, choose:
R
UVLO1
=
3.5V 1.29V
1.29V
+11.6μA
=190.5k
Figure 7. Configurable UVLO
To activate the LT3580 for V
IN
voltage greater than
4.5V using the double resistor configuration, choose
R
UVLO2
= 10k and:
R
UVLO1
=
4.5V 1.32V
1.32V
10k
+11.6μA
=22.1k
Internal Undervoltage Lockout
The LT3580 monitors the V
IN
supply voltage in case V
IN
drops below a minimum operating level (typically about
2.3V). When V
IN
is detected low, the power switch is
deactivated, and while sufficient V
IN
voltage persists, the
soft-start capacitor is discharged. After V
IN
is detected
high, the power switch will be reactivated and the soft-start
capacitor will begin charging.
Thermal Considerations
For the LT3580 to deliver its full output power, it is imperative
that a good thermal path be provided to dissipate the heat
generated within the package. This is accomplished by
taking advantage of the thermal pad on the underside of
the IC. It is recommended that multiple vias in the printed
circuit board be used to conduct heat away from the IC and
into a copper plane with as much area as possible.
Thermal Lockout
If the die temperature reaches approximately 165°C, the
part will go into thermal lockout, the power switch will be
turned off and the soft-start capacitor will be discharged.
The part will be enabled again when the die temperature
has dropped by ~5°C (nominal).
Thermal Calculations
Power dissipation in the LT3580 chip comes from four
primary sources: switch I
2
R loss, NPN base drive (AC), NPN
base drive (DC), and additional input current. The following
formulas can be used to approximate the power losses.
These formulas assume continuous mode operation,
R
UVLO2
(OPTIONAL)
1.3V
R
UVLO1
3580 F07
V
IN
V
IN
ACTIVE/
LOCKOUT
GND
11.6μA
AT 1.3V
+
SHDN
LT3580
15
3580fg
APPLICATIONS INFORMATION
so they should not be used for calculating efficiency in
discontinuous mode or at light load currents.
Average Input Current: I
IN
=
V
OUT
•I
OUT
V
IN
η
Switch I
2
R Loss: P
SW
= (DC)(I
IN
)
2
(R
SW
)
Base Drive Loss (AC): P
BAC
=13n(I
IN
)(V
OUT
)(f)
Base Drive Loss (DC): P
BDC
=
(V
IN
)(I
IN
)(DC)
50
Input Power Loss: P
INP
=7mA(V
IN
)
where:
R
SW
= switch resistance (typically 200mΩ at 1.5A)
DC = duty cycle (see the Power Switch Duty Cycle sec-
tion for formulas)
η = power conversion efficiency (typically 88% at high
currents)
Example: boost configuration, V
IN
= 5V, V
OUT
= 12V,
I
OUT
= 0.5A, f = 1.25MHz, V
D
= 0.5V:
I
IN
= 1.36A
DC = 61.5%
P
SW
= 228mW
P
BAC
= 270mW
P
BDC
= 84mW
P
INP
= 35mW
Total LT3580 power dissipation (P
TOT
) = 617mW
Thermal resistance for the LT3580 is influenced by the pres-
ence of internal, topside or backside planes. To calculate
die temperature, use the appropriate thermal resistance
number and add in worst-case ambient temperature:
T
J
= T
A
+ θ
JA
• P
TOT
where T
J
= junction temperature, T
A
= ambient tempera-
ture, θ
JA
= 43°C/W for the 3mm × 3mm DFN package and
35°C/W to 40°C/W for the MSOP Exposed Pad package.
P
TOT
is calculated above.
V
IN
Ramp Rate
While initially powering a switching converter application,
the V
IN
ramp rate should be limited. High V
IN
ramp rates can
cause excessive inrush currents in the passive components
of the converter. This can lead to current and/or voltage
overstress and may damage the passive components or
the chip. Ramp rates less than 500mV/μs, depending on
component parameters, will generally prevent these issues.
Also, be careful to avoid hot-plugging. Hot-plugging occurs
when an active voltage supply is “instantly” connected or
switched to the input of the converter. Hot-plugging results
in very fast input ramp rates and is not recommended.
Finally, for more information, refer to Linear application
note AN88, which discusses voltage overstress that can
occur when an inductive source impedance is hot-plugged
to an input pin bypassed by ceramic capacitors.
Layout Hints
As with all high frequency switchers, when considering
layout, care must be taken to achieve optimal electrical,
thermal and noise performance. One will not get adver-
tised performance with a careless layout. For maximum
efficiency, switch rise and fall times are typically in the
5ns to 10ns range. To prevent noise, both radiated and
conducted, the high speed switching current path, shown in
Figure 8, must be kept as short as possible. This is imple-
mented in the suggested layout of a boost configuration in
Figure 9. Shortening this path will also reduce the parasitic
trace inductance. At switch-off, this parasitic inductance
produces a flyback spike across the LT3580 switch. When
operating at higher currents and output voltages, with poor
layout, this spike can generate voltages across the LT3580
that may exceed its absolute maximum rating. A ground
plane should also be used under the switcher circuitry to
prevent interplane coupling and overall noise.
The VC and FB components should be kept as far away
as practical from the switch node. The ground for these
components should be separated from the switch cur-
rent path. Failure to do so can result in poor stability or
subharmonic oscillation.

LT3580IDD#PBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators 2A Boost/Inverting Switching Regulator
Lifecycle:
New from this manufacturer.
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