10
FN6325.3
August 12, 2014
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voltage monitoring. A 10µA current source to GND is active
while the part is disabled, and is inactive when the part is
enabled. This provides functionality for programmable
hysteresis when the EN pin is used for voltage monitoring.
VFF (Pin 13)
The voltage at this pin is used for input voltage feed forward
compensation and sets the internal oscillator ramp peak to
peak amplitude at 0.16*VFF. An external RC filter may be
required at this pin in noisy input environments. The
minimum recommended VFF voltage is 2.97V.
VIN (Pin 14, Internal Linear Regulator Input)
This pin should be tied directly to the input rail when using
the internal or external linear regulator options. It provides
power to the External/Internal Linear drive circuitry. When
used with an external 3.3V to 5V supply, this pin should be
tied directly to PVCC.
EXDRV (Pin 15, External Linear Regulator Drive)
This pin allows the use of an external pass element to power
the IC for input voltages above 5.0V. It should be connected to
GND when using an external 5V supply or the internal linear
regulator. When using the external linear regulator option, this
pin should be connected to the gate of a PMOS pass element,
a pull-up resistor must be connected between the PMOS
device’s gate and source for proper operation.
PVCC (Pin 16, Driver Bias Voltage)
This pin is the output of the internal series linear regulator. It
also provides the bias for both bottom side and top side
MOSFET drivers. The maximum voltage differential between
PVCC and PGND is 6V. Its recommended operational
voltage range is 2.9V to 5.6V. At minimum, a 10µF capacitor
is required for decoupling PVCC to PGND. For proper
operation the PVCC capacitor must be within 150 mils of the
PVCC and the PGND pins and must be connected to these
pins with dedicated traces.
BGATE (Pin 17)
This pin provides the drive for the bottom side MOSFET and
should be connected to its gate.
PGND (Pin 18, Power Ground)
This pin connects to the bottom side MOSFET's source and
provides the ground return path for the lower MOSFET driver
and internal power circuitries. In addition, PGND is the return
path for the bottom side MOSFET’s rDS(ON) current sensing
circuit.
LX (Pin 19)
This pin connects to the source of the top side MOSFET and
the drain of the bottom side MOSFET. This pin represents
the return path for the top side gate driver. During normal
switching, this pin is used for top side and bottom side
current sensing.
TGATE (Pin 20)
This pin provides the drive for the top side MOSFET and
should be connected to its gate.
BOOT (Pin 21)
This pin provides the bootstrap bias for the top side driver.
The absolute maximum voltage differential between BOOT
and LX is 6.0V (including the voltage added due to the
overcharging of the bootstrap capacitor); its operational
voltage range is 2.5V to 5.6V with respect to LX. It is
recommended that a 2.2 resistor be placed in series with
the bootstrap diode to prevent over charging of the BOOT
capacitor during normal operation.
TSOC (Pin 22)
The top side sourcing current limit is set by connecting this
pin with a resistor and capacitor to the drain of the top side
MOSEFT. A 100µA current source develops a voltage
across the resistor which is then compared with the voltage
developed across the top side MOSFET. An initial ~120ns
blanking period is used to eliminate sampling error due to
the switching noise before the current is measured.
BSOC (Pin 23)
The bottom side source and sinking current limit is set by
placing a resistor (RBSOC) and capacitor between this pin
and PGND. A 100µA current source develops a voltage
across RBSOC which is then compared with the voltage
developed across the bottom side MOSFET when on. The
sinking current limit is set at 1x of the nominal sourcing limit
in ISL8118. An initial ~120ns blanking period is used to
eliminate the sampling error due to switching noise before
the current is measured.
FSET (Pin 24)
This pin provides oscillator switching frequency adjustment
by placing a resistor (RFSET) from this pin to GND.
COMP (Pin 25)
This pin is the error amplifier output. It should be connected
to the FB pin through the desired compensation network.
FB (Pin 26)
This pin is the inverting input of the error amplifier and has a
maximum usable voltage of VCC-1.8V. When using the
internal differential remote sense functionality, this pin
should be connected to VDIFF by a standard feedback
network. In the event the remote sense buffer is disabled,
the VDIFF pin should be connected to VOUT by a resistor
divider along with FB’s compensation network.
GND (Pin 27, Analog Ground)
Signal ground for the IC. All voltage levels are measured
with respect to this pin. This pin should not be left floating.
VDIFF (Pin 28)
This pin is the output of the differential remote sense
instrumentation amplifier. It is connected internally to the
ISL8118