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83905AK-01LF

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P20
83905-01 DATA SHEET
LOW SKEW, 1:6 CRYSTAL-TO-LVCMOS FANOUT BUFFER 16 REVISION 1 05/01/15
Reliability Information
Table 8A.
JA
vs. Air Flow Table for a 16-Lead TSSOP
Table 8B.
JA
vs. Air Flow Table for a 20-Lead VFQFN
Transistor Count
The transistor count for 83905-01: 505
JA
vs. Air Flow
Meters per Second 012.5
Multi-Layer PCB, JEDEC Standard Test Boards 100.3°C/W 96.0°C/W 93.9°C/W
JA
vs. Air Flow
Meters per Second 012.5
Multi-Layer PCB, JEDEC Standard Test Boards 57.5°C/W 50.3°C/W 45.1°C/W
REVISION 1 05/01/15 17 LOW SKEW, 1:6 CRYSTAL-TO-LVCMOS FANOUT BUFFER
83905-01 DATA SHEET
16-Lead TSSOP Package Outline and Package Dimensions
Package Outline - G Suffix for 16-Lead TSSOP
Table 9A. Package Dimensions for 16-Lead TSSOP
Reference Document: JEDEC Publication 95, MO-153
All Dimensions in Millimeters
Symbol Minimum Maximum
N 16
A 1.20
A1 0.05 0.15
A2 0.80 1.05
b 0.19 0.30
c 0.09 0.20
D 4.90 5.10
E 6.40 Basic
E1 4.30 4.50
e 0.65 Basic
L 0.45 0.75
0° 8°
aaa 0.10
83905-01 DATA SHEET
LOW SKEW, 1:6 CRYSTAL-TO-LVCMOS FANOUT BUFFER 18 REVISION 1 05/01/15
20-Lead VFQFN Package Outline and Package Dimensions
Package Outline - K Suffix for 20-Lead VFQFN
Reference Document: JEDEC Publication 95, MO-220
NOTE:
The drawing and dimension data originate from IDT package
outline drawing PSC-4170, rev03.
1. Dimensions and tolerances conform to ASME Y14.5M-1994
2. All dimensions are in millimeters. All angles are in degrees.
3. N is the total number of terminals.
4. All specifications comply with JEDEC MO-220.
Table 9C. Package Dimensions for 20-Lead VFQFN
All Dimensions in Millimeters
Symbol Minimum Nom Maximum
b 0.20 0.25 0.30
D 3.90 4.00 4.10
E 3.90 4.00 4.10
D2 1.95 2.10 2.25
E2 1.95 2.10 2.25
L 0.45 0.55 0.65
e 0.50 BSC
N 20
A 0.80 0.90 1.00
A1 0.00 0.02 0.05
A3 0.2 REF
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P20

83905AK-01LF

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IC CLOCK BUFFER 20-VFQFPN
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