KMA199 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 7 December 2011 31 of 36
NXP Semiconductors
KMA199
Programmable angle sensor
18. Marking
19. Terminals
Lead frame material: CuZr with 99.9 % Cu and 0.1 % Zr
Lead finish: matt tin; thickness 7 m to 11 m
Marking paint: laser
Code: see drawing
Type face: DIN 1451 condensed type
Letter height: 0.8 mm
Line spacing: 0.25 mm
Crossing of lines not allowed
A: leading letters of type number (5 characters max.)
B: number and attached letters of type number (6 characters max.)
C: day code/date code
All lines A to C to be marked in centered position
Date code: x yyy z
x: product manufacturing code; m for manufacturing Manila
Day code: x yyy z
x: ---
y: day of year
z: year of production (last figure)
Fig 19. Marking
001aag745
batch
number
2.1 min
X
NNNNN
YC
B
A
YYZ
KMA199 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 7 December 2011 32 of 36
NXP Semiconductors
KMA199
Programmable angle sensor
20. Package outline
Fig 20. Package outline SOT880
SOT880Plastic single-ended multi-chip package; 6 interconnections; 3 in-line leads
UNIT
b
c
L
2
min
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
1.65
1.45
0.41
0.34
b
1
1.57
1.47
8.1
7.9
4.1
3.9
0.30
0.24
4.75
L
1
L
7.1
6.9
0.85
0.75
w
v
DD
1
5.45
5.25
E
2.54
21.4
21.0
H
E
6.42
6.32
5.85 1.20.4
H
E1
H
E2
max
eQ
1
0.65
0.55
DIMENSIONS (mm are the original dimensions)
SOT880
07-09-03
07-09-11
A
0 2.5 5 mm
scale
view A-B
Note
1. Terminals within this zone are uncontrolled to allow for flow of plastic between and besides the leads.
H
E
c
Q
1
Q
1
A
A
A
wA
e
B
E
(1)
(1)
(1)
H
E1
H
E2
L
1
L
b
1
D
D
1
L
2
b
123
BA
vB
KMA199 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 7 December 2011 33 of 36
NXP Semiconductors
KMA199
Programmable angle sensor
21. Handling information
22. Solderability information
The solderability qualification is done according to AEC-Q100, Rev-F. Recommended
soldering process for leaded devices is wave soldering. The maximum soldering
temperature is 260 C for maximum 5 s. Device terminals shall be compatible with laser
and electrical welding.
23. Revision history
Dimensions in mm
(1) No bending allowed.
(2) Plastic body and interface plastic body - leads: application of bending forces not allowed.
Fig 21. Bending recommendation
006aaa246
R 0.25 min
R 0.25 min
0.7
(1)
0.7
(1)
0.7
(1)
(2)
(2)
Table 26. Revision history
Document ID Release date Data sheet status Change notice Supersedes
KMA199 v.2 20111207 Product data sheet PCN 201106032F01 KMA199 v.1
Modifications:
Section 19 “Terminals: Lead finish dimensions changed
KMA199 v.1 20100426 Product data sheet - -

KMA199,115

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
Magnetic Sensors Board Mount Hall Effect / Magnetic Sensors Programble Angle Sensor 5V 5mA-10mA
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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