KMA199 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 7 December 2011 33 of 36
NXP Semiconductors
KMA199
Programmable angle sensor
21. Handling information
22. Solderability information
The solderability qualification is done according to AEC-Q100, Rev-F. Recommended
soldering process for leaded devices is wave soldering. The maximum soldering
temperature is 260 C for maximum 5 s. Device terminals shall be compatible with laser
and electrical welding.
23. Revision history
Dimensions in mm
(1) No bending allowed.
(2) Plastic body and interface plastic body - leads: application of bending forces not allowed.
Fig 21. Bending recommendation
006aaa246
R 0.25 min
R 0.25 min
0.7
(1)
0.7
(1)
0.7
(1)
(2)
(2)
Table 26. Revision history
Document ID Release date Data sheet status Change notice Supersedes
KMA199 v.2 20111207 Product data sheet PCN 201106032F01 KMA199 v.1
Modifications:
• Section 19 “Terminals”: Lead finish dimensions changed
KMA199 v.1 20100426 Product data sheet - -