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MT66R7072A10ACUXZW.ZCA

P1-P3P4-P6P7-P9P10-P12
Product Brief
LPDDR2-PCM and Mobile LPDDR2
121-Ball MCP
MT66R7072A10AB5ZZW.ZCA, MT66R7072A10ACUXZW.ZCA
MT66R5072A10ACUXZW.ZFA
Features
• Micron
®
LPDDR2-PCM and LPDDR2 components
• RoHS-compliant, “green” package
• Shared LPDDR2-PCM and LPDDR2 interfaces
• Space-saving multichip package
• Ultra low-voltage core and I/O power supplies
– V
DD1
= 1.7–1.95V
– V
DDCA
/V
DDQ
= 1.14–1.3V
– V
DD2
= 1.14–1.3V
• Wireless temperature range: –25°C to +85°C
LPDDR2-PCM Specific Features
• Memory interface
– 16-bit data bus width
– Two data transfers per clock cycle
– Clock frequency up to 400 MHz
– Active to read/write delay:
t
RCD = 86ns
– Configurable output drive strength
• Memory architecture
– 4-row data buffers (RDB)
– Row data buffer size: 32B
– 4-row address buffers (RAB)
– Emulated block size: 128KB
• Program/erase performance
– Legacy programming mode up to 10MB/s (TYP)
– Overwrite up to 3 MB/s (TYP)
– Legacy block erase time: 60ms (TYP)
• Dual operations
– PROGRAM/ERASE in one partition while READ
in other partitions
– No delay between READ and WRITE operations
• Locking scheme
– All blocks locked at power-up
– 8Mb lock region
– Any combination of regions can be locked
– Absolute write protection with
V
ACC
= V
SS
• Quality and reliability
– Minimum 100k WRITE cycles/row
Figure 1: MCP Block Diagram
LPDDR2-PCM
Device
LPDDR2-PCM
Power
Interface
LPDDR2 Power
LPDDR2
LPDDR2
Device
Mobile LPDDR2-Specific Features
• Programmable read and write latencies
• Programmable burst lengths: 4, 8, or 16
• Partial-array self refresh (PASR)
• Deep power-down (DPD) mode
• Selectable output drive strength
• Adjustable clock frequency and clock stop capabili-
ties
Note: This product brief does not provide detailed de-
vice information. For the complete data sheet, which
covers device functionality, operating modes, and
specifications, or for further information on any as-
pect of the product, contact the Micron sales office.
Part Number:The MT66R5072A10ACUXZW.ZFA is
available as an engineering sample only.
Product Brief – 121-Ball LPDDR2-PCM and LPDDR2 MCP
Features
PDF: 09005aef84e25954
121ball_pcm_lpddr2_product_brief.pdf – Rev. B 12/12 EN
1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
Part Numbering Information
Micron LPDDR2-PCM and LPDDR2 devices are available in different configurations and densities. The MCP/PoP
part numbering guide is available at www.micron.com/numbering.
Figure 2: Part Number Chart
MT 66R 707 2 A 1 0 A CUX* Z W . ZCA - ES
Micron Technology
Product Family
66R = LPDDR2-PCM I/F + LPDDR2
Density
Voltage Range (Core_ I/0)
Die Count
PCM Configuration
Production Status
Blank = Production
ES = Engineering samples
MS = Mechanical samples
Die Revision
Contact factory
Operating Temperature Range
W = –25°C to +85°C (Wireless)
I = –40°C to +85°C (Industrial)
Special Options
Contact factory
Package Codes
B5Z = 121-ball WFBGA, 11mmx10mmx0.8mm
CUX = 121-ball WFBGA, 8mmx8mmx0.8mm
*X = a null character used as a placeholder
LPDDR2 Description
0 = N/A
A = X16DDR2_S4 2KB Page
B = X16DDR2_S2 2KB Page
NAND Description
0 = N/A
PCM xNAND xLPDDR2
0 N/A
1 32Mb = 4MB 16Mb = 2MB
2 64Mb = 8MB 32Mb = 4MB
3 128Mb = 16MB 64Mb = 8MB
4 256Mb = 32MB 128Mb = 16MB
5 512Mb = 64MB 256Mb = 32MB
6 768Mb = 96MB 384Mb = 48MB
7 1Gb = 128MB 512Mb = 64MB
PCM LPDDR2
1
1.8_1.8 1.8_1.8
2
1.8_1.2 1.8_1.2
PCM LPDDR2
A
1 1
B
1 2
Bus Width Frequency
1 x16 166 MHz
2 x16 266 MHz
3 x16 333 MHz
4 x16 400 MHz
Note:
1. The MT66R5072A10ACUXZW.ZFA is available as an engineering sample only. This MCP will be packaged as
512Mb LPDDR-PCM and 512Mb LPDDR2, 121-ball, 8mm x 8mm x 0.8mm.
Device Marking
Due to the size of the package, the Micron-standard part number is not printed on the top of the device. Instead,
an abbreviated device mark consisting of a 5-digit alphanumeric code is used. The abbreviated device marks are
cross-referenced to the Micron part numbers at the FBGA Part Marking Decoder site: www.micron.com/decoder.
To view the location of the abbreviated mark on the device, refer to customer service note CSN-11, “Product Mark/
Label,” at www.micron.com/csn.
Product Brief – 121-Ball LPDDR2-PCM and LPDDR2 MCP
Features
PDF: 09005aef84e25954
121ball_pcm_lpddr2_product_brief.pdf – Rev. B 12/12 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
MCP General Description
Micron MCP products combine LPDDR2-PCM and Mobile LPDDR2 devices in a single
MCP. These products target mobile applications with low-power, high-performance,
and minimal package-footprint design requirements. The LPDDR2-PCM and Mobile
LPDDR2 devices are also members of the Micron discrete memory products portfolio.
The bus architecture of this device also supports separate LPDDR2-PCM and Mobile
LPDDR2 functionality without concern for device interaction.
Device Diagrams
Figure 3: 121-Ball (LPDDR2-PCM and LPDDR2) Functional Block Diagram
V
DD1
V
DDQ
V
DDCA
V
SS
V
SSQ
V
SSCA
V
REFDQ
V
REFCA
V
DD2
D-CS#
D-CKE
CK/CK#
DQS[1:0]
DQS#[1:0]
DQ[15:0]
DM[1:0]
CA[9:0]
ZQ
LPDDR2
NV-CS#
NV-CKE
LPDDR2–PCM
Product Brief – 121-Ball LPDDR2-PCM and LPDDR2 MCP
MCP General Description
PDF: 09005aef84e25954
121ball_pcm_lpddr2_product_brief.pdf – Rev. B 12/12 EN
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
P1-P3P4-P6P7-P9P10-P12

MT66R7072A10ACUXZW.ZCA

Mfr. #:
Buy MT66R7072A10ACUXZW.ZCA
Manufacturer:
Micron
Description:
IC RAM 1G PARALLEL 121VFBGA
Lifecycle:
New from this manufacturer.
Delivery:
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