SI3424BDV-T1-GE3

Vishay Siliconix
Si3424BDV
Document Number: 74623
S13-0631-Rev. E, 25-Mar-13
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
For technical questions, contact: pmostechsupport@vishay.com
N-Channel 30 V (D-S) MOSFET
FEATURES
TrenchFET
®
Power MOSFET
100 % R
g
Tested
Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
Load Switch for Portable Devices
Notes:
a. Package limited.
b. Based on T
C
= 25 °C.
c. Surface mounted on 1" x 1" FR4 board.
d. t = 5 s.
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
()I
D
(A) Q
g
(Typ.)
30
0.028 at V
GS
= 10 V
8
a
6.2
0.038 at V
GS
= 4.5 V
7
ABSOLUTE MAXIMUM RATINGS (T
A
= 25 °C, unless otherwise noted)
Parameter Symbol Limit Unit
Drain-Source Voltage
V
DS
30
V
Gate-Source Voltage
V
GS
± 20
Continuous Drain Current (T
J
= 150 °C)
a
T
C
= 25 °C
I
D
8
a, b
A
T
C
= 70 °C
6.7
T
A
= 25 °C
7
c, d
T
A
= 70 °C
5.6
c, d
Pulsed Drain Current
I
DM
30
Continuous Source-Drain Diode Current
T
C
= 25 °C
I
S
2.48
A
T
A
= 25 °C
1.74
c, d
Maximum Power Dissipation
a
T
C
= 25 °C
P
D
2.98
W
T
C
= 70 °C
1.9
T
A
= 25 °C
2.1
c, d
T
A
= 70 °C
1.3
c, d
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 150 °C
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
c
t 5 s
R
thJA
50 60
°C/WSteady State
R
thJA
90 110
Maximum Junction-to-Foot (Drain) Steady State
R
thJF
35 42
Marking Code
AG XX
Lot Tracea b ility
and Date Code
Part # Code
Y
Y
TSOP-6
Top View
6
4
1
2
3
5
3 mm
2.85 mm
D
D
D
D
S
G
N-Channel MOSFET
G
D
S
(1, 2, 5, 6)
(3)
(4)
Ordering Information: Si3424BDV-T1-GE3 (Lead (Pb)-free and Halogen-free)
Vishay Siliconix
Si3424BDV
www.vishay.com
2
Document Number: 74623
S13-0631-Rev. E, 25-Mar-13
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
For technical questions, contact: pmostechsupport@vishay.com
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS (T
J
= 25 °C, unless otherwise noted)
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage
V
DS
V
GS
= 0 V, I
D
= 250 µA
30 V
V
DS
Temperature Coefficient V
DS
/T
J
I
D
= 250 µA
23.75
mV/°C
V
GS(th)
Temperature Coefficient V
GS(th)
/T
J
5.8
Gate-Source Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= 250 µA
13V
Gate-Source Leakage
I
GSS
V
DS
= 0 V, V
GS
= ± 20 V
± 100 nA
Zero Gate Voltage Drain Current
I
DSS
V
DS
= 30 V, V
GS
= 0 V
1
µA
V
DS
= 30 V, V
GS
= 0 V, T
J
= 85 °C
10
On-State Drain Current
a
I
D(on)
V
DS
= 5 V, V
GS
= 10 V 30 A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= 10 V, I
D
= 7 A
0.0230 0.0280
V
GS
= 4.5 V, I
D
= 5.8 A
0.0315 0.0380
Forward Transconductance
g
fs
V
DS
= 15 V, I
D
= 7 A
17 S
Dynamic
b
Input Capacitance
C
iss
V
DS
= 15 V, V
GS
= 0 V, f = 1 MHz
735
pFOutput Capacitance
C
oss
130
Reverse Transfer Capacitance
C
rss
34
Total Gate Charge
Q
g
V
DS
= 15 V, V
GS
= 10 V, I
D
= 7 A
13.05 19.6
nC
V
DS
= 24 V, V
GS
= 4.5 V, I
D
= 7 A
6.2 9.3
Gate-Source Charge
Q
gs
2.16
Gate-Drain Charge
Q
gd
2.15
Gate Resistance
R
g
f = 1 MHz 2.45 3.7
Tur n - O n D e l ay Time
t
d(on)
V
DD
= 15 V, R
L
= 2.7
I
D
5.6 A, V
GEN
= 10 V, R
g
= 1
4.5 6.8
ns
Rise Time
t
r
10 15
Turn-Off DelayTime
t
d(off)
16 24
Fall Time
t
f
710.5
Tur n - O n D e l ay Time
t
d(on)
V
DD
= 15 V, R
L
= 3.2
I
D
4.7 A, V
GEN
= 4.5 V, R
g
= 1
18 27
Rise Time
t
r
85 128
Turn-Off DelayTime
t
d(off)
17 26
Fall Time
t
f
12 18
Drain-Source Body Diode Characteristics
Continous Source-Drain Diode Current
I
S
T
C
= 25 °C
2.48
A
Pulse Diode Forward Current
a
I
SM
30
Body Diode Voltage
V
SD
I
S
= 3 A
0.8 1.2 V
Body Diode Reverse Recovery Time
t
rr
I
F
= 3.2 A, dI/dt = 100 A/µs
13.8 20.7 nC
Body Diode Reverse Recovery Charge
Q
rr
6.21 9.32
nsReverse Recovery Fall Time
t
a
8.5
Reverse Recovery Rise Time
t
b
5.3
Vishay Siliconix
Si3424BDV
Document Number: 74623
S13-0631-Rev. E, 25-Mar-13
www.vishay.com
3
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
For technical questions, contact: pmostechsupport@vishay.com
TYPICAL CHARACTERISTICS (T
A
= 25 °C, unless otherwise noted)
Output Characteristics
On-Resistance vs. Drain Current
Q
g
- Gate Charge
0
012345
6
12
18
24
30
V
GS
= 3 V
V
GS
= 4 V
V
GS
= 10 V thru 4.5 V
V
DS
- Drain-to-Source Voltage (V)
I
D
- Drain Current (A)
0
0.01
0.02
0.03
0.04
0.05
0.06
V
GS
= 10 V
V
GS
= 4.5 V
R
DS(on)
- D to S On-Resistance (Ω)
I
D
- Drain Current (A)
0 8 16 24 32 40
0
2
4
6
8
10
03691215
V
GS
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
I
D
= 7 A
V
DS
= 15 V
V
DS
= 24 V
Transfer Characteristics curves vs. Temp
Capacitance
On-Resistance vs. Junction Temperature
0
1
2
3
4
5
T
J
= 125 °C
T
J
= 25 °C
T
J
= - 55 °C
V
GS
- Gate-to-Source Voltage (V)
I
D
- Drain Current (A)
01234
0
200
400
600
800
1000
C
iss
C
oss
C
rss
V
DS
- Drain-to-Source Voltage (V)
C - Capacitance (pF)
0 6 12 18 24 30
0.6
0.8
1.0
1.2
1.4
1.6
1.8
R
DS(on)
- On-Resistance
(Normalized)
T
J
- Junction Temperature (°C)
- 50 - 25 0 25 50 75 100 125 150
V
GS
= 10 V, I
D
= 7 A
V
GS
= 4.5 V, I
D
= 5.8 A

SI3424BDV-T1-GE3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET 30V 8.0A 2.98W 28mohm @ 10V
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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