LTC4211
22
4211fc
For more information www.linear.com/LTC4211
OPERATION
SENSE RESISTOR CONSIDERATIONS
The fault current level at which the LTC4211’s internal
electronic circuit breaker trips is determined by a sense
resistor connected between the LTC4211s V
CC
and SENSE
pins and two separate trip points. The first trip point is
set by the SLOW COMPs threshold, V
CB(SLOW)
= 50mV,
and occurs should a load current fault condition exist for
more than 20µs. The current level at which the electronic
circuit breaker trips is given by Equation 8:
I
TRIP(SLOW)
=
V
CB(SLOW)
R
SENSE
=
50mV
R
SENSE
(8)
The second trip point is set by the FAST COMPs threshold,
V
CB(FAST)
= 150mV, and occurs during fast load current
transients that exist for 300ns or longer. The current level
at which the circuit breaker trips in this case is given by
Equation 9:
I
TRIP(FAST)
=
V
CB(FAST)
R
SENSE
=
150mV
R
SENSE
(9)
As a design aid, the currents at which the electronic circuit
breaker trips for common values for R
SENSE
are shown
in Table 3.
Figure 11. Making PCB Connections to the Sense Resistor
Table 2. t
SLOWCOMP
vs C
FILTER
C
FILTER
t
SLOWCOMP
100pF 82µs
220pF 156µs
330pF 224µs
470pF 310µs
680pF 440µs
820pF 527µs
1000pF 638µs
Table 3. I
TRIP(SLOW)
and I
TRIP(FAST)
vs R
SENSE
R
SENSE
I
TRIP(SLOW)
I
TRIP(FAST)
0.005Ω 10A 30A
0.006Ω 8.3A 25A
0.007Ω 7.1A 21A
0.008Ω 6.3A 19A
0.009Ω 5.6A 17A
0.01Ω 5A 15A
For proper circuit breaker operation, Kelvin-sense PCB
connections between the sense resistor and the LTC4211’s
V
CC
and SENSE pins are strongly recommended. The
drawing in Figure 11 illustrates the correct way of making
connections between the LTC4211 and the sense resis
-
tor. PCB layout should be balanced and symmetrical to
minimize wiring errors. In addition, the PCB layout for the
sense resistor should include good thermal management
techniques for optimal sense resistor power dissipation.
The power rating of the sense resistor should accommodate
steady-state fault current levels so that the component is
not damaged before the circuit breaker trips. Table4 in
the Appendix lists sense resistors that can be used with
the LTC4211’s circuit breaker.
IRC-TT SENSE RESISTOR
LR251201R010F
OR EQUIVALENT
0.01, 1%, 1W
CURRENT FLOW
TO LOAD
CURRENT FLOW
TO LOAD
TO
V
CC
TO
SENSE
TRACK WIDTH W:
0.03" PER AMP
ON 1 OZ COPPER
W
4211 F11
CALCULATING CIRCUIT BREAKER TRIP CURRENT
For a selected R
SENSE
value, the nominal load current that
trips the circuit breaker is given by Equation 10:
I
TRIP(NOM)
=
V
CB(NOM)
R
SENSE(NOM)
=
50mV
R
SENSE(NOM)
(10)
The minimum load current that trips the circuit breaker is
given by Equation 11.
I
TRIP(MIN)
=
V
CB(MIN)
R
SENSE(MAX)
=
40mV
R
SENSE(MAX)
(11)
where
R
SENSE(MAX)
= R
SENSE(NOM)
1+
R
TOL
100
LTC4211
23
4211fc
For more information www.linear.com/LTC4211
OPERATION
The maximum load current that trips the circuit breaker
is given in Equation 12.
I
TRIP(MAX)
=
V
CB(MAX)
R
SENSE(MIN)
=
60mV
R
SENSE(MIN)
(12)
where
R
SENSE(MIN)
=R
SENSE(NOM)
1
R
TOL
100
For example:
If a sense resistor with 7mΩ ±5% R
TOL
is used for current
limiting, the nominal trip current I
TRIP(NOM)
= 7.1A. From
Equations 11 and 12, I
TRIP(MIN)
= 5.4A and I
TRIP(MAX)
=
9.02A respectively.
For proper operation and to avoid the circuit breaker trip
-
ping unnecessarily, the minimum trip current (I
TRIP(MIN)
)
must exceed the circuits maximum operating load current.
For reliability purposes, the operation at the maximum
trip current (I
TRIP(MAX)
) must be evaluated carefully. If
necessary, two resistors with the same R
TOL
can be con-
nected in parallel to yield an R
SENSE(NOM)
value that fits
the circuit requirements.
POWER MOSFET SELECTION CRITERIA
To start the power MOSFET selection process, choose the
maximum drain-to-source voltage, V
DS(MAX)
, and the maxi-
mum drain current, I
D(MAX)
of the MOSFET. The V
DS(MAX)
rating must exceed the maximum input supply voltage
(including surges, spikes, ringing, etc.) and the I
D(MAX)
rating must exceed the maximum short-circuit current in
the system during a fault condition. In addition, consider
three other key parameters: 1) the required gate-source
(V
GS
) voltage drive, 2) the voltage drop across the drain-
to-source on resistance, R
DS(ON)
and 3) the maximum
junction temperature rating of the MOSFET.
Power MOSFETs are classified into three categories:
standard MOSFETs (R
DS(ON)
specified at V
GS
= 10V)
logic-level MOSFETs (R
DS(ON)
specified at V
GS
= 5V), and
sub-logic-level MOSFETs (R
DS(ON)
specified at V
GS
= 2.5V).
The absolute maximum rating for V
GS
is typically ±20V for
standard MOSFETs. However, the V
GS
maximum rating for
logic-level MOSFETs ranges from ±8V to ±20V depend-
ing upon the manufacturer and the specific part number.
The LT
C4211’
s GATE overdrive as a function of V
CC
is
illustrated in the Typical Performance curves. Logic-level
and sub-logic-level MOSFETs are recommended for low
supply voltage applications and standard MOSFETs can
be used for applications where supply voltage is greater
than 4.75V.
Note that in some applications, the gate of the external
MOSFET can discharge faster than the output voltage
when the circuit breaker is tripped. This causes a negative
V
GS
voltage on the external MOSFET. Usually, the selected
external MOSFET should have a ±V
GS(MAX)
rating that is
higher than the operating input supply voltage to ensure
that the external MOSFET is not destroyed by a nega
-
tive V
GS
voltage. In addition, the ±V
GS(MAX)
rating of the
MOSFET must be higher than the gate overdrive voltage.
Lower ±V
GS(MAX)
rating MOSFETs can be used with the
LTC4211 if the GATE overdrive is clamped to a lower volt-
age. The circuit in Figure 12 illustrates the use of Zener
diodes to clamp the
LTC4211’
s GATE overdrive signal if
lower voltage MOSFETs are used.
Figure 12. Optional Gate Clamp for Lower V
GS(MAX)
MOSFETs
V
CC
V
OUT
*USER SELECTED VOLTAGE CLAMP
(A LOW BIAS CURRENT ZENER DIODE IS RECOMMENDED)
1N4688 (5V)
1N4692 (7V): LOGIC-LEVEL MOSFET
1N4695 (9V)
1N4702 (15V): STANDARD-LEVEL MOSFET
4211 F12
R
SENSE
GATE
D2*
D1*
Q1
R
G
200Ω
The R
DS(ON)
of the external pass transistor should be low
to make its drain-source voltage (V
DS
) a small percentage
of V
CC
. At a V
CC
= 2.5V, V
DS
+ V
RSENSE
= 0.1V yields 4%
error at the output voltage. This restricts the choice of
MOSFETs to very low R
DS(ON)
. At higher V
CC
voltages, the
V
DS
requirement can be relaxed in which case MOSFET
package dissipation (P
D
and T
J
) may limit the value of
LTC4211
24
4211fc
For more information www.linear.com/LTC4211
OPERATION
R
DS(ON)
. Table 5 lists some power MOSFETs that can be
used with the LTC4211.
For reliable circuit operation, the maximum junction
temperature (T
J(MAX)
) for a power MOSFET should not
exceed the manufacturers recommended value. This
includes normal mode operation, start-up, current-limit
and autoretry mode in a fault condition. Under normal
conditions the junction temperature of a power MOSFET
is given by Equation 13:
MOSFET Junction Temperature,
T
J(MAX)
≤ T
A(MAX)
+ θ
JA
• P
D
(13)
where
P
D
= (I
LOAD
)
2
• R
DS(ON)
θ
JA
= junction-to-ambient thermal resistance
T
A(MAX)
= maximum ambient temperature
If a short circuit happens during start-up, the external
MOSFET can experience a big single pulse energy. This
is especially true if the applications only employ a small
gate capacitor or no gate capacitor at all. Consult the safe
operating area (SOA) curve of the selected MOSFET to
ensure that the T
J(MAX)
is not exceeded during start-up.
USING STAGGERED PIN CONNECTORS
The LTC4211 can be used on either a printed circuit board
or on the backplane side of the connector, and examples
for both are shown in Figures 13 and 14. Printed circuit
board edge connectors with staggered pins are recom
-
mended as the insertion and removal of circuit boards do
sequence the pin connections. Supply voltage and ground
connections on the printed circuit board should be wired
to the edge connector’s long pins or blades. Control and
status signals (like RESET, FAULT and ON) passing through
the cards edge connector should be wired to short length
pins or blades.
PCB CONNECTION SENSE
There are a number of ways to use the LTC4211’s ON pin
to detect whether the printed circuit board has been fully
seated in the backplane before the LTC4211 commences
a start-up cycle.
The first example is shown in the schematic on the front
page of this data sheet. In this case, the LTC4211 is
mounted on the PCB and a 20k/10k resistive divider is
connected to the ON pin. On the edge connector, R1 is
wired to a short pin. Until the connectors are fully mated,
the ON pin is held low, keeping the LTC4211 in an OFF
state. Once the connectors are mated, the resistive divider
is con
nected to V
CC
, V
ON
> 1.316V and the LTC4211 begins
a start-up cycle.
In Figure 13, an LTC4211 is illustrated in a basic configura
-
tion on a PCB daughter card. The ON pin is connected to
V
CC
on the backplane through a 10k pull-up resistor once
the card is seated into the backplane. R2 bleeds off any
potential static charge which might exist on the backplane,
the connector or during card installation.
A third example is shown in Figure 14 where the LTC4211
is mounted on the backplane. In this example, a 2N2222
transistor and a pair of resistors (R4, R5) form the PCB
connection sense circuit. With the card out of the chassis,
Q2’s base is biased to V
CC
through R5, biasing Q2 ON
and driving the LTC4211’s ON pin low. The base of Q2 is
also wired to a socket on the backplane connector. When
a card is firmly seated into the backplane, the base of Q2
is then grounded through a short pin connection on the
card. Q2 is biased OFF, the LTC4211’s ON pin is pulled-up
to V
CC
and a start-up cycle begins.
In the previous three examples, the connection sense was
hard wired with no processor (low) interrupt capability.
As illustrated in Figure 15, the addition of an inexpensive
logic-level discrete MOSFET and a couple of resistors offers
processor interrupt control to the connection sense. R4
keeps the gate of M2 at V
CC
until the card is firmly mated
to the backplane. A logic low for the ON/OFF signal turns
M2 OFF, allows the ON pin to pull high and turns on the
LTC4211.

LTC4211CMS#PBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Hot Swap Voltage Controllers Hot Swap Controller w/Active Limit
Lifecycle:
New from this manufacturer.
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