Sensors
10 NXP Semiconductors
MMA16xx
2.8 Dynamic Electrical Characteristics - Signal Chain
V
L
(V
CC
- V
SS
) V
H
, T
L
T
A
T
H
, ΔT 25 K/min, unless otherwise specified
Notes:
1. Parameters tested 100% at final test at -40°C, 25°C, and 105°C.
2. Parameters tested 100% at probe.
3. Verified by characterization.
4. * Indicates critical characteristic.
5. Verified by qualification testing, not tested in production.
6. Parameters verified by pass/fail testing in production.
7. Functionality guaranteed by modeling, simulation and/or design verification. Circuit integrity assured through IDDQ and scan testing. Timing
is determined by internal system clock frequency.
8. Verified by user system level characterization, not tested in production, or at component level.
9. Verified by Simulation.
10.Measured at final test. Self-Test activation occurs under control of the test program.
11.Thermal resistance between the die junction and the exposed pad; cold plate is attached to the exposed pad.
12.Maximum voltage characterized. Minimum voltage tested 100% at final test. Maximum voltage tested 100% to 24V at final test.
13.N/A.
14.Sensitivity, and overload capability specifications will be reduced when 800 Hz filter is selected.
15.Filter cutoff frequencies are directly dependent upon the internal oscillator frequency.
16.Target values. Actual values to be determined during device characterization.
# Characteristic Symbol Min Typ Max Units
120 Internal Oscillator Frequency * f
OSC
3.80 4 4.20 MHz (1)
121 Data Interpolation Latency t
LAT_INTERP
64 / f
OSC
65 / f
OSC
s(7)
122
123
124
125
126
127
DSP Low-Pass Filter
Cutoff frequency LPF0 (referenced to 0 Hz)
Filter Order LPF0
Cutoff frequency LPF1 (referenced to 0 Hz)
Filter Order LPF1
Cutoff frequency LPF2 (referenced to 0 Hz)
Filter Order LPF2
f
C_LPF0
O
LPF0
f
C_LPF1
O
LPF1
f
C_LPF2
O
LPF2
171
380
760
180
2
400
4
800
4
189
420
840
Hz
1
Hz
1
Hz
1
(7)
(7)
(7)
(7)
(7)
(7)
128
129
Sensing Element Rolloff Frequency (-3 db)
±50g, ±62.5g, ±125g
±187g, ±312g
f
gcell_3dB_zlo
f
gcell_3dB_zhi
798
1437
2211
2425
Hz
Hz
(9)
(9)
130
131
Sensing Element Natural Frequency
±50g, ±62.5g, ±125g
±187g, ±312g
f
gcell_zlo
f
gcell_zhi
7000
13600
8000
15100
Hz
Hz
(9)
(9)
132
133
Sensing Element Damping Ratio
±50g, ±62.5g, ±125g
±187g, ±312g
ζ
gcell_zlo
ζ
gcell_zhi
1.870
2.040
4.610
7.580
(9)
(9)
134
135
Sensing Element Delay (@100 Hz)
±50g, ±62.5g, ±125g
±187g, ±312g
f
gcell_delay100_zlo
f
gcell_delay100_zhi
77
47
200
160
μs
μs
(9)
(9)
136 Package Resonance Frequency f
Package
100 ⎯⎯kHz (9)
Sensors
NXP Semiconductors 11
MMA16xx
Figure 6. V
HCAP
Under-Voltage Detection
Figure 7. V
REG
Under-Voltage Detection
Figure 8. V
REGA
Under-Voltage Detection
V
PORHCAP_r
V
HCAP
V
PORHCAP_f
V
HYST_HCAP
t
HCAP_POR
UV
UV: UNDER-VOLTAGE CONDITION
EXISTS
UV
POR
V
PORVREG_r
V
REG
V
PORVREG_f
V
HYST_VREG
POR
t
VREG_POR
V
PORVREGA_r
V
REGA
V
PORVREGA_f
V
HYST_VREGA
POR
t
VREGA_POR
Sensors
12 NXP Semiconductors
MMA16xx
Figure 9. DSI Bus Inter-frame Timing
t
IFS_slave
t
IFS_master
LOGIC ‘1’ LOGIC ‘0’
t
START_master
t
START_slave
BUSIN’
I
RESPONSE
1mA
9mA
t
RSP_R
t
ITR
t
ITR
t
RSP_F
V
THS
V
THF
DSP_OUT
t
LAT_DSI
t
LAT_INTERP
EOF
slave

MMA1618KGCWR2

Mfr. #:
Manufacturer:
NXP / Freescale
Description:
Accelerometers DSI2.5 Accelerometer, QFN 16
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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